From mboxrd@z Thu Jan 1 00:00:00 1970 Return-Path: Subject: Re: [PATCH v2] arm64: dts: renesas: r8a77970: add thermal support References: <575ebd1f-165a-756f-f76a-14a11bba7f19@cogentembedded.com> <20181012112107.vtkjojhefzrkwovl@verge.net.au> From: Sergei Shtylyov Message-ID: <263dd8f7-8d7a-75e6-c1f3-43ddcdd98ead@cogentembedded.com> Date: Fri, 12 Oct 2018 17:36:55 +0300 MIME-Version: 1.0 In-Reply-To: <20181012112107.vtkjojhefzrkwovl@verge.net.au> Content-Type: text/plain; charset=utf-8 Content-Language: en-MW Content-Transfer-Encoding: 7bit To: Simon Horman , Geert Uytterhoeven Cc: Rob Herring , Linux-Renesas , "open list:OPEN FIRMWARE AND FLATTENED DEVICE TREE BINDINGS" , Magnus Damm , Mark Rutland List-ID: On 10/12/2018 02:21 PM, Simon Horman wrote: >>> Describe THS/CIVM in the R8A77970 device tree. >>> >>> Based on the original (and large) patches by Vladimir Barinov. >>> >>> Signed-off-by: Vladimir Barinov >>> Signed-off-by: Sergei Shtylyov >>> >>> --- >>> This patch is against the 'renesas-devel-20181004-v4.19-rc6' tag of Simon >>> Horman's 'renesas.git' repo. >>> >>> Changed in version 2: >>> - fix the "reg" prop in the thermal device node; >>> - fixed wrong plural in the patch description. >> >> Reviewed-by: Geert Uytterhoeven > > Thanks, applied for v4.21. Not seeing any updates -- forgot to push? MBR, Sergei