From mboxrd@z Thu Jan 1 00:00:00 1970 Return-Path: Received: (majordomo@vger.kernel.org) by vger.kernel.org via listexpand id S1751564AbdDCGmM (ORCPT ); Mon, 3 Apr 2017 02:42:12 -0400 Received: from mail.free-electrons.com ([62.4.15.54]:50014 "EHLO mail.free-electrons.com" rhost-flags-OK-OK-OK-OK) by vger.kernel.org with ESMTP id S1751282AbdDCGmK (ORCPT ); Mon, 3 Apr 2017 02:42:10 -0400 Date: Mon, 3 Apr 2017 08:42:08 +0200 From: Maxime Ripard To: Quentin Schulz Cc: icenowy@aosc.io, Lee Jones , Chen-Yu Tsai , Jonathan Cameron , Zhang Rui , devicetree@vger.kernel.org, linux-pm@vger.kernel.org, linux-arm-kernel@lists.infradead.org, linux-kernel@vger.kernel.org, linux-iio@vger.kernel.org, linux-sunxi@googlegroups.com Subject: Re: [RFC PATCH v2 4/4] ARM: sun8i: h3: add support for the thermal sensor in H3 Message-ID: <20170403064208.llk6usgtkbg5ejzw@lukather> References: <20170402133304.56824-1-icenowy@aosc.io> <20170402133304.56824-5-icenowy@aosc.io> <3f13c07d-be6a-0350-6d86-de1a4d4e33a8@free-electrons.com> MIME-Version: 1.0 Content-Type: multipart/signed; micalg=pgp-sha256; protocol="application/pgp-signature"; boundary="j5sdxdc32svkkqg5" Content-Disposition: inline In-Reply-To: <3f13c07d-be6a-0350-6d86-de1a4d4e33a8@free-electrons.com> User-Agent: Mutt/1.6.2-neo (2016-08-21) Sender: linux-kernel-owner@vger.kernel.org List-ID: X-Mailing-List: linux-kernel@vger.kernel.org --j5sdxdc32svkkqg5 Content-Type: text/plain; charset=us-ascii Content-Disposition: inline Content-Transfer-Encoding: quoted-printable On Sun, Apr 02, 2017 at 04:34:55PM +0200, Quentin Schulz wrote: > Hi Icenowy, >=20 > On 02/04/2017 15:33, Icenowy Zheng wrote: > > As we have gained the support for the thermal sensor in H3, we can now > > add its device nodes to the device tree. > >=20 > > Add them to the H3 device tree. > >=20 > > The H5 thermal sensor has some differences, and will be added furtherly. > >=20 > > Signed-off-by: Icenowy Zheng > > --- > > arch/arm/boot/dts/sun8i-h3.dtsi | 26 ++++++++++++++++++++++++++ > > 1 file changed, 26 insertions(+) > >=20 > > diff --git a/arch/arm/boot/dts/sun8i-h3.dtsi b/arch/arm/boot/dts/sun8i-= h3.dtsi > > index b36f9f423c39..552217bb9266 100644 > > --- a/arch/arm/boot/dts/sun8i-h3.dtsi > > +++ b/arch/arm/boot/dts/sun8i-h3.dtsi > > @@ -72,6 +72,32 @@ > > }; > > }; > > =20 > > + iio-hwmon { > > + compatible =3D "iio-hwmon"; > > + io-channels =3D <&ths>; > > + }; > > + > > + soc { > > + ths: ths@01c25000 { > > + compatible =3D "allwinner,sun8i-h3-ths"; > > + reg =3D <0x01c25000 0x100>; > > + clocks =3D <&ccu CLK_BUS_THS>, <&ccu CLK_THS>; > > + clock-names =3D "bus", "ths"; > > + resets =3D <&ccu RST_BUS_THS>; > > + #thermal-sensor-cells =3D <0>; > > + #io-channel-cells =3D <0>; > > + }; > > + }; > > + > > + thermal-zones { > > + cpu_thermal { > > + /* milliseconds */ > > + polling-delay-passive =3D <250>; > > + polling-delay =3D <1000>; > > + thermal-sensors =3D <&ths>; > > + }; >=20 > Would it make sense to add the CPU temp trip points in this patch? No. This is a separate, unrelated, change that has nothing to do with what is described either in the commit title or the commit log. The thermal zone itself shouldn't even be in this patch. Maxime --=20 Maxime Ripard, Free Electrons Embedded Linux and Kernel engineering