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Date: Fri, 12 Oct 2018 13:21:07 +0200
From: Simon Horman <horms@verge.net.au>
Subject: Re: [PATCH v2] arm64: dts: renesas: r8a77970: add thermal support
Message-ID: <20181012112107.vtkjojhefzrkwovl@verge.net.au>
References: <fb4eb097-40aa-82df-68c7-9b727c858a8b@cogentembedded.com>
 <575ebd1f-165a-756f-f76a-14a11bba7f19@cogentembedded.com>
 <CAMuHMdW4JNYiDqwo9ZQbsrxCpXaoJzs8a1L3eNnfhVqgozRNaw@mail.gmail.com>
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In-Reply-To: <CAMuHMdW4JNYiDqwo9ZQbsrxCpXaoJzs8a1L3eNnfhVqgozRNaw@mail.gmail.com>
To: Geert Uytterhoeven <geert@linux-m68k.org>
Cc: Sergei Shtylyov <sergei.shtylyov@cogentembedded.com>, Rob Herring <robh+dt@kernel.org>, Linux-Renesas <linux-renesas-soc@vger.kernel.org>, "open list:OPEN FIRMWARE AND FLATTENED DEVICE TREE BINDINGS" <devicetree@vger.kernel.org>, Magnus Damm <magnus.damm@gmail.com>, Mark Rutland <mark.rutland@arm.com>
List-ID: <devicetree@vger.kernel.org>

On Wed, Oct 10, 2018 at 09:12:54AM +0200, Geert Uytterhoeven wrote:
> On Tue, Oct 9, 2018 at 9:50 PM Sergei Shtylyov
> <sergei.shtylyov@cogentembedded.com> wrote:
> > Describe THS/CIVM in the R8A77970 device tree.
> >
> > Based on the original (and large) patches by Vladimir Barinov.
> >
> > Signed-off-by: Vladimir Barinov <vladimir.barinov@cogentembedded.com>
> > Signed-off-by: Sergei Shtylyov <sergei.shtylyov@cogentembedded.com>
> >
> > ---
> > This patch is against the 'renesas-devel-20181004-v4.19-rc6' tag of Simon
> > Horman's 'renesas.git' repo.
> >
> > Changed in version 2:
> > - fix the "reg" prop in the thermal device node;
> > - fixed wrong plural in the patch description.
> 
> Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>

Thanks, applied for v4.21.