From: Amit Kucheria <amit.kucheria@verdurent.com>
To: LKML <linux-kernel@vger.kernel.org>,
linux-arm-msm <linux-arm-msm@vger.kernel.org>,
Stephen Boyd <swboyd@chromium.org>,
Matthias Kaehlcke <mka@chromium.org>,
Daniel Lezcano <daniel.lezcano@linaro.org>,
Amit Kucheria <amit.kucheria@verdurent.com>,
Zhang Rui <rui.zhang@intel.com>
Cc: "open list:OPEN FIRMWARE AND FLATTENED DEVICE TREE BINDINGS"
<devicetree@vger.kernel.org>,
Linux PM list <linux-pm@vger.kernel.org>
Subject: Re: [RFC PATCH v5 0/3] Convert thermal bindings to yaml
Date: Mon, 24 Feb 2020 12:52:07 +0530 [thread overview]
Message-ID: <CAHLCerPQ1MhxHPYx9sODTf25MFzEYO7W8rREdarTUCGHJzZ2LQ@mail.gmail.com> (raw)
In-Reply-To: <cover.1582527752.git.amit.kucheria@linaro.org>
Sigh, typo on my part with the version of the series. Will resend with
corrections.
On Mon, Feb 24, 2020 at 12:50 PM Amit Kucheria <amit.kucheria@linaro.org> wrote:
>
> Hi all,
>
> Here is a series splitting up the thermal bindings into 3 separate bindings
> in YAML, one each of the sensor, cooling-device and the thermal zones.
> Since I was learning about YAML parsers while creating these bindings,
> there are bound to be some issues.
>
> I have to add that the bindings as they exist today, don't really follow
> the "describe the hardware" model of devicetree. e.g. the entire
> thermal-zone binding is a software abstraction to tie arbitrary,
> board-specific trip points to cooling strategies. This doesn't fit well
> into the model where the same SoC in two different form-factor devices e.g.
> mobile and laptop, will have fairly different thermal profiles and might
> benefit from different trip points and mitigation heuristics. I've started
> some experiments with moving the thermal zone data to a board-specific
> platform data that is used to initialise a "thermal zone driver".
>
> In any case, if we ever move down that path, it'll probably end up being v2
> of the binding, so this series is still relevant.
>
> Please help review.
>
> Regards,
> Amit
>
>
> Amit Kucheria (3):
> dt-bindings: thermal: Add yaml bindings for thermal sensors
> dt-bindings: thermal: Add yaml bindings for thermal cooling-devices
> dt-bindings: thermal: Add yaml bindings for thermal zones
>
> .../thermal/thermal-cooling-devices.yaml | 114 +++++++
> .../bindings/thermal/thermal-sensor.yaml | 70 ++++
> .../bindings/thermal/thermal-zones.yaml | 302 ++++++++++++++++++
> 3 files changed, 486 insertions(+)
> create mode 100644 Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml
> create mode 100644 Documentation/devicetree/bindings/thermal/thermal-sensor.yaml
> create mode 100644 Documentation/devicetree/bindings/thermal/thermal-zones.yaml
>
> --
> 2.20.1
>
prev parent reply other threads:[~2020-02-24 7:22 UTC|newest]
Thread overview: 5+ messages / expand[flat|nested] mbox.gz Atom feed top
2020-02-24 7:20 [RFC PATCH v5 0/3] Convert thermal bindings to yaml Amit Kucheria
2020-02-24 7:20 ` [RFC PATCH v5 1/3] dt-bindings: thermal: Add yaml bindings for thermal sensors Amit Kucheria
2020-02-24 7:20 ` [RFC PATCH v5 2/3] dt-bindings: thermal: Add yaml bindings for thermal cooling-devices Amit Kucheria
2020-02-24 7:20 ` [RFC PATCH v5 3/3] dt-bindings: thermal: Add yaml bindings for thermal zones Amit Kucheria
2020-02-24 7:22 ` Amit Kucheria [this message]
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