From mboxrd@z Thu Jan 1 00:00:00 1970 Return-Path: Date: Mon, 15 Oct 2018 17:43:39 +0200 From: Simon Horman Subject: Re: [PATCH v2] arm64: dts: renesas: r8a77970: add thermal support Message-ID: <20181015154339.alaeq7s2xguf7mjo@verge.net.au> References: <575ebd1f-165a-756f-f76a-14a11bba7f19@cogentembedded.com> <20181012112107.vtkjojhefzrkwovl@verge.net.au> <263dd8f7-8d7a-75e6-c1f3-43ddcdd98ead@cogentembedded.com> MIME-Version: 1.0 Content-Type: text/plain; charset=us-ascii Content-Disposition: inline In-Reply-To: <263dd8f7-8d7a-75e6-c1f3-43ddcdd98ead@cogentembedded.com> To: Sergei Shtylyov Cc: Geert Uytterhoeven , Rob Herring , Linux-Renesas , "open list:OPEN FIRMWARE AND FLATTENED DEVICE TREE BINDINGS" , Magnus Damm , Mark Rutland List-ID: On Fri, Oct 12, 2018 at 05:36:55PM +0300, Sergei Shtylyov wrote: > On 10/12/2018 02:21 PM, Simon Horman wrote: > > >>> Describe THS/CIVM in the R8A77970 device tree. > >>> > >>> Based on the original (and large) patches by Vladimir Barinov. > >>> > >>> Signed-off-by: Vladimir Barinov > >>> Signed-off-by: Sergei Shtylyov > >>> > >>> --- > >>> This patch is against the 'renesas-devel-20181004-v4.19-rc6' tag of Simon > >>> Horman's 'renesas.git' repo. > >>> > >>> Changed in version 2: > >>> - fix the "reg" prop in the thermal device node; > >>> - fixed wrong plural in the patch description. > >> > >> Reviewed-by: Geert Uytterhoeven > > > > Thanks, applied for v4.21. > > Not seeing any updates -- forgot to push? Yes, sorry. I noticed that this morning and pushed renesas-devel-20181012-v4.19-rc7.