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[24.155.109.49]) by smtp.gmail.com with ESMTPSA id t9sm154233oie.24.2020.04.20.14.14.48 (version=TLS1_3 cipher=TLS_AES_256_GCM_SHA384 bits=256/256); Mon, 20 Apr 2020 14:14:49 -0700 (PDT) Received: (nullmailer pid 16562 invoked by uid 1000); Mon, 20 Apr 2020 21:14:48 -0000 Date: Mon, 20 Apr 2020 16:14:48 -0500 From: Rob Herring To: Daniel Lezcano Cc: daniel.lezcano@linaro.org, rui.zhang@intel.com, amit.kucheria@verdurent.com, Mark Rutland , "open list:THERMAL" , "open list:OPEN FIRMWARE AND FLATTENED DEVICE TREE BINDINGS" , open list Subject: Re: [PATCH v3 2/4] dt-bindings: thermal: Add the idle cooling device Message-ID: <20200420211448.GA16458@bogus> References: <20200414220837.9284-1-daniel.lezcano@linaro.org> <20200414220837.9284-2-daniel.lezcano@linaro.org> MIME-Version: 1.0 Content-Type: text/plain; charset=us-ascii Content-Disposition: inline In-Reply-To: <20200414220837.9284-2-daniel.lezcano@linaro.org> User-Agent: Mutt/1.10.1 (2018-07-13) Sender: linux-kernel-owner@vger.kernel.org Precedence: bulk List-ID: X-Mailing-List: linux-kernel@vger.kernel.org On Wed, 15 Apr 2020 00:08:31 +0200, Daniel Lezcano wrote: > Some devices are not able to cool down by reducing their voltage / > frequency because it could be not available or the system does not > allow voltage scaling. In this configuration, it is not possible to > use this strategy and the idle injection cooling device can be used > instead. > > One idle cooling device is now present for the CPU as implemented by > the combination of the idle injection framework belonging to the power > capping framework and the thermal cooling device. The missing part is > the DT binding providing a way to describe how the cooling device will > work on the system. > > A first iteration was done by making the cooling device to point to > the idle state. Unfortunately it does not make sense because it would > need to duplicate the idle state description for each CPU in order to > have a different phandle and make the thermal internal framework > happy. > > It was proposed to add an cooling-cells to <3>, unfortunately the > thermal framework is expecting a value of <2> as stated by the > documentation and it is not possible from the cooling device generic > code to loop this third value to the back end cooling device. > > Another proposal was to add a child 'thermal-idle' node as the SCMI > does. This approach allows to have a self-contained configuration for > the idle cooling device without colliding with the cpufreq cooling > device which is based on the CPU node. In addition, it allows to have > the cpufreq cooling device and the idle cooling device to co-exist > together as shown in the example. > > Signed-off-by: Daniel Lezcano > --- > - V3: > - Removed extra line with tab inside > - V2: > - Fixed comment type > - Added dual license > - Fixed description s/begins to/should/ > - Changed name s/duration/duration-us/ > - Changed name s/latency/exit-latency-us/ > - Removed types for latency / duration > - Fixed s/idle-thermal/thermal-idle/ > --- > .../bindings/thermal/thermal-idle.yaml | 145 ++++++++++++++++++ > 1 file changed, 145 insertions(+) > create mode 100644 Documentation/devicetree/bindings/thermal/thermal-idle.yaml > Reviewed-by: Rob Herring