From: Krzysztof Kozlowski <krzk@kernel.org>
To: Li Jun <jun.li@nxp.com>
Cc: aisheng.dong@nxp.com, balbi@kernel.org, peng.fan@nxp.com,
festevam@gmail.com, fugang.duan@nxp.com, horia.geanta@nxp.com,
Anson.Huang@nxp.com, peter.chen@nxp.com,
gregkh@linuxfoundation.org, s.hauer@pengutronix.de,
qiangqing.zhang@nxp.com, devicetree@vger.kernel.org,
robh+dt@kernel.org, linux-imx@nxp.com, kernel@pengutronix.de,
shawnguo@kernel.org, linux-arm-kernel@lists.infradead.org
Subject: Re: [PATCH v5 1/4] dt-bindings: usb: dwc3-imx8mp: add imx8mp dwc3 glue bindings
Date: Sun, 4 Oct 2020 15:44:36 +0200 [thread overview]
Message-ID: <20201004134436.GA3158@kozik-lap> (raw)
In-Reply-To: <1601726527-23326-2-git-send-email-jun.li@nxp.com>
On Sat, Oct 03, 2020 at 08:02:04PM +0800, Li Jun wrote:
> NXP imx8mp integrates 2 dwc3 3.30b IP and add some wakeup logic
> to support low power mode, the glue layer is for this wakeup
> functionality, which has a separated interrupt, can support
> wakeup from U3 and connect events for host, and vbus wakeup for
> device.
>
> Signed-off-by: Li Jun <jun.li@nxp.com>
> ---
> .../devicetree/bindings/usb/fsl,imx8mp-dwc3.yaml | 105 +++++++++++++++++++++
> 1 file changed, 105 insertions(+)
>
Reviewed-by: Krzysztof Kozlowski <krzk@kernel.org>
Best regards,
Krzysztof
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next prev parent reply other threads:[~2020-10-04 13:46 UTC|newest]
Thread overview: 9+ messages / expand[flat|nested] mbox.gz Atom feed top
2020-10-03 12:02 [PATCH v5 0/4] add NXP imx8mp usb support Li Jun
2020-10-03 12:02 ` [PATCH v5 1/4] dt-bindings: usb: dwc3-imx8mp: add imx8mp dwc3 glue bindings Li Jun
2020-10-04 13:44 ` Krzysztof Kozlowski [this message]
2020-10-06 21:10 ` Rob Herring
2020-10-03 12:02 ` [PATCH v5 2/4] usb: dwc3: add imx8mp dwc3 glue layer driver Li Jun
2020-12-04 2:07 ` Jun Li
2020-10-03 12:02 ` [PATCH v5 3/4] arm64: dtsi: imx8mp: add usb nodes Li Jun
2020-10-03 12:02 ` [PATCH v5 4/4] arm64: dts: imx8mp-evk: enable usb1 as host mode Li Jun
2020-10-30 7:23 ` [PATCH v5 0/4] add NXP imx8mp usb support Shawn Guo
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