On Tue, Feb 19, 2019 at 03:54:00PM +0800, Chen-Yu Tsai wrote: > Sorry for resurrecting an old discussion, but since someone posted patches > for H5 and H6, I thought we should resolve this. I'm working on patches to > fix / replace the big-endian issue. > > On Thu, Sep 6, 2018 at 7:51 PM Maxime Ripard wrote: > > > > On Thu, Sep 06, 2018 at 01:47:47PM +0200, Philipp Rossak wrote: > > > On 04.09.2018 18:46, Emmanuel Vadot wrote: > > > > > + /* Data cells */ > > > > > + thermal_calibration: calib@234 { > > > > > + reg = <0x234 0x8>; > > > > > + }; > > > > You are declaring 8 bytes of calibration data but to my knowledge it's > > > > only 2 bytes per sensor, so 2 bytes for H3. > > > > Am I missing something ? > > > > > > > > Thanks, > > > > > > Emmanuel you are right, it is 2 bytes per Sensor and should be 2 bytes for > > > H3, but the thermal calibration data field is on all chips 64 bit wide - so > > > 8 bytes. So I'm reading here the complete calibration data field. > > > > Having one cell per channel would make more sense I guess. > > Would it? The 2 32-bit words directly map onto the registers 0x74 / 0x78 in > the THS. As far as the SID is concerned, their is just one consumer for this > data, the thermal sensor. How the thermal sensor uses that data is really not > its concern. And the thermal sensor is really just copying the data from the > e-fuses into its registers. Nothing more. > > Furthermore, with the register access interface, the e-fuses are read/write > 32 bits at a time. Seems to me it would make more sense to enforce a 32-bit > word size, so cells should be multiples of 32 bits. I guess you convinced me :) Maxime -- Maxime Ripard, Bootlin Embedded Linux and Kernel engineering https://bootlin.com