From: Bjorn Andersson <bjorn.andersson@linaro.org>
To: Thara Gopinath <thara.gopinath@linaro.org>
Cc: qualcomm-lt@lists.linaro.org, linux-pm@vger.kernel.org,
ulf.hansson@linaro.org, rnayak@codeaurora.org
Subject: Re: [PATCH 3/4] thermal: qcom: Add RPMHPD cooling device driver.
Date: Wed, 28 Aug 2019 12:22:11 -0700 [thread overview]
Message-ID: <20190828192211.GO6167@minitux> (raw)
In-Reply-To: <5D650904.1010402@linaro.org>
On Tue 27 Aug 03:42 PDT 2019, Thara Gopinath wrote:
> On 08/24/2019 02:10 AM, Bjorn Andersson wrote:
> > On Fri 09 Aug 17:58 PDT 2019, Thara Gopinath wrote:
> >
> >> The MX power domain in RPMH can be used to warm the
> >> the SoC in SDM845. To support this feature, introduce
> >> a RPMH power domain cooling device driver that can be
> >> plugged into the thermal framework.(The thermal framework
> >> itself requires further modifiction to support a warming
> >> device in place of a cooling device. Those extensions are
> >> not introduced in this patch series).
> >>
> >
> > This cooling device provides an interface to set a minimum state for a
> > power domain. So while it's used for controlling the MX rail exposed by
> > the RPMh on some Qualcomm SoCs there's nothing Qualcomm/RPMh specific
> > with it.
> Hi Bjorn,
>
> I agree that there is nothing Qualcomm specific. Are you suggesting a
> more generic driver here ?
>
Yes, that's what I'm suggesting.
Regards,
Bjorn
next prev parent reply other threads:[~2019-08-28 19:22 UTC|newest]
Thread overview: 21+ messages / expand[flat|nested] mbox.gz Atom feed top
2019-08-10 0:58 [PATCH 0/4] qcom: Model RPMH power domains as thermal cooling devices Thara Gopinath
2019-08-10 0:58 ` [PATCH 1/4] PM/Domains: Add support for retrieving genpd performance states information Thara Gopinath
2019-08-11 3:25 ` kbuild test robot
2019-08-11 4:03 ` kbuild test robot
2019-08-22 15:03 ` Ulf Hansson
2019-08-23 17:39 ` Thara Gopinath
2019-09-06 22:24 ` Thara Gopinath
2019-09-09 9:40 ` Ulf Hansson
2019-08-10 0:58 ` [PATCH 2/4] soc: qcom: rpmhpd: Introduce function to retrieve power domain performance state count Thara Gopinath
2019-08-10 0:58 ` [PATCH 3/4] thermal: qcom: Add RPMHPD cooling device driver Thara Gopinath
2019-08-22 15:19 ` Ulf Hansson
2019-08-23 17:51 ` Thara Gopinath
2019-08-24 6:10 ` Bjorn Andersson
2019-08-27 10:42 ` Thara Gopinath
2019-08-28 19:22 ` Bjorn Andersson [this message]
2019-08-28 12:23 ` Zhang Rui
2019-09-06 15:05 ` Thara Gopinath
2019-08-10 0:58 ` [PATCH 4/4] arm64: dts: qcom: Extend AOSS RPMHPD node Thara Gopinath
2019-08-14 10:52 ` [PATCH 0/4] qcom: Model RPMH power domains as thermal cooling devices Daniel Lezcano
2019-08-15 13:09 ` Thara Gopinath
2019-08-24 6:00 ` Bjorn Andersson
Reply instructions:
You may reply publicly to this message via plain-text email
using any one of the following methods:
* Save the following mbox file, import it into your mail client,
and reply-to-all from there: mbox
Avoid top-posting and favor interleaved quoting:
https://en.wikipedia.org/wiki/Posting_style#Interleaved_style
* Reply using the --to, --cc, and --in-reply-to
switches of git-send-email(1):
git send-email \
--in-reply-to=20190828192211.GO6167@minitux \
--to=bjorn.andersson@linaro.org \
--cc=linux-pm@vger.kernel.org \
--cc=qualcomm-lt@lists.linaro.org \
--cc=rnayak@codeaurora.org \
--cc=thara.gopinath@linaro.org \
--cc=ulf.hansson@linaro.org \
/path/to/YOUR_REPLY
https://kernel.org/pub/software/scm/git/docs/git-send-email.html
* If your mail client supports setting the In-Reply-To header
via mailto: links, try the mailto: link
Be sure your reply has a Subject: header at the top and a blank line
before the message body.
This is a public inbox, see mirroring instructions
for how to clone and mirror all data and code used for this inbox;
as well as URLs for NNTP newsgroup(s).