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From: Len Brown <lenb@kernel.org>
To: x86@kernel.org
Cc: linux-kernel@vger.kernel.org, Zhang Rui <rui.zhang@intel.com>,
	Len Brown <len.brown@intel.com>,
	linux-pm@vger.kernel.org
Subject: [PATCH 08/14] powercap/intel_rapl: Support multi-die/package
Date: Tue, 26 Feb 2019 01:20:06 -0500	[thread overview]
Message-ID: <680e11fe0dcc65e4cfa5bfeaa0d1cdbe7896e3c0.1551160674.git.len.brown@intel.com> (raw)
In-Reply-To: <e2810a5317d3a109a98204e883fd1461f77b9339.1551160674.git.len.brown@intel.com>

From: Zhang Rui <rui.zhang@intel.com>

On the new dual-die/package systems, the RAPL MSR becomes die-scope.
Thus instead of one powercap device per physical package, now there
should be one powercap device for each unique die on these systems.

This patch introduces intel_rapl driver support for new
dual-die/package systems.

On the hardwares that do not have multi-die, topology_logical_die_id()
equals topology_physical_package_id(), thus there is no functional change.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Cc: linux-pm@vger.kernel.org
---
 drivers/powercap/intel_rapl.c | 4 ++--
 1 file changed, 2 insertions(+), 2 deletions(-)

diff --git a/drivers/powercap/intel_rapl.c b/drivers/powercap/intel_rapl.c
index 6057d9695fed..8723e9ae7436 100644
--- a/drivers/powercap/intel_rapl.c
+++ b/drivers/powercap/intel_rapl.c
@@ -266,7 +266,7 @@ static struct rapl_domain *platform_rapl_domain; /* Platform (PSys) domain */
 /* caller to ensure CPU hotplug lock is held */
 static struct rapl_package *rapl_find_package(int cpu)
 {
-	int id = topology_physical_package_id(cpu);
+	int id = topology_logical_die_id(cpu);
 	struct rapl_package *rp;
 
 	list_for_each_entry(rp, &rapl_packages, plist) {
@@ -1457,7 +1457,7 @@ static void rapl_remove_package(struct rapl_package *rp)
 /* called from CPU hotplug notifier, hotplug lock held */
 static struct rapl_package *rapl_add_package(int cpu)
 {
-	int id = topology_physical_package_id(cpu);
+	int id = topology_logical_die_id(cpu);
 	struct rapl_package *rp;
 	int ret;
 
-- 
2.18.0-rc0


  parent reply	other threads:[~2019-02-26  6:21 UTC|newest]

Thread overview: 39+ messages / expand[flat|nested]  mbox.gz  Atom feed  top
2019-02-26  6:19 [PATCH 0/14] v2 multi-die/package topology support Len Brown
2019-02-26  6:19 ` [PATCH 01/14] x86 topology: Fix doc typo Len Brown
2019-02-26  6:20   ` [PATCH 02/14] topolgy: Simplify cputopology.txt formatting and wording Len Brown
2019-02-26  6:20   ` [PATCH 03/14] x86 smpboot: Rename match_die() to match_pkg() Len Brown
2019-02-26  6:20   ` [PATCH 04/14] x86 topology: Add CPUID.1F multi-die/package support Len Brown
2019-02-26 19:46     ` Dave Hansen
2019-02-28 15:43       ` Len Brown
2019-04-05 18:16         ` Thomas Gleixner
2019-02-26  6:20   ` [PATCH 05/14] cpu topology: Export die_id Len Brown
2019-03-07 14:45     ` Morten Rasmussen
2019-03-26 18:18       ` Len Brown
2019-02-26  6:20   ` [PATCH 06/14] x86 topology: Define topology_logical_die_id() Len Brown
2019-02-26  6:20   ` [PATCH 07/14] powercap/intel_rapl: Simplify rapl_find_package() Len Brown
2019-02-26 19:06     ` Peter Zijlstra
2019-03-26 18:27       ` Len Brown
2019-02-26  6:20   ` Len Brown [this message]
2019-04-05 18:27     ` [PATCH 08/14] powercap/intel_rapl: Support multi-die/package Thomas Gleixner
2019-04-08  1:35       ` Zhang Rui
2019-02-26  6:20   ` [PATCH 09/14] thermal/x86_pkg_temp_thermal: " Len Brown
2019-04-05 18:29     ` Thomas Gleixner
2019-04-05 18:39       ` Brown, Len
2019-04-05 18:50         ` Thomas Gleixner
2019-02-26  6:20   ` [PATCH 10/14] powercap/intel_rapl: update rapl domain name and debug messages Len Brown
2019-02-26  6:20   ` [PATCH 11/14] hwmon/coretemp: Support multi-die/package Len Brown
2019-02-26  6:20   ` [PATCH 12/14] topology: Create package_threads sysfs attribute Len Brown
2019-02-26  6:20   ` [PATCH 13/14] topology: Create core_threads " Len Brown
2019-02-26  6:20   ` [PATCH 14/14] topology: Create die_threads " Len Brown
2019-02-26 18:51 ` [PATCH 0/14] v2 multi-die/package topology support Peter Zijlstra
2019-04-12 19:32   ` Len Brown
2019-02-26 18:53 ` Peter Zijlstra
2019-03-07 14:59   ` Morten Rasmussen
2019-04-05 18:33     ` Thomas Gleixner
2019-04-12 19:52       ` Len Brown
2019-04-12 20:40         ` Brice Goglin
2019-02-26 19:05 ` Peter Zijlstra
2019-04-30  6:50   ` Len Brown
2019-04-30  9:33     ` Borislav Petkov
2019-04-30 18:46       ` Len Brown
2019-04-05 18:33 ` Thomas Gleixner

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