From: Johan Hovold <johan@kernel.org>
To: Krishna Kurapati <quic_kriskura@quicinc.com>
Cc: Bjorn Andersson <andersson@kernel.org>,
Wesley Cheng <quic_wcheng@quicinc.com>,
Konrad Dybcio <konrad.dybcio@linaro.org>,
Greg Kroah-Hartman <gregkh@linuxfoundation.org>,
Thinh Nguyen <Thinh.Nguyen@synopsys.com>,
linux-arm-msm@vger.kernel.org, linux-usb@vger.kernel.org,
linux-kernel@vger.kernel.org, quic_ppratap@quicinc.com,
quic_jackp@quicinc.com
Subject: Re: [PATCH v2] usb: dwc3: qcom: Remove ACPI support from glue driver
Date: Tue, 5 Mar 2024 10:49:43 +0100 [thread overview]
Message-ID: <Zebqt6ohrAz2eVVs@hovoldconsulting.com> (raw)
In-Reply-To: <20240305093216.3814787-1-quic_kriskura@quicinc.com>
On Tue, Mar 05, 2024 at 03:02:16PM +0530, Krishna Kurapati wrote:
> Minimal ACPI support was added to the Qualcomm DWC3 glue driver in order to
> enable USB on SDM850 and SC8180X compute platforms. The support is still
> functional, but unnoticed regressions in other drivers indicates that no
> one actually booting any of platforms dependent on this implementation.
>
> The functionality provides is the bare minimum and is not expected to aid
> in the effort of bringing full ACPI support to the driver in the future.
>
> Remove the ACPI code from the Qualcomm DWC3 glue driver to aid in the
> implementation of improvements that are actually used like multiport and
> flattening device tree.
>
> Commit message by Bjorn Andersson.
>
> Signed-off-by: Krishna Kurapati <quic_kriskura@quicinc.com>
> ---
> Changes in v2:
> Removed ACPI dependency in Kconfig.
Reviewed-by: Johan Hovold <johan+linaro@kernel.org>
prev parent reply other threads:[~2024-03-05 9:49 UTC|newest]
Thread overview: 2+ messages / expand[flat|nested] mbox.gz Atom feed top
2024-03-05 9:32 [PATCH v2] usb: dwc3: qcom: Remove ACPI support from glue driver Krishna Kurapati
2024-03-05 9:49 ` Johan Hovold [this message]
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