From mboxrd@z Thu Jan 1 00:00:00 1970 Return-Path: Received: (majordomo@vger.kernel.org) by vger.kernel.org via listexpand id S1753310AbbDFOED (ORCPT ); Mon, 6 Apr 2015 10:04:03 -0400 Received: from mail-ig0-f173.google.com ([209.85.213.173]:34207 "EHLO mail-ig0-f173.google.com" rhost-flags-OK-OK-OK-OK) by vger.kernel.org with ESMTP id S1752853AbbDFOEB (ORCPT ); Mon, 6 Apr 2015 10:04:01 -0400 Date: Mon, 6 Apr 2015 10:03:55 -0400 From: Matt Porter To: Xinwei Kong Cc: rui.zhuang@intel.com, edubezval@gmail.com, mark.rutland@arm.com, devicetree@vger.kernel.org, linux-pm@vger.kernel.org, linuxarm@huawei.com, xuwei5@hisilicon.com, linux-kernel@vger.kernel.org, jorge.ramirez-ortiz@linaro.org, xweikong@hotmail.com, liguozhu@hisilicon.com, linux-arm-kernel@lists.infradead.org Subject: Re: [PATCH v2 1/2] dt-bindings: Document the hi6220 thermal sensor bindings Message-ID: <20150406140355.GI30984@beef> References: <1427785162-15172-1-git-send-email-kong.kongxinwei@hisilicon.com> <1427785162-15172-2-git-send-email-kong.kongxinwei@hisilicon.com> MIME-Version: 1.0 Content-Type: text/plain; charset=us-ascii Content-Disposition: inline In-Reply-To: <1427785162-15172-2-git-send-email-kong.kongxinwei@hisilicon.com> User-Agent: Mutt/1.5.23 (2014-03-12) Sender: linux-kernel-owner@vger.kernel.org List-ID: X-Mailing-List: linux-kernel@vger.kernel.org On Tue, Mar 31, 2015 at 02:59:21PM +0800, Xinwei Kong wrote: > From: kongxinwei > > This adds documentation of device tree bindings for the > thermal sensor controller of hi6220 SoC. > > Signed-off-by: Leo Yan > Signed-off-by: kongxinwei > --- > .../bindings/thermal/hisilicon-thermal.txt | 45 ++++++++++++++++++++++ > 1 file changed, 45 insertions(+) > create mode 100644 Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt > > diff --git a/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt b/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt > new file mode 100644 > index 0000000..ceb6e2e > --- /dev/null > +++ b/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt > @@ -0,0 +1,45 @@ > +* Hisilicon Thermal > + > +This driver is for hi6220 SoC which contain 4 thermal sensor. > + > + 1. sensor 0: local sensor; > + 2. sensor 1: remote sensor for ACPU cluster 1; > + 3. sensor 2: remote sensor for ACPU cluster 2; > + 4. sensor 3: remote sensor for GPU. > + > +Every sensor use one child node to represent it, so thermal sensor include > +parent node and four child node. The parent node describe common feature and > +child node describe private feature for thermal sensor; > + > +** Required properties : > + > +- compatible: "hisilicon,tsensor". > +- reg: physical base address of thermal sensor and length of memory mapped > + region. > +- interrupt: The interrupt number to the cpu. Defines the interrupt used > + by SOCTHERM. > +- clock-names: Input clock name, should be 'thermal_clk'. > +- clocks: phandles for clock specified in "clock-names" property. > +- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a description. > + > +** Required properties for child nodes : > + > +- hisilicon,tsensor-id: the index of thermal sensor and use it to distinguish > + thermal sensor. For example: <0> stands for local sensor; <1> stands for > + acpu1 sensor; Please show an example illustrating why this property is needed. The example below doesn't show any per sensor properties aside from the sensor id. Other bindings with a similar sub-sensor hardware design like tegra-soctherm and rockchip-thermal don't have a need for a vendor specific property like this. Their drivers simply iterate over an id index during thermal sensor registration. -Matt > + > +Example : > + > + tsensor: tsensor@0,f7030700 { > + compatible = "hisilicon,tsensor"; > + reg = <0x0 0xf7030700 0x0 0x1000>; > + interrupts = <0 7 0x4>; > + clocks = <&clock_sys HI6220_TSENSOR_CLK>; > + clock-names = "thermal_clk"; > + #thermal-sensor-cells = <1>; > + > + local_sensor { > + hisilicon,tsensor-id = <0>; > + } > + ....... > + } > -- > 1.9.1 > > > > _______________________________________________ > linux-arm-kernel mailing list > linux-arm-kernel@lists.infradead.org > http://lists.infradead.org/mailman/listinfo/linux-arm-kernel From mboxrd@z Thu Jan 1 00:00:00 1970 From: Matt Porter Subject: Re: [PATCH v2 1/2] dt-bindings: Document the hi6220 thermal sensor bindings Date: Mon, 6 Apr 2015 10:03:55 -0400 Message-ID: <20150406140355.GI30984@beef> References: <1427785162-15172-1-git-send-email-kong.kongxinwei@hisilicon.com> <1427785162-15172-2-git-send-email-kong.kongxinwei@hisilicon.com> Mime-Version: 1.0 Content-Type: text/plain; charset=us-ascii Return-path: Content-Disposition: inline In-Reply-To: <1427785162-15172-2-git-send-email-kong.kongxinwei-C8/M+/jPZTeaMJb+Lgu22Q@public.gmane.org> Sender: devicetree-owner-u79uwXL29TY76Z2rM5mHXA@public.gmane.org To: Xinwei Kong Cc: rui.zhuang-ral2JQCrhuEAvxtiuMwx3w@public.gmane.org, edubezval-Re5JQEeQqe8AvxtiuMwx3w@public.gmane.org, mark.rutland-5wv7dgnIgG8@public.gmane.org, devicetree-u79uwXL29TY76Z2rM5mHXA@public.gmane.org, linux-pm-u79uwXL29TY76Z2rM5mHXA@public.gmane.org, linuxarm-hv44wF8Li93QT0dZR+AlfA@public.gmane.org, xuwei5-C8/M+/jPZTeaMJb+Lgu22Q@public.gmane.org, linux-kernel-u79uwXL29TY76Z2rM5mHXA@public.gmane.org, jorge.ramirez-ortiz-QSEj5FYQhm4dnm+yROfE0A@public.gmane.org, xweikong-PkbjNfxxIARBDgjK7y7TUQ@public.gmane.org, liguozhu-C8/M+/jPZTeaMJb+Lgu22Q@public.gmane.org, linux-arm-kernel-IAPFreCvJWM7uuMidbF8XUB+6BGkLq7r@public.gmane.org List-Id: devicetree@vger.kernel.org On Tue, Mar 31, 2015 at 02:59:21PM +0800, Xinwei Kong wrote: > From: kongxinwei > > This adds documentation of device tree bindings for the > thermal sensor controller of hi6220 SoC. > > Signed-off-by: Leo Yan > Signed-off-by: kongxinwei > --- > .../bindings/thermal/hisilicon-thermal.txt | 45 ++++++++++++++++++++++ > 1 file changed, 45 insertions(+) > create mode 100644 Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt > > diff --git a/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt b/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt > new file mode 100644 > index 0000000..ceb6e2e > --- /dev/null > +++ b/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt > @@ -0,0 +1,45 @@ > +* Hisilicon Thermal > + > +This driver is for hi6220 SoC which contain 4 thermal sensor. > + > + 1. sensor 0: local sensor; > + 2. sensor 1: remote sensor for ACPU cluster 1; > + 3. sensor 2: remote sensor for ACPU cluster 2; > + 4. sensor 3: remote sensor for GPU. > + > +Every sensor use one child node to represent it, so thermal sensor include > +parent node and four child node. The parent node describe common feature and > +child node describe private feature for thermal sensor; > + > +** Required properties : > + > +- compatible: "hisilicon,tsensor". > +- reg: physical base address of thermal sensor and length of memory mapped > + region. > +- interrupt: The interrupt number to the cpu. Defines the interrupt used > + by SOCTHERM. > +- clock-names: Input clock name, should be 'thermal_clk'. > +- clocks: phandles for clock specified in "clock-names" property. > +- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a description. > + > +** Required properties for child nodes : > + > +- hisilicon,tsensor-id: the index of thermal sensor and use it to distinguish > + thermal sensor. For example: <0> stands for local sensor; <1> stands for > + acpu1 sensor; Please show an example illustrating why this property is needed. The example below doesn't show any per sensor properties aside from the sensor id. Other bindings with a similar sub-sensor hardware design like tegra-soctherm and rockchip-thermal don't have a need for a vendor specific property like this. Their drivers simply iterate over an id index during thermal sensor registration. -Matt > + > +Example : > + > + tsensor: tsensor@0,f7030700 { > + compatible = "hisilicon,tsensor"; > + reg = <0x0 0xf7030700 0x0 0x1000>; > + interrupts = <0 7 0x4>; > + clocks = <&clock_sys