Re: [PATCH v10 0/6] Re-introduce TX FIFO resize for larger EP bursting

[Wesley Cheng <wcheng@codeaurora.org>]

Hi,

On 6/17/2021 2:01 PM, Ferry Toth wrote:
> Hi
> 
> Op 17-06-2021 om 11:58 schreef Wesley Cheng:
>> Changes in V10:
>>   - Fixed compilation errors in config where OF is not used (error due to
>>     unknown symbol for of_add_property()).  Add of_add_property() stub.
>>   - Fixed compilation warning for incorrect argument being passed to
>> dwc3_mdwidth
> This fixes the OOPS I had in V9. I do not see any change in performance
> on Merrifield though.

I see...thanks Ferry! With your testing, are you writing to the device's
internal storage (ie UFS, eMMC, etc...), or did you use a ramdisk as well?

If not with a ramdisk, we might want to give that a try to avoid the
storage path being the bottleneck.  You can use "dd" to create an empty
file, and then just use that as the LUN's backing file.

echo ramdisk.img >
/sys/kernel/config/usb_gadget/g1/functions/mass_storage.0/lun.0/file

Thanks
Wesley Cheng

>> Changes in V9:
>>   - Fixed incorrect patch in series.  Removed changes in DTSI, as
>> dwc3-qcom will
>>     add the property by default from the kernel.
>>
>> Changes in V8:
>>   - Rebased to usb-testing
>>   - Using devm_kzalloc for adding txfifo property in dwc3-qcom
>>   - Removed DWC3 QCOM ACPI property for enabling the txfifo resize
>>
>> Changes in V7:
>>   - Added a new property tx-fifo-max-num for limiting how much fifo
>> space the
>>     resizing logic can allocate for endpoints with large burst
>> values.  This
>>     can differ across platforms, and tie in closely with overall
>> system latency.
>>   - Added recommended checks for DWC32.
>>   - Added changes to set the tx-fifo-resize property from dwc3-qcom by
>> default
>>     instead of modifying the current DTSI files.
>>   - Added comments on all APIs/variables introduced.
>>   - Updated the DWC3 YAML to include a better description of the
>> tx-fifo-resize
>>     property and added an entry for tx-fifo-max-num.
>>
>> Changes in V6:
>>   - Rebased patches to usb-testing.
>>   - Renamed to PATCH series instead of RFC.
>>   - Checking for fs_descriptors instead of ss_descriptors for
>> determining the
>>     endpoint count for a particular configuration.
>>   - Re-ordered patch series to fix patch dependencies.
>>
>> Changes in V5:
>>   - Added check_config() logic, which is used to communicate the
>> number of EPs
>>     used in a particular configuration.  Based on this, the DWC3
>> gadget driver
>>     has the ability to know the maximum number of eps utilized in all
>> configs.
>>     This helps reduce unnecessary allocation to unused eps, and will
>> catch fifo
>>     allocation issues at bind() time.
>>   - Fixed variable declaration to single line per variable, and
>> reverse xmas.
>>   - Created a helper for fifo clearing, which is used by ep0.c
>>
>> Changes in V4:
>>   - Removed struct dwc3* as an argument for dwc3_gadget_resize_tx_fifos()
>>   - Removed WARN_ON(1) in case we run out of fifo space
>>   Changes in V3:
>>   - Removed "Reviewed-by" tags
>>   - Renamed series back to RFC
>>   - Modified logic to ensure that fifo_size is reset if we pass the
>> minimum
>>     threshold.  Tested with binding multiple FDs requesting 6 FIFOs.
>>
>> Changes in V2:
>>   - Modified TXFIFO resizing logic to ensure that each EP is reserved a
>>     FIFO.
>>   - Removed dev_dbg() prints and fixed typos from patches
>>   - Added some more description on the dt-bindings commit message
>>
>> Currently, there is no functionality to allow for resizing the
>> TXFIFOs, and
>> relying on the HW default setting for the TXFIFO depth.  In most
>> cases, the
>> HW default is probably sufficient, but for USB compositions that contain
>> multiple functions that require EP bursting, the default settings
>> might not be enough.  Also to note, the current SW will assign an EP to a
>> function driver w/o checking to see if the TXFIFO size for that
>> particular
>> EP is large enough. (this is a problem if there are multiple HW defined
>> values for the TXFIFO size)
>>
>> It is mentioned in the SNPS databook that a minimum of TX FIFO depth = 3
>> is required for an EP that supports bursting.  Otherwise, there may be
>> frequent occurences of bursts ending.  For high bandwidth functions,
>> such as data tethering (protocols that support data aggregation), mass
>> storage, and media transfer protocol (over FFS), the bMaxBurst value
>> can be
>> large, and a bigger TXFIFO depth may prove to be beneficial in terms
>> of USB
>> throughput. (which can be associated to system access latency,
>> etc...)  It
>> allows for a more consistent burst of traffic, w/o any interruptions, as
>> data is readily available in the FIFO.
>>
>> With testing done using the mass storage function driver, the results
>> show
>> that with a larger TXFIFO depth, the bandwidth increased significantly.
>>
>> Test Parameters:
>>   - Platform: Qualcomm SM8150
>>   - bMaxBurst = 6
>>   - USB req size = 256kB
>>   - Num of USB reqs = 16
>>   - USB Speed = Super-Speed
>>   - Function Driver: Mass Storage (w/ ramdisk)
>>   - Test Application: CrystalDiskMark
>>
>> Results:
>>
>> TXFIFO Depth = 3 max packets
>>
>> Test Case | Data Size | AVG tput (in MB/s)
>> -------------------------------------------
>> Sequential|1 GB x     |
>> Read      |9 loops    | 193.60
>>       |           | 195.86
>>            |           | 184.77
>>            |           | 193.60
>> -------------------------------------------
>>
>> TXFIFO Depth = 6 max packets
>>
>> Test Case | Data Size | AVG tput (in MB/s)
>> -------------------------------------------
>> Sequential|1 GB x     |
>> Read      |9 loops    | 287.35
>>       |           | 304.94
>>            |           | 289.64
>>            |           | 293.61
>> -------------------------------------------
>>
>> Wesley Cheng (6):
>>    usb: gadget: udc: core: Introduce check_config to verify USB
>>      configuration
>>    usb: gadget: configfs: Check USB configuration before adding
>>    usb: dwc3: Resize TX FIFOs to meet EP bursting requirements
>>    of: Add stub for of_add_property()
>>    usb: dwc3: dwc3-qcom: Enable tx-fifo-resize property by default
>>    dt-bindings: usb: dwc3: Update dwc3 TX fifo properties
>>
>>   .../devicetree/bindings/usb/snps,dwc3.yaml         |  15 +-
>>   drivers/usb/dwc3/core.c                            |   9 +
>>   drivers/usb/dwc3/core.h                            |  15 ++
>>   drivers/usb/dwc3/dwc3-qcom.c                       |   9 +
>>   drivers/usb/dwc3/ep0.c                             |   2 +
>>   drivers/usb/dwc3/gadget.c                          | 212
>> +++++++++++++++++++++
>>   drivers/usb/gadget/configfs.c                      |  22 +++
>>   drivers/usb/gadget/udc/core.c                      |  25 +++
>>   include/linux/of.h                                 |   5 +
>>   include/linux/usb/gadget.h                         |   5 +
>>   10 files changed, 317 insertions(+), 2 deletions(-)
>>

-- 
The Qualcomm Innovation Center, Inc. is a member of the Code Aurora Forum,
a Linux Foundation Collaborative Project