From mboxrd@z Thu Jan 1 00:00:00 1970 Return-Path: Received: (majordomo@vger.kernel.org) by vger.kernel.org via listexpand id S1751732AbeAZU5p convert rfc822-to-8bit (ORCPT ); Fri, 26 Jan 2018 15:57:45 -0500 Received: from hermes.aosc.io ([199.195.250.187]:40073 "EHLO hermes.aosc.io" rhost-flags-OK-OK-OK-OK) by vger.kernel.org with ESMTP id S1751256AbeAZU5o (ORCPT ); Fri, 26 Jan 2018 15:57:44 -0500 From: Icenowy Zheng To: Maxime Ripard Cc: linux-arm-kernel@lists.infradead.org, devicetree@vger.kernel.org, linux-sunxi@googlegroups.com, Marc Zyngier , Linus Walleij , Daniel Lezcano , Russell King , linux-kernel@vger.kernel.org, linux-gpio@vger.kernel.org, Chen-Yu Tsai , linux-clk@vger.kernel.org Subject: Re: [RFC PATCH 0/9] initial support for "suniv" Allwinner new ARM9 SoC Date: Sat, 27 Jan 2018 04:57:33 +0800 Message-ID: <3527360.oZpfb5Pa1p@ice-x220i> In-Reply-To: <20180125153520.lxcfvh3yvi36uiux@flea.lan> References: <20180119231735.61504-1-icenowy@aosc.io> <14593819.uISRktVE4V@ice-x220i> <20180125153520.lxcfvh3yvi36uiux@flea.lan> MIME-Version: 1.0 Content-Transfer-Encoding: 8BIT Content-Type: text/plain; charset="UTF-8" Sender: linux-kernel-owner@vger.kernel.org List-ID: X-Mailing-List: linux-kernel@vger.kernel.org 在 2018年1月25日星期四 CST 下午11:35:20,Maxime Ripard 写道: > Hi, > > On Wed, Jan 24, 2018 at 09:10:34PM +0800, Icenowy Zheng wrote: > > 在 2018年1月22日星期一 CST 下午8:14:35,Maxime Ripard 写道: > > > > > On Sat, Jan 20, 2018 at 07:17:26AM +0800, Icenowy Zheng wrote: > > > > This is the RFC initial patchset for the "new" Allwinner SUNIV ARM9 > > > > SoC. > > > > > > > > The same die is packaged differently, come with different co-packaged > > > > DRAM or shipped with different SDK; and then made many model names: > > > > F23, > > > > F25, F1C100A, F1C100S, F1C200S, F1C500, F1C600, R6, etc. These SoCs > > > > all > > > > share a common feature set and are packaged similarly (eLQFP128 for > > > > SoCs > > > > without co-packaged DRAM, QFN88 for with DRAM). As their's no > > > > functionality hidden on the QFN88 models (except DRAM interface not > > > > exported), it's not clever to differentiate them. So I will use suniv > > > > as > > > > common name of all these SoCs. > > > > > > Where is that suniv prefix coming from? > > > > The BSP (Melis and Linux). (e.g. "libs/suniv" directory of the Melis SDK > > and "arch/arm/boot/dts/sunivw1p1.dtsi" in the Linux SDK) > > Do you have a link to that BSP? https://pan.baidu.com/s/1rar5YtI There's Melis (F1C100s) and Linux (F1C600) BSP. > > > > You should really answer two questions here: > > > - Are you able to predict whether you'll find an SoC part of that > > > > > > family in the future that derives a bit and will need a compatible > > > of its own? > > > > > > - Are you able to predict which quirks we'll need along the way to > > > > > > support all the SoCs you've listed there? > > > > > > If you can't answer yes to both these questions, with a 100% > > > certainty, then you'll need a SoC name in the compatible. > > > > > > Which doesn't prevent you from sharing as much as possible the DT like > > > we did between the A10s and the A13 for example. > > > > So the suniv-f1c100s.dtsi will still be kept empty and all peripherals > > known should go through suniv.dtsi. > > Sorry if I wasn't really clear. You can totally keep the current DT > structure if that makes sense (and judging by what you're saying, it > does.), but the compatibles should have the SoC name in it. > > Maxime