HI6220_TSENSOR_CLK>; > + clock-names = "thermal_clk"; > + #thermal-sensor-cells = <1>; > + > + local_sensor { > + hisilicon,tsensor-id = <0>; > + } > + ....... > + } > -- > 1.9.1 > > > > _______________________________________________ > linux-arm-kernel mailing list > linux-arm-kernel-IAPFreCvJWM7uuMidbF8XUB+6BGkLq7r@public.gmane.org > http://lists.infradead.org/mailman/listinfo/linux-arm-kernel -- To unsubscribe from this list: send the line "unsubscribe devicetree" in the body of a message to majordomo-u79uwXL29TY76Z2rM5mHXA@public.gmane.org More majordomo info at http://vger.kernel.org/majordomo-info.html From mboxrd@z Thu Jan 1 00:00:00 1970 From: mporter@konsulko.com (Matt Porter) Date: Mon, 6 Apr 2015 10:03:55 -0400 Subject: [PATCH v2 1/2] dt-bindings: Document the hi6220 thermal sensor bindings In-Reply-To: <1427785162-15172-2-git-send-email-kong.kongxinwei@hisilicon.com> References: <1427785162-15172-1-git-send-email-kong.kongxinwei@hisilicon.com> <1427785162-15172-2-git-send-email-kong.kongxinwei@hisilicon.com> Message-ID: <20150406140355.GI30984@beef> To: linux-arm-kernel@lists.infradead.org List-Id: linux-arm-kernel.lists.infradead.org On Tue, Mar 31, 2015 at 02:59:21PM +0800, Xinwei Kong wrote: > From: kongxinwei > > This adds documentation of device tree bindings for the > thermal sensor controller of hi6220 SoC. > > Signed-off-by: Leo Yan > Signed-off-by: kongxinwei > --- > .../bindings/thermal/hisilicon-thermal.txt | 45 ++++++++++++++++++++++ > 1 file changed, 45 insertions(+) > create mode 100644 Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt > > diff --git a/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt b/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt > new file mode 100644 > index 0000000..ceb6e2e > --- /dev/null > +++ b/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt > @@ -0,0 +1,45 @@ > +* Hisilicon Thermal > + > +This driver is for hi6220 SoC which contain 4 thermal sensor. > + > + 1. sensor 0: local sensor; > + 2. sensor 1: remote sensor for ACPU cluster 1; > + 3. sensor 2: remote sensor for ACPU cluster 2; > + 4. sensor 3: remote sensor for GPU. > + > +Every sensor use one child node to represent it, so thermal sensor include > +parent node and four child node. The parent node describe common feature and > +child node describe private feature for thermal sensor; > + > +** Required properties : > + > +- compatible: "hisilicon,tsensor". > +- reg: physical base address of thermal sensor and length of memory mapped > + region. > +- interrupt: The interrupt number to the cpu. Defines the interrupt used > + by SOCTHERM. > +- clock-names: Input clock name, should be 'thermal_clk'. > +- clocks: phandles for clock specified in "clock-names" property. > +- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a description. > + > +** Required properties for child nodes : > + > +- hisilicon,tsensor-id: the index of thermal sensor and use it to distinguish > + thermal sensor. For example: <0> stands for local sensor; <1> stands for > + acpu1 sensor; Please show an example illustrating why this property is needed. The example below doesn't show any per sensor properties aside from the sensor id. Other bindings with a similar sub-sensor hardware design like tegra-soctherm and rockchip-thermal don't have a need for a vendor specific property like this. Their drivers simply iterate over an id index during thermal sensor registration. -Matt > + > +Example : > + > + tsensor: tsensor at 0,f7030700 { > + compatible = "hisilicon,tsensor"; > + reg = <0x0 0xf7030700 0x0 0x1000>; > + interrupts = <0 7 0x4>; > + clocks = <&clock_sys HI6220_TSENSOR_CLK>; > + clock-names = "thermal_clk"; > + #thermal-sensor-cells = <1>; > + > + local_sensor { > + hisilicon,tsensor-id = <0>; > + } > + ....... > + } > -- > 1.9.1 > > > > _______________________________________________ > linux-arm-kernel mailing list > linux-arm-kernel at lists.infradead.org > http://lists.infradead.org/mailman/listinfo/linux-arm-kernel