From: Dawei Chien <dawei.chien-NuS5LvNUpcJWk0Htik3J/w@public.gmane.org>
To: Viresh Kumar <viresh.kumar-QSEj5FYQhm4dnm+yROfE0A@public.gmane.org>
Cc: "Rafael J. Wysocki" <rjw-LthD3rsA81gm4RdzfppkhA@public.gmane.org>,
Rob Herring <robh+dt-DgEjT+Ai2ygdnm+yROfE0A@public.gmane.org>,
Pawel Moll <pawel.moll-5wv7dgnIgG8@public.gmane.org>,
Mark Rutland <mark.rutland-5wv7dgnIgG8@public.gmane.org>,
Ian Campbell
<ijc+devicetree-KcIKpvwj1kUDXYZnReoRVg@public.gmane.org>,
Kumar Gala <galak-sgV2jX0FEOL9JmXXK+q4OQ@public.gmane.org>,
Matthias Brugger
<matthias.bgg-Re5JQEeQqe8AvxtiuMwx3w@public.gmane.org>,
Daniel Kurtz <djkurtz-F7+t8E8rja9g9hUCZPvPmw@public.gmane.org>,
Sascha Hauer <s.hauer-bIcnvbaLZ9MEGnE8C9+IrQ@public.gmane.org>,
Daniel Lezcano
<daniel.lezcano-QSEj5FYQhm4dnm+yROfE0A@public.gmane.org>,
Dawei Chien <dawei.chien-NuS5LvNUpcJWk0Htik3J/w@public.gmane.org>,
devicetree-u79uwXL29TY76Z2rM5mHXA@public.gmane.org,
linux-arm-kernel-IAPFreCvJWM7uuMidbF8XUB+6BGkLq7r@public.gmane.org,
linux-kernel-u79uwXL29TY76Z2rM5mHXA@public.gmane.org,
linux-pm-u79uwXL29TY76Z2rM5mHXA@public.gmane.org,
linux-mediatek-IAPFreCvJWM7uuMidbF8XUB+6BGkLq7r@public.gmane.org,
srv_heupstream-NuS5LvNUpcJWk0Htik3J/w@public.gmane.org,
Sascha Hauer <kernel-bIcnvbaLZ9MEGnE8C9+IrQ@public.gmane.org>,
Punit Agrawal <punit.agrawal-5wv7dgnIgG8@public.gmane.org>
Subject: [PATCH v6 0/3] thermal: mediatek: Add cpu dynamic power cooling model.
Date: Wed, 16 Dec 2015 21:29:13 +0800 [thread overview]
Message-ID: <1450272556-29770-1-git-send-email-dawei.chien@mediatek.com> (raw)
Use Intelligent Power Allocation (IPA) technical to add dynamic power model
for binding CPU thermal zone. The power allocator governor allocates power
budget to control CPU temperature.
Power Allocator governor is able to keep SOC temperature within a defined
temperature range to avoid SOC overheat and keep it's performance.
mt8173-cpufreq.c need to register its' own power model with power allocator
thermal governor, so that power allocator governor can allocates suitable
power budget to control CPU temperature.
Binding document is refer to this patchset
https://lkml.org/lkml/2015/11/30/239
Change since V5:
1. Remove thermal sensor ID from phandles
Change since V4:
1. Remove unnecessary error-checking for mt8173-cpufreq.c
2. Initializing variable capacitance with 0
Change since V3:
1. Remove static power model
2. Split V3's device tree in two for thermal zones and dynamic power models respectively
Change since V2:
1. Move dynamic/static power model in device tree
Change since V1:
1. Include mt8171.h and sort header file for mt8173.dtsi
Dawei Chien (3):
thermal: mediatek: Add cpu dynamic power cooling model.
arm64: dts: mt8173: Add thermal zone node.
arm64: dts: mt8173: Add dynamic power node.
arch/arm64/boot/dts/mediatek/mt8173.dtsi | 47 ++++++++++++++++++++++++++++++
drivers/cpufreq/mt8173-cpufreq.c | 12 ++++++--
2 files changed, 57 insertions(+), 2 deletions(-)
--
1.7.9.5
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next reply other threads:[~2015-12-16 13:29 UTC|newest]
Thread overview: 12+ messages / expand[flat|nested] mbox.gz Atom feed top
2015-12-16 13:29 Dawei Chien [this message]
2015-12-16 13:29 ` [PATCH v6 1/3] thermal: mediatek: Add cpu dynamic power cooling model Dawei Chien
2015-12-16 13:29 ` [PATCH v6 2/3] arm64: dts: mt8173: Add thermal zone node Dawei Chien
2015-12-16 13:29 ` [PATCH v6 3/3] arm64: dts: mt8173: Add dynamic power node Dawei Chien
2015-12-17 1:52 ` [PATCH v6 0/3] thermal: mediatek: Add cpu dynamic power cooling model Viresh Kumar
2016-03-15 4:53 ` dawei chien
2016-03-15 6:17 ` Viresh Kumar
2016-03-22 5:13 ` dawei chien
2016-04-12 2:32 ` dawei chien
2016-04-12 5:11 ` Viresh Kumar
2016-04-12 5:24 ` dawei chien
2016-04-12 5:39 ` Viresh Kumar
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