From: Yang Shen <shenyang39@huawei.com>
To: <rui.zhang@intel.com>, <daniel.lezcano@linaro.org>,
<amit.kucheria@verdurent.com>
Cc: <linux-pm@vger.kernel.org>, <linuxarm@huawei.com>,
<wangzhou1@hisilicon.com>
Subject: [PATCH V3 0/2] thermal:Add HiSilicon Kunpeng thermal driver and Maintainers
Date: Tue, 21 Apr 2020 15:44:51 +0800 [thread overview]
Message-ID: <1587455093-33876-1-git-send-email-shenyang39@huawei.com> (raw)
Add HiSilicon Kunpeng thermal driver and Maintainers.
Changelog:
v3:
* remove tsensor devices enabled checking in probe function
* fix some comments
v2:
* fix sizeof(* tdev) and sizeof(* tdev->tsensor)
Yang Shen (2):
MAINTAINERS: Add maintainers for kunpeng thermal
thermal: Add HiSilicon Kunpeng thermal driver
MAINTAINERS | 7 ++
drivers/thermal/Kconfig | 8 ++U
drivers/thermal/Makefile | 1 +
drivers/thermal/kunpeng_thermal.c | 216 ++++++++++++++++++++++++++++++++++++++
4 files changed, 232 insertions(+)
create mode 100644 drivers/thermal/kunpeng_thermal.c
--
2.7.4
next reply other threads:[~2020-04-21 7:45 UTC|newest]
Thread overview: 15+ messages / expand[flat|nested] mbox.gz Atom feed top
2020-04-21 7:44 Yang Shen [this message]
2020-04-21 7:44 ` [PATCH V3 1/2] MAINTAINERS: Add maintainers for kunpeng thermal Yang Shen
2020-04-21 7:44 ` [PATCH V3 2/2] thermal: Add HiSilicon Kunpeng thermal driver Yang Shen
2020-04-27 12:13 ` Daniel Lezcano
2020-04-28 11:58 ` shenyang (M)
2020-04-28 14:02 ` Daniel Lezcano
2020-05-09 7:35 ` Zhou Wang
2020-05-10 5:04 ` Daniel Lezcano
2020-05-11 1:26 ` Zhou Wang
2020-05-11 8:14 ` Daniel Lezcano
2020-05-13 8:12 ` Zhou Wang
2020-05-13 12:45 ` Amit Kucheria
2020-05-14 13:08 ` Zhou Wang
2020-05-15 18:29 ` Daniel Lezcano
2020-04-27 8:36 ` [PATCH V3 0/2] thermal:Add HiSilicon Kunpeng thermal driver and Maintainers shenyang (M)
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