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From: Len Brown <lenb@kernel.org>
To: x86@kernel.org
Cc: linux-kernel@vger.kernel.org, Zhang Rui <rui.zhang@intel.com>,
	Len Brown <len.brown@intel.com>,
	linux-pm@vger.kernel.org
Subject: [PATCH 08/11] powercap/intel_rapl: Support multi-die/package
Date: Mon, 18 Feb 2019 22:40:10 -0500	[thread overview]
Message-ID: <3349c9e551eecbfe849320c0e938daf4e0126734.1550545163.git.len.brown@intel.com> (raw)
In-Reply-To: <635b2bf8b1151a191cd9299276b75791a818c0c2.1550545163.git.len.brown@intel.com>

From: Zhang Rui <rui.zhang@intel.com>

On the new dual-die/package systems, the RAPL MSR becomes die-scope.
Thus instead of one powercap device per physical package, now there
should be one powercap device for each unique die on these systems.

This patch introduces intel_rapl driver support for new
dual-die/package systems.

On the hardwares that do not have multi-die, topology_unique_die_id()
equals topology_physical_package_id(), thus there is no functional change.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
Cc: linux-pm@vger.kernel.org
Signed-off-by: Len Brown <len.brown@intel.com>
---
 drivers/powercap/intel_rapl.c | 4 ++--
 1 file changed, 2 insertions(+), 2 deletions(-)

diff --git a/drivers/powercap/intel_rapl.c b/drivers/powercap/intel_rapl.c
index 6057d9695fed..e004707283da 100644
--- a/drivers/powercap/intel_rapl.c
+++ b/drivers/powercap/intel_rapl.c
@@ -266,7 +266,7 @@ static struct rapl_domain *platform_rapl_domain; /* Platform (PSys) domain */
 /* caller to ensure CPU hotplug lock is held */
 static struct rapl_package *rapl_find_package(int cpu)
 {
-	int id = topology_physical_package_id(cpu);
+	int id = topology_unique_die_id(cpu);
 	struct rapl_package *rp;
 
 	list_for_each_entry(rp, &rapl_packages, plist) {
@@ -1457,7 +1457,7 @@ static void rapl_remove_package(struct rapl_package *rp)
 /* called from CPU hotplug notifier, hotplug lock held */
 static struct rapl_package *rapl_add_package(int cpu)
 {
-	int id = topology_physical_package_id(cpu);
+	int id = topology_unique_die_id(cpu);
 	struct rapl_package *rp;
 	int ret;
 
-- 
2.18.0-rc0


  parent reply	other threads:[~2019-02-19  3:40 UTC|newest]

Thread overview: 48+ messages / expand[flat|nested]  mbox.gz  Atom feed  top
     [not found] <20190219032259.12237-1-len.brown@intel.com>
2019-02-19  3:22 ` [PATCH 01/11] x86 topology: fix doc typo Len Brown
2019-02-19  3:40   ` Len Brown
2019-02-19  3:22   ` [PATCH 02/11] topolgy: simplify cputopology.txt formatting and wording Len Brown
2019-02-19  3:40     ` Len Brown
2019-02-19 19:33     ` Randy Dunlap
2019-02-19 20:33       ` [linux-drivers-review] " Brown, Len
2019-02-19  3:22   ` [PATCH 03/11] x86 topology: Add CPUID.1F multi-die/package support Len Brown
2019-02-19  3:40     ` Len Brown
2019-02-19 16:49     ` Liang, Kan
2019-02-19 19:27       ` Brown, Len
2019-02-20  2:59     ` Like Xu
2019-02-20  6:10       ` Len Brown
2019-02-20 10:55     ` Peter Zijlstra
2019-02-20 15:08       ` Len Brown
2019-02-26 13:54         ` Peter Zijlstra
2019-02-28 15:59           ` Len Brown
2019-02-28 17:56             ` Peter Zijlstra
2019-02-24 10:04     ` Brice Goglin
2019-02-25  5:31       ` Like Xu
2019-02-25  8:08       ` Brown, Len
2019-02-19  3:22   ` [PATCH 04/11] cpu topology: export die_id Len Brown
2019-02-19  3:40     ` Len Brown
2019-02-19  3:22   ` [PATCH 05/11] x86 topology: export die_siblings Len Brown
2019-02-19  3:40     ` Len Brown
2019-02-19 16:56     ` Liang, Kan
2019-02-19 18:43       ` Brown, Len
2019-02-19 19:33         ` Liang, Kan
2019-02-20 10:58           ` Peter Zijlstra
2019-02-20 21:52     ` Brice Goglin
2019-02-21  7:41       ` Len Brown
2019-02-21  8:38         ` Brice Goglin
2019-02-19  3:22   ` [PATCH 11/11] hwmon/coretemp: Support multi-die/package Len Brown
2019-02-19  3:40     ` Len Brown
2019-02-19 15:08     ` Guenter Roeck
2019-02-19 16:46     ` Guenter Roeck
2019-02-19  3:40   ` [PATCH 06/11] x86 topology: define topology_unique_die_id() Len Brown
2019-02-19  3:40   ` [PATCH 07/11] powercap/intel_rapl: simplify rapl_find_package() Len Brown
2019-02-19  9:11     ` Rafael J. Wysocki
2019-02-19  3:40   ` Len Brown [this message]
2019-02-19  9:10     ` [PATCH 08/11] powercap/intel_rapl: Support multi-die/package Rafael J. Wysocki
2019-02-20 11:02     ` Peter Zijlstra
2019-02-21  5:44       ` Len Brown
2019-02-26  4:41         ` Len Brown
2019-02-26  6:55           ` Zhang Rui
2019-02-19  3:40   ` [PATCH 09/11] powercap/intel_rapl: update rapl domain name and debug messages Len Brown
2019-02-19  9:10     ` Rafael J. Wysocki
2019-02-19  3:40   ` [PATCH 10/11] thermal/x86_pkg_temp_thermal: Support multi-die/package Len Brown
2019-02-19  3:40 [PATCH 0/11] multi-die/package support Len Brown

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