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([2401:4900:1c60:5362:9d7f:2354:1d0a:78e3]) by smtp.gmail.com with ESMTPSA id f7-20020a635547000000b0042b117e8bf8sm773930pgm.23.2022.09.02.00.39.18 (version=TLS1_3 cipher=TLS_AES_128_GCM_SHA256 bits=128/128); Fri, 02 Sep 2022 00:39:21 -0700 (PDT) Message-ID: Date: Fri, 2 Sep 2022 13:09:17 +0530 MIME-Version: 1.0 User-Agent: Mozilla/5.0 (X11; Linux x86_64; rv:91.0) Gecko/20100101 Thunderbird/91.12.0 Subject: Re: [PATCH] thermal/drivers/qcom: Drop false build dependency of all QCOM drivers on QCOM_TSENS Content-Language: en-US To: Jonathan Cameron , "Rafael J . Wysocki" , Daniel Lezcano Cc: Amit Kucheria , Thara Gopinath , linux-pm@vger.kernel.org, Zhang Rui , Jonathan Cameron , Dmitry Baryshkov References: <20220821160032.2206349-1-jic23@kernel.org> From: Bhupesh Sharma In-Reply-To: <20220821160032.2206349-1-jic23@kernel.org> Content-Type: text/plain; charset=UTF-8; format=flowed Content-Transfer-Encoding: 7bit Precedence: bulk List-ID: X-Mailing-List: linux-pm@vger.kernel.org Hi, On 8/21/22 9:30 PM, Jonathan Cameron wrote: > From: Jonathan Cameron > > The SPMI QCOM drivers have no dependency in Kconfig, but the Makefile > will not be included without QCOM_TSENS. This unnecessarily reduces > build coverage. > > Signed-off-by: Jonathan Cameron > Cc: Dmitry Baryshkov > Cc: Bhupesh Sharma > --- > > Run into whilst trying to build test a namespace move for the IIO > interfaces used in these drivers. Good catch. Actually, I am working on a detailed cleanup of the Makefile, Kconfig and Maintainers entries for qcom thermal driver entries as in the present form having all entries inside qcom/ directory dependent on CONFIG_QCOM_TSENS doesn't seem optimal (especially with new driver files being added). > Maintainers entry for TSENS should probably also be made more > specific. > --- > drivers/thermal/Makefile | 2 +- > 1 file changed, 1 insertion(+), 1 deletion(-) > > diff --git a/drivers/thermal/Makefile b/drivers/thermal/Makefile > index def8e1a0399c..2506c6c8ca83 100644 > --- a/drivers/thermal/Makefile > +++ b/drivers/thermal/Makefile > @@ -52,7 +52,7 @@ obj-$(CONFIG_DA9062_THERMAL) += da9062-thermal.o > obj-y += intel/ > obj-$(CONFIG_TI_SOC_THERMAL) += ti-soc-thermal/ > obj-y += st/ > -obj-$(CONFIG_QCOM_TSENS) += qcom/ > +obj-y += qcom/ > obj-y += tegra/ > obj-$(CONFIG_HISI_THERMAL) += hisi_thermal.o > obj-$(CONFIG_MTK_THERMAL) += mtk_thermal.o For now, this looks good to me, so: Reviewed-by: Bhupesh Sharma Thanks.