From mboxrd@z Thu Jan 1 00:00:00 1970 From: Giuseppe CAVALLARO Subject: Re: [PATCH net-next 00/11] convert stmmac glue layers into platform drivers Date: Fri, 15 May 2015 11:11:14 +0200 Message-ID: <5555B832.3080708@st.com> References: <1431598266-25736-1-git-send-email-manabian@gmail.com> <5555A42B.3040205@st.com> <5463867.jjPLKQomlR@wuerfel> Mime-Version: 1.0 Content-Type: text/plain; charset="us-ascii"; Format="flowed" Content-Transfer-Encoding: 7bit Cc: netdev , Joachim Eastwood , b.galvani-Re5JQEeQqe8AvxtiuMwx3w@public.gmane.org, linux-rockchip-IAPFreCvJWM7uuMidbF8XUB+6BGkLq7r@public.gmane.org, Chen-Yu Tsai , Roger , dinguyen-yzvPICuk2ABMcg4IHK0kFoH6Mc4MB0Vx@public.gmane.org, David Miller , linux-arm-kernel To: Arnd Bergmann Return-path: In-Reply-To: <5463867.jjPLKQomlR@wuerfel> List-Unsubscribe: , List-Archive: List-Post: List-Help: List-Subscribe: , Sender: "Linux-rockchip" Errors-To: linux-rockchip-bounces+glpar-linux-rockchip=m.gmane.org-IAPFreCvJWM7uuMidbF8XUB+6BGkLq7r@public.gmane.org List-Id: netdev.vger.kernel.org Hi Arnd On 5/15/2015 10:44 AM, Arnd Bergmann wrote: > On Friday 15 May 2015 09:45:47 Giuseppe CAVALLARO wrote: >> Hello >> >> On 5/14/2015 5:24 PM, Chen-Yu Tsai wrote: >>> On Thu, May 14, 2015 at 6:10 PM, Joachim Eastwood wrote: >>>> This patch set aims to convert the current dwmac glue layers into >>>> proper platform drivers as request by Arnd[1]. These changes start >>>> from patch 3 and onwards. >>>> >>>> Overview: >>>> Platform driver functions like probe and remove are exported from >>>> the stmmac platform and then used in subsequent glue later >>>> conversions. The conversion involes adding the platform driver >>>> boiler plate code and adding it to the build system. The last patch >>>> removes the driver from the stmmac platform code thus making it into >>>> a library for common platform driver functions. >>>> >>>> The two first patches adds glue layer for my platform. I chose to >>>> first add old style glue layer and then convert it. The churn this >>>> creates is just 3 lines. >>>> >>>> I would be very nice if people could test this patch set on their >>>> respective platform. My testing has been limited to compiling and >>>> testing on my (LPC18xx) platform. Thanks! >> >> I wonder if this will make the compatibility with old >> platforms (like SH4) not based on DT, where there was not used >> any glue-logic around the driver and just the platform was the >> reference. > > With patch 11, this gets handled by the dwmac-generic driver. ok > >> To be honest, I prefer to not have the Kconfig options. >> The device-tree compatibility will select the glue-logic >> needed and we will just pay some bytes when compile. >> >> In my opinion, the Koption(s) introduce a problem when touch >> the driver and we want to guarantee that, at least, >> all its parts build fine on all the platforms. > > The current model is not scalable and requires modifying the base > driver for each variation, and the change brings the driver > in line with how we do things for other platform drivers. > > We should always be able to build all soc-specific glue drivers > with 'allmodconfig' for build testing, and a lot of us run that > frequently to find regressions. thx for your prompt feedback Peppe > > Arnd > > From mboxrd@z Thu Jan 1 00:00:00 1970 From: peppe.cavallaro@st.com (Giuseppe CAVALLARO) Date: Fri, 15 May 2015 11:11:14 +0200 Subject: [PATCH net-next 00/11] convert stmmac glue layers into platform drivers In-Reply-To: <5463867.jjPLKQomlR@wuerfel> References: <1431598266-25736-1-git-send-email-manabian@gmail.com> <5555A42B.3040205@st.com> <5463867.jjPLKQomlR@wuerfel> Message-ID: <5555B832.3080708@st.com> To: linux-arm-kernel@lists.infradead.org List-Id: linux-arm-kernel.lists.infradead.org Hi Arnd On 5/15/2015 10:44 AM, Arnd Bergmann wrote: > On Friday 15 May 2015 09:45:47 Giuseppe CAVALLARO wrote: >> Hello >> >> On 5/14/2015 5:24 PM, Chen-Yu Tsai wrote: >>> On Thu, May 14, 2015 at 6:10 PM, Joachim Eastwood wrote: >>>> This patch set aims to convert the current dwmac glue layers into >>>> proper platform drivers as request by Arnd[1]. These changes start >>>> from patch 3 and onwards. >>>> >>>> Overview: >>>> Platform driver functions like probe and remove are exported from >>>> the stmmac platform and then used in subsequent glue later >>>> conversions. The conversion involes adding the platform driver >>>> boiler plate code and adding it to the build system. The last patch >>>> removes the driver from the stmmac platform code thus making it into >>>> a library for common platform driver functions. >>>> >>>> The two first patches adds glue layer for my platform. I chose to >>>> first add old style glue layer and then convert it. The churn this >>>> creates is just 3 lines. >>>> >>>> I would be very nice if people could test this patch set on their >>>> respective platform. My testing has been limited to compiling and >>>> testing on my (LPC18xx) platform. Thanks! >> >> I wonder if this will make the compatibility with old >> platforms (like SH4) not based on DT, where there was not used >> any glue-logic around the driver and just the platform was the >> reference. > > With patch 11, this gets handled by the dwmac-generic driver. ok > >> To be honest, I prefer to not have the Kconfig options. >> The device-tree compatibility will select the glue-logic >> needed and we will just pay some bytes when compile. >> >> In my opinion, the Koption(s) introduce a problem when touch >> the driver and we want to guarantee that, at least, >> all its parts build fine on all the platforms. > > The current model is not scalable and requires modifying the base > driver for each variation, and the change brings the driver > in line with how we do things for other platform drivers. > > We should always be able to build all soc-specific glue drivers > with 'allmodconfig' for build testing, and a lot of us run that > frequently to find regressions. thx for your prompt feedback Peppe > > Arnd > >