From mboxrd@z Thu Jan 1 00:00:00 1970 Return-Path: Received: (majordomo@vger.kernel.org) by vger.kernel.org via listexpand id S1751931AbeA2Lyf (ORCPT ); Mon, 29 Jan 2018 06:54:35 -0500 Received: from mail-wr0-f196.google.com ([209.85.128.196]:44774 "EHLO mail-wr0-f196.google.com" rhost-flags-OK-OK-OK-OK) by vger.kernel.org with ESMTP id S1751778AbeA2Lyb (ORCPT ); Mon, 29 Jan 2018 06:54:31 -0500 X-Google-Smtp-Source: AH8x226DxzRaymgxY8L2L4DNzPdGNAyUchwV8Gv2cIOaumB8cnWXEfB/j9976x4/X5q2wKvvkiIV3w== Subject: Re: [PATCH v2 11/16] arm: dts: sunxi-h3-h5: add support for the thermal sensor in H3 and H5 To: Maxime Ripard Cc: lee.jones@linaro.org, robh+dt@kernel.org, mark.rutland@arm.com, wens@csie.org, linux@armlinux.org.uk, jic23@kernel.org, knaack.h@gmx.de, lars@metafoo.de, pmeerw@pmeerw.net, davem@davemloft.net, hans.verkuil@cisco.com, mchehab@kernel.org, rask@formelder.dk, clabbe.montjoie@gmail.com, sean@mess.org, krzk@kernel.org, quentin.schulz@free-electrons.com, icenowy@aosc.io, edu.molinas@gmail.com, singhalsimran0@gmail.com, linux-iio@vger.kernel.org, devicetree@vger.kernel.org, linux-arm-kernel@lists.infradead.org, linux-kernel@vger.kernel.org, linux-sunxi@googlegroups.com References: <20180128232919.12639-1-embed3d@gmail.com> <20180128232919.12639-12-embed3d@gmail.com> <20180129094918.4fvxpmoftgxxkqg3@flea.lan> From: Philipp Rossak Message-ID: Date: Mon, 29 Jan 2018 12:54:26 +0100 User-Agent: Mozilla/5.0 (X11; Linux x86_64; rv:52.0) Gecko/20100101 Thunderbird/52.5.0 MIME-Version: 1.0 In-Reply-To: <20180129094918.4fvxpmoftgxxkqg3@flea.lan> Content-Type: text/plain; charset=windows-1252; format=flowed Content-Language: en-US Content-Transfer-Encoding: 7bit Sender: linux-kernel-owner@vger.kernel.org List-ID: X-Mailing-List: linux-kernel@vger.kernel.org On 29.01.2018 10:49, Maxime Ripard wrote: > Hi, > > On Mon, Jan 29, 2018 at 12:29:14AM +0100, Philipp Rossak wrote: >> As we have gained the support for the thermal sensor in H3 and H5, >> we can now add its device nodes to the device tree. The H3 and H5 share >> most of its compatible. The compatible and the thermal sensor cells >> will be added in an additional patch per device. >> >> Signed-off-by: Philipp Rossak >> --- >> arch/arm/boot/dts/sunxi-h3-h5.dtsi | 9 +++++++++ >> 1 file changed, 9 insertions(+) >> >> diff --git a/arch/arm/boot/dts/sunxi-h3-h5.dtsi b/arch/arm/boot/dts/sunxi-h3-h5.dtsi >> index 7a83b15225c7..413c789b588d 100644 >> --- a/arch/arm/boot/dts/sunxi-h3-h5.dtsi >> +++ b/arch/arm/boot/dts/sunxi-h3-h5.dtsi >> @@ -426,6 +426,15 @@ >> }; >> }; >> >> + ths: thermal-sensor@1c25000 { >> + reg = <0x01c25000 0x100>; > > The size is 0x400 > > Maxime > Ok, I will fix this. Philipp From mboxrd@z Thu Jan 1 00:00:00 1970 From: Philipp Rossak Subject: Re: [PATCH v2 11/16] arm: dts: sunxi-h3-h5: add support for the thermal sensor in H3 and H5 Date: Mon, 29 Jan 2018 12:54:26 +0100 Message-ID: References: <20180128232919.12639-1-embed3d@gmail.com> <20180128232919.12639-12-embed3d@gmail.com> <20180129094918.4fvxpmoftgxxkqg3@flea.lan> Reply-To: embed3d-Re5JQEeQqe8AvxtiuMwx3w@public.gmane.org Mime-Version: 1.0 Content-Type: text/plain; charset="UTF-8"; format=flowed Return-path: Sender: linux-sunxi-/JYPxA39Uh5TLH3MbocFFw@public.gmane.org In-Reply-To: <20180129094918.4fvxpmoftgxxkqg3-ZC1Zs529Oq4@public.gmane.org> Content-Language: en-US List-Post: , List-Help: , List-Archive: , List-Unsubscribe: , To: Maxime Ripard Cc: lee.jones-QSEj5FYQhm4dnm+yROfE0A@public.gmane.org, robh+dt-DgEjT+Ai2ygdnm+yROfE0A@public.gmane.org, mark.rutland-5wv7dgnIgG8@public.gmane.org, wens-jdAy2FN1RRM@public.gmane.org, linux-I+IVW8TIWO2tmTQ+vhA3Yw@public.gmane.org, jic23-DgEjT+Ai2ygdnm+yROfE0A@public.gmane.org, knaack.h-Mmb7MZpHnFY@public.gmane.org, lars-Qo5EllUWu/uELgA04lAiVw@public.gmane.org, pmeerw-jW+XmwGofnusTnJN9+BGXg@public.gmane.org, davem-fT/PcQaiUtIeIZ0/mPfg9Q@public.gmane.org, hans.verkuil-FYB4Gu1CFyUAvxtiuMwx3w@public.gmane.org, mchehab-DgEjT+Ai2ygdnm+yROfE0A@public.gmane.org, rask-SivP7zSAdNDZaaYASwVUlg@public.gmane.org, clabbe.montjoie-Re5JQEeQqe8AvxtiuMwx3w@public.gmane.org, sean-hENCXIMQXOg@public.gmane.org, krzk-DgEjT+Ai2ygdnm+yROfE0A@public.gmane.org, quentin.schulz-wi1+55ScJUtKEb57/3fJTNBPR1lH4CV8@public.gmane.org, icenowy-h8G6r0blFSE@public.gmane.org, edu.molinas-Re5JQEeQqe8AvxtiuMwx3w@public.gmane.org, singhalsimran0-Re5JQEeQqe8AvxtiuMwx3w@public.gmane.org, linux-iio-u79uwXL29TY76Z2rM5mHXA@public.gmane.org, devicetree-u79uwXL29TY76Z2rM5mHXA@public.gmane.org, linux-arm-kernel-IAPFreCvJWM7uuMidbF8XUB+6BGkLq7r@public.gmane.org, linux-kernel-u79uwXL29TY76Z2rM5mHXA@public.gmane.org, linux-sunxi-/JYPxA39Uh5TLH3MbocFFw@public.gmane.org List-Id: devicetree@vger.kernel.org On 29.01.2018 10:49, Maxime Ripard wrote: > Hi, > > On Mon, Jan 29, 2018 at 12:29:14AM +0100, Philipp Rossak wrote: >> As we have gained the support for the thermal sensor in H3 and H5, >> we can now add its device nodes to the device tree. The H3 and H5 share >> most of its compatible. The compatible and the thermal sensor cells >> will be added in an additional patch per device. >> >> Signed-off-by: Philipp Rossak >> --- >> arch/arm/boot/dts/sunxi-h3-h5.dtsi | 9 +++++++++ >> 1 file changed, 9 insertions(+) >> >> diff --git a/arch/arm/boot/dts/sunxi-h3-h5.dtsi b/arch/arm/boot/dts/sunxi-h3-h5.dtsi >> index 7a83b15225c7..413c789b588d 100644 >> --- a/arch/arm/boot/dts/sunxi-h3-h5.dtsi >> +++ b/arch/arm/boot/dts/sunxi-h3-h5.dtsi >> @@ -426,6 +426,15 @@ >> }; >> }; >> >> + ths: thermal-sensor@1c25000 { >> + reg = <0x01c25000 0x100>; > > The size is 0x400 > > Maxime > Ok, I will fix this. Philipp From mboxrd@z Thu Jan 1 00:00:00 1970 From: embed3d@gmail.com (Philipp Rossak) Date: Mon, 29 Jan 2018 12:54:26 +0100 Subject: [PATCH v2 11/16] arm: dts: sunxi-h3-h5: add support for the thermal sensor in H3 and H5 In-Reply-To: <20180129094918.4fvxpmoftgxxkqg3@flea.lan> References: <20180128232919.12639-1-embed3d@gmail.com> <20180128232919.12639-12-embed3d@gmail.com> <20180129094918.4fvxpmoftgxxkqg3@flea.lan> Message-ID: To: linux-arm-kernel@lists.infradead.org List-Id: linux-arm-kernel.lists.infradead.org On 29.01.2018 10:49, Maxime Ripard wrote: > Hi, > > On Mon, Jan 29, 2018 at 12:29:14AM +0100, Philipp Rossak wrote: >> As we have gained the support for the thermal sensor in H3 and H5, >> we can now add its device nodes to the device tree. The H3 and H5 share >> most of its compatible. The compatible and the thermal sensor cells >> will be added in an additional patch per device. >> >> Signed-off-by: Philipp Rossak >> --- >> arch/arm/boot/dts/sunxi-h3-h5.dtsi | 9 +++++++++ >> 1 file changed, 9 insertions(+) >> >> diff --git a/arch/arm/boot/dts/sunxi-h3-h5.dtsi b/arch/arm/boot/dts/sunxi-h3-h5.dtsi >> index 7a83b15225c7..413c789b588d 100644 >> --- a/arch/arm/boot/dts/sunxi-h3-h5.dtsi >> +++ b/arch/arm/boot/dts/sunxi-h3-h5.dtsi >> @@ -426,6 +426,15 @@ >> }; >> }; >> >> + ths: thermal-sensor at 1c25000 { >> + reg = <0x01c25000 0x100>; > > The size is 0x400 > > Maxime > Ok, I will fix this. Philipp