From mboxrd@z Thu Jan 1 00:00:00 1970 Return-Path: Received: (majordomo@vger.kernel.org) by vger.kernel.org via listexpand id S933245Ab3GVTnu (ORCPT ); Mon, 22 Jul 2013 15:43:50 -0400 Received: from avon.wwwdotorg.org ([70.85.31.133]:58582 "EHLO avon.wwwdotorg.org" rhost-flags-OK-OK-OK-OK) by vger.kernel.org with ESMTP id S932820Ab3GVTns (ORCPT ); Mon, 22 Jul 2013 15:43:48 -0400 Message-ID: <51ED8B6F.6020700@wwwdotorg.org> Date: Mon, 22 Jul 2013 12:43:43 -0700 From: Stephen Warren User-Agent: Mozilla/5.0 (X11; Linux x86_64; rv:17.0) Gecko/20130510 Thunderbird/17.0.6 MIME-Version: 1.0 To: Guenter Roeck CC: Eduardo Valentin , Grant Likely , Rob Herring , devicetree-discuss@lists.ozlabs.org, wni@nvidia.com, linux-pm@vger.kernel.org, linux-kernel@vger.kernel.org, lm-sensors@lm-sensors.org, l.stach@pengutronix.de Subject: Re: [lm-sensors] [RESEND PATCH V1 0/9] thermal: introduce DT thermal zone build References: <1374074248-31690-1-git-send-email-eduardo.valentin@ti.com> <20130717220942.GB990@roeck-us.net> <51E7F341.8020508@ti.com> <51E8234D.1020607@wwwdotorg.org> <20130718212108.GC4110@roeck-us.net> <51E98A07.4050402@wwwdotorg.org> <20130721110807.GC24303@roeck-us.net> In-Reply-To: <20130721110807.GC24303@roeck-us.net> X-Enigmail-Version: 1.4.6 Content-Type: text/plain; charset=ISO-8859-1 Content-Transfer-Encoding: 7bit Sender: linux-kernel-owner@vger.kernel.org List-ID: X-Mailing-List: linux-kernel@vger.kernel.org On 07/21/2013 04:08 AM, Guenter Roeck wrote: > ... [a bunch of good points re: why DT shouldn't describe thermal > profiles] Yes, lots of good arguments there. So, where/how in your opinion should thermal profiles be defined, and how should they get into the kernel? The nice thing about DT is that it's a single place that describes the platform, with a well-defined method of getting that information into the kernel. What alternatives exist? > Other but related subject .. from a thermal / hwmon driver's perspective, if > such a driver supports thermal subsystem, it should just register itself as > thermal sensor device, because that is what it is. If and how it is tied to > cooling devices should be part of the thermal subsystem and be decided there. For audio, we have individual DT nodes that represent individual audio-related components such as audio controllers, audio CODECs, etc. We also have a "virtual" node that describes how those components interact and create a complete sound card. Would it make sense to do something similar with thermal sensors and cooling devices; represent them all individually, have them register themselves with the thermal/hwmon subsystem as you describe, but then have another "system level" node that describes how the system designer intended them to interact? If you don't think so, how would the kernel represent and gain that higher-level knowledge? From mboxrd@z Thu Jan 1 00:00:00 1970 From: Stephen Warren Date: Mon, 22 Jul 2013 19:43:43 +0000 Subject: Re: [lm-sensors] [RESEND PATCH V1 0/9] thermal: introduce DT thermal zone build Message-Id: <51ED8B6F.6020700@wwwdotorg.org> List-Id: References: <1374074248-31690-1-git-send-email-eduardo.valentin@ti.com> <20130717220942.GB990@roeck-us.net> <51E7F341.8020508@ti.com> <51E8234D.1020607@wwwdotorg.org> <20130718212108.GC4110@roeck-us.net> <51E98A07.4050402@wwwdotorg.org> <20130721110807.GC24303@roeck-us.net> In-Reply-To: <20130721110807.GC24303@roeck-us.net> MIME-Version: 1.0 Content-Type: text/plain; charset="us-ascii" Content-Transfer-Encoding: 7bit To: Guenter Roeck Cc: Eduardo Valentin , Grant Likely , Rob Herring , devicetree-discuss@lists.ozlabs.org, wni@nvidia.com, linux-pm@vger.kernel.org, linux-kernel@vger.kernel.org, lm-sensors@lm-sensors.org, l.stach@pengutronix.de On 07/21/2013 04:08 AM, Guenter Roeck wrote: > ... [a bunch of good points re: why DT shouldn't describe thermal > profiles] Yes, lots of good arguments there. So, where/how in your opinion should thermal profiles be defined, and how should they get into the kernel? The nice thing about DT is that it's a single place that describes the platform, with a well-defined method of getting that information into the kernel. What alternatives exist? > Other but related subject .. from a thermal / hwmon driver's perspective, if > such a driver supports thermal subsystem, it should just register itself as > thermal sensor device, because that is what it is. If and how it is tied to > cooling devices should be part of the thermal subsystem and be decided there. For audio, we have individual DT nodes that represent individual audio-related components such as audio controllers, audio CODECs, etc. We also have a "virtual" node that describes how those components interact and create a complete sound card. Would it make sense to do something similar with thermal sensors and cooling devices; represent them all individually, have them register themselves with the thermal/hwmon subsystem as you describe, but then have another "system level" node that describes how the system designer intended them to interact? If you don't think so, how would the kernel represent and gain that higher-level knowledge? _______________________________________________ lm-sensors mailing list lm-sensors@lm-sensors.org http://lists.lm-sensors.org/mailman/listinfo/lm-sensors