http://free-electrons.com --j5sdxdc32svkkqg5 Content-Type: application/pgp-signature; name="signature.asc" -----BEGIN PGP SIGNATURE----- iQIcBAEBCAAGBQJY4e68AAoJEBx+YmzsjxAgoO4QAJP1HqM4G2JQzd2c7gDybKEF k00fktQyr/m0CLjntDayL5g7V6ofqhx4ToliHMN87B9L0ETP1X+tlDV/zm5Ej/0o Ep3m22I3qJHlYPvmT0j+7Q/HtsLxlyxFUGexshZa22T8SKWKLysJ5McVVC9UL+QR hUjLWMNvbwOKHmXdcETYRc03uBEHN6GpPqW9K9eCg0qHs+wamd3+0benFI1Q0e/2 Nuq7acsl/4/U9D3NR3bc0c9I/3M5pGqRf87HP1mERunpEbY6jpdY9zGtWzpLrWiK ffe6CoysORKVtB+XTvqGuMzBsk5wnt3+9Hob6QHcVXjkkwfMl9SFL2Ts6HAUU+Xt q2xUxEVf7odZgv4dWE0sQDayZZB80SM31xgwjnM4lUKapQO/TLIM7AvFLP1qa/y3 2m1r8J9aa2zouQqg3kT4dRi50xebasHUX0Pf/ab8ONMMYbm5z0ZMcaK5Ogt8hjsO stsNwqWINVK+GTe6VhZhO6Qn0hGtM6ItR/EceWPCrxCs2Q8O0APmn2QEj3ALBJOl zTWAsaMrYFN9fzRIkz54hBPJf/284LGEciShRzZdFitBJks4BBV1UR06z9cYYHnd pJWzJE7j+frI3Jn+q/F4DuSbZQywoYXBoEy+uouI6JOTCag8u/seRfWpf15NF1gE hNdJaaLL5uLMtFtzLgX+ =0FJ3 -----END PGP SIGNATURE----- --j5sdxdc32svkkqg5-- From mboxrd@z Thu Jan 1 00:00:00 1970 From: Maxime Ripard Subject: Re: [RFC PATCH v2 4/4] ARM: sun8i: h3: add support for the thermal sensor in H3 Date: Mon, 3 Apr 2017 08:42:08 +0200 Message-ID: <20170403064208.llk6usgtkbg5ejzw@lukather> References: <20170402133304.56824-1-icenowy@aosc.io> <20170402133304.56824-5-icenowy@aosc.io> <3f13c07d-be6a-0350-6d86-de1a4d4e33a8@free-electrons.com> Reply-To: maxime.ripard-wi1+55ScJUtKEb57/3fJTNBPR1lH4CV8@public.gmane.org Mime-Version: 1.0 Content-Type: multipart/signed; micalg=pgp-sha256; protocol="application/pgp-signature"; boundary="j5sdxdc32svkkqg5" Return-path: Sender: linux-sunxi-/JYPxA39Uh5TLH3MbocFFw@public.gmane.org Content-Disposition: inline In-Reply-To: <3f13c07d-be6a-0350-6d86-de1a4d4e33a8-wi1+55ScJUtKEb57/3fJTNBPR1lH4CV8@public.gmane.org> List-Post: , List-Help: , List-Archive: , List-Unsubscribe: , To: Quentin Schulz Cc: icenowy-h8G6r0blFSE@public.gmane.org, Lee Jones , Chen-Yu Tsai , Jonathan Cameron , Zhang Rui , devicetree-u79uwXL29TY76Z2rM5mHXA@public.gmane.org, linux-pm-u79uwXL29TY76Z2rM5mHXA@public.gmane.org, linux-arm-kernel-IAPFreCvJWM7uuMidbF8XUB+6BGkLq7r@public.gmane.org, linux-kernel-u79uwXL29TY76Z2rM5mHXA@public.gmane.org, linux-iio-u79uwXL29TY76Z2rM5mHXA@public.gmane.org, linux-sunxi-/JYPxA39Uh5TLH3MbocFFw@public.gmane.org List-Id: devicetree@vger.kernel.org --j5sdxdc32svkkqg5 Content-Type: text/plain; charset=UTF-8 Content-Disposition: inline On Sun, Apr 02, 2017 at 04:34:55PM +0200, Quentin Schulz wrote: > Hi Icenowy, > > On 02/04/2017 15:33, Icenowy Zheng wrote: > > As we have gained the support for the thermal sensor in H3, we can now > > add its device nodes to the device tree. > > > > Add them to the H3 device tree. > > > > The H5 thermal sensor has some differences, and will be added furtherly. > > > > Signed-off-by: Icenowy Zheng > > --- > > arch/arm/boot/dts/sun8i-h3.dtsi | 26 ++++++++++++++++++++++++++ > > 1 file changed, 26 insertions(+) > > > > diff --git a/arch/arm/boot/dts/sun8i-h3.dtsi b/arch/arm/boot/dts/sun8i-h3.dtsi > > index b36f9f423c39..552217bb9266 100644 > > --- a/arch/arm/boot/dts/sun8i-h3.dtsi > > +++ b/arch/arm/boot/dts/sun8i-h3.dtsi > > @@ -72,6 +72,32 @@ > > }; > > }; > > > > + iio-hwmon { > > + compatible = "iio-hwmon"; > > + io-channels = <&ths>; > > + }; > > + > > + soc { > > + ths: ths@01c25000 { > > + compatible = "allwinner,sun8i-h3-ths"; > > + reg = <0x01c25000 0x100>; > > + clocks = <&ccu CLK_BUS_THS>, <&ccu CLK_THS>; > > + clock-names = "bus", "ths"; > > + resets = <&ccu RST_BUS_THS>; > > + #thermal-sensor-cells = <0>; > > + #io-channel-cells = <0>; > > + }; > > + }; > > + > > + thermal-zones { > > + cpu_thermal { > > + /* milliseconds */ > > + polling-delay-passive = <250>; > > + polling-delay = <1000>; > > + thermal-sensors = <&ths>; > > + }; > > Would it make sense to add the CPU temp trip points in this patch? No. This is a separate, unrelated, change that has nothing to do with what is described either in the commit title or the commit log. The thermal zone itself shouldn't even be in this patch. Maxime -- Maxime Ripard, Free Electrons Embedded Linux and Kernel engineering http://free-electrons.com --j5sdxdc32svkkqg5-- From mboxrd@z Thu Jan 1 00:00:00 1970 From: maxime.ripard@free-electrons.com (Maxime Ripard) Date: Mon, 3 Apr 2017 08:42:08 +0200 Subject: [RFC PATCH v2 4/4] ARM: sun8i: h3: add support for the thermal sensor in H3 In-Reply-To: <3f13c07d-be6a-0350-6d86-de1a4d4e33a8@free-electrons.com> References: <20170402133304.56824-1-icenowy@aosc.io> <20170402133304.56824-5-icenowy@aosc.io> <3f13c07d-be6a-0350-6d86-de1a4d4e33a8@free-electrons.com> Message-ID: <20170403064208.llk6usgtkbg5ejzw@lukather> To: linux-arm-kernel@lists.infradead.org List-Id: linux-arm-kernel.lists.infradead.org On Sun, Apr 02, 2017 at 04:34:55PM +0200, Quentin Schulz wrote: > Hi Icenowy, > > On 02/04/2017 15:33, Icenowy Zheng wrote: > > As we have gained the support for the thermal sensor in H3, we can now > > add its device nodes to the device tree. > > > > Add them to the H3 device tree. > > > > The H5 thermal sensor has some differences, and will be added furtherly. > > > > Signed-off-by: Icenowy Zheng > > --- > > arch/arm/boot/dts/sun8i-h3.dtsi | 26 ++++++++++++++++++++++++++ > > 1 file changed, 26 insertions(+) > > > > diff --git a/arch/arm/boot/dts/sun8i-h3.dtsi b/arch/arm/boot/dts/sun8i-h3.dtsi > > index b36f9f423c39..552217bb9266 100644 > > --- a/arch/arm/boot/dts/sun8i-h3.dtsi > > +++ b/arch/arm/boot/dts/sun8i-h3.dtsi > > @@ -72,6 +72,32 @@ > > }; > > }; > > > > + iio-hwmon { > > + compatible = "iio-hwmon"; > > + io-channels = <&ths>; > > + }; > > + > > + soc { > > + ths: ths at 01c25000 { > > + compatible = "allwinner,sun8i-h3-ths"; > > + reg = <0x01c25000 0x100>; > > + clocks = <&ccu CLK_BUS_THS>, <&ccu CLK_THS>; > > + clock-names = "bus", "ths"; > > + resets = <&ccu RST_BUS_THS>; > > + #thermal-sensor-cells = <0>; > > + #io-channel-cells = <0>; > > + }; > > + }; > > + > > + thermal-zones { > > + cpu_thermal { > > + /* milliseconds */ > > + polling-delay-passive = <250>; > > + polling-delay = <1000>; > > + thermal-sensors = <&ths>; > > + }; > > Would it make sense to add the CPU temp trip points in this patch? No. This is a separate, unrelated, change that has nothing to do with what is described either in the commit title or the commit log. The thermal zone itself shouldn't even be in this patch. Maxime -- Maxime Ripard, Free Electrons Embedded Linux and Kernel engineering http://free-electrons.com -------------- next part -------------- A non-text attachment was scrubbed... Name: signature.asc Type: application/pgp-signature Size: 801 bytes Desc: not available URL: