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* [PATCH 2/4] dt-bindings: thermal: Add the idle cooling device
       [not found] <20200329220324.8785-1-daniel.lezcano@linaro.org>
@ 2020-03-29 22:03 ` Daniel Lezcano
  2020-04-07 13:36   ` Daniel Lezcano
                     ` (2 more replies)
  0 siblings, 3 replies; 5+ messages in thread
From: Daniel Lezcano @ 2020-03-29 22:03 UTC (permalink / raw)
  To: rafael, robh
  Cc: daniel.lezcano, Zhang Rui, Amit Kucheria, Rob Herring,
	Mark Rutland, open list:THERMAL,
	open list:OPEN FIRMWARE AND FLATTENED DEVICE TREE BINDINGS,
	open list

Some devices are not able to cool down by reducing their voltage /
frequency because it could be not available or the system does not
allow voltage scaling. In this configuration, it is not possible to
use this strategy and the idle injection cooling device can be used
instead.

One idle cooling device is now present for the CPU as implemented by
the combination of the idle injection framework belonging to the power
capping framework and the thermal cooling device. The missing part is
the DT binding providing a way to describe how the cooling device will
work on the system.

A first iteration was done by making the cooling device to point to
the idle state. Unfortunately it does not make sense because it would
need to duplicate the idle state description for each CPU in order to
have a different phandle and make the thermal internal framework
happy.

It was proposed to add an cooling-cells to <3>, unfortunately the
thermal framework is expecting a value of <2> as stated by the
documentation and it is not possible from the cooling device generic
code to loop this third value to the back end cooling device.

Another proposal was to add a child 'thermal-idle' node as the SCMI
does. This approach allows to have a self-contained configuration for
the idle cooling device without colliding with the cpufreq cooling
device which is based on the CPU node. In addition, it allows to have
the cpufreq cooling device and the idle cooling device to co-exist
together as showed in the example.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
---
 .../bindings/thermal/thermal-idle.yaml        | 145 ++++++++++++++++++
 1 file changed, 145 insertions(+)
 create mode 100644 Documentation/devicetree/bindings/thermal/thermal-idle.yaml

diff --git a/Documentation/devicetree/bindings/thermal/thermal-idle.yaml b/Documentation/devicetree/bindings/thermal/thermal-idle.yaml
new file mode 100644
index 000000000000..f9f59cfa3c36
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/thermal-idle.yaml
@@ -0,0 +1,145 @@
+# SPDX-License-Identifier: (GPL-2.0)
+# Copyright 2020 Linaro Ltd.
+%YAML 1.2
+---
+$id: http://devicetree.org/schemas/thermal/thermal-idle.yaml#
+$schema: http://devicetree.org/meta-schemas/core.yaml#
+
+title: Thermal idle cooling device binding
+
+maintainers:
+  - Daniel Lezcano <daniel.lezcano@linaro.org>
+
+description: |
+  The thermal idle cooling device allows the system to passively
+  mitigate the temperature on the device by injecting idle cycles,
+  forcing it to cool down.
+
+  This binding describes the thermal idle node.
+
+properties:
+   $nodename:
+     const: thermal-idle
+     description: |
+        A /thermal-idle node describes the idle cooling device properties to
+        cool down efficiently the attached thermal zone.
+
+   '#cooling-cells':
+      const: 2
+      description: |
+         Must be 2, in order to specify minimum and maximum cooling state used in
+         the cooling-maps reference. The first cell is the minimum cooling state
+         and the second cell is the maximum cooling state requested.
+
+   duration:
+      $ref: /schemas/types.yaml#/definitions/uint32
+      description: |
+         The idle duration in microsecond the device begins to cool down.
+
+   latency:
+      $ref: /schemas/types.yaml#/definitions/uint32
+      description: |
+         The exit latency constraint in microsecond for the injected
+         idle state for the device.
+
+required:
+  - '#cooling-cells'
+
+examples:
+  - |
+    #include <dt-bindings/thermal/thermal.h>
+
+    // Example: Combining idle cooling device on big CPUs with cpufreq cooling device
+    cpus {
+            #address-cells = <2>;
+            #size-cells = <0>;
+
+            /* ... */
+
+                 cpu_b0: cpu@100 {
+                         device_type = "cpu";
+                         compatible = "arm,cortex-a72";
+                         reg = <0x0 0x100>;
+                         enable-method = "psci";
+                         capacity-dmips-mhz = <1024>;
+                         dynamic-power-coefficient = <436>;
+                         #cooling-cells = <2>; /* min followed by max */
+                         cpu-idle-states = <&CPU_SLEEP &CLUSTER_SLEEP>;
+                         idle-thermal {
+                                 #cooling-cells = <2>;
+                                 duration = <10000>;
+                                 latency = <500>;
+                         };
+                };
+
+                cpu_b1: cpu@101 {
+                        device_type = "cpu";
+                        compatible = "arm,cortex-a72";
+                        reg = <0x0 0x101>;
+                        enable-method = "psci";
+                        capacity-dmips-mhz = <1024>;
+                        dynamic-power-coefficient = <436>;
+                        #cooling-cells = <2>; /* min followed by max */
+                        cpu-idle-states = <&CPU_SLEEP &CLUSTER_SLEEP>;
+                        idle-thermal {
+                                #cooling-cells = <2>;
+                                duration = <10000>;
+                                latency = <500>;
+                        };
+                 };
+
+          /* ... */
+
+    };
+
+    /* ... */
+
+    thermal_zones {
+         cpu_thermal: cpu {
+                polling-delay-passive = <100>;
+                polling-delay = <1000>;
+
+                /* ... */
+
+                trips {
+                        cpu_alert0: cpu_alert0 {
+                                    temperature = <65000>;
+                                    hysteresis = <2000>;
+                                    type = "passive";
+                        };
+
+                        cpu_alert1: cpu_alert1 {
+                                    temperature = <70000>;
+                                    hysteresis = <2000>;
+                                    type = "passive";
+                        };
+
+                        cpu_alert2: cpu_alert2 {
+                                    temperature = <75000>;
+                                    hysteresis = <2000>;
+                                    type = "passive";
+                        };
+
+                        cpu_crit: cpu_crit {
+                                    temperature = <95000>;
+                                    hysteresis = <2000>;
+                                    type = "critical";
+                        };
+                };
+
+                cooling-maps {
+                        map0 {
+                             trip = <&cpu_alert1>;
+                             cooling-device = <&{/cpus/cpu@100/idle-thermal} 0 15 >,
+                                              <&{/cpus/cpu@101/idle-thermal} 0 15>;
+                        };
+
+                        map1 {
+                             trip = <&cpu_alert2>;
+                             cooling-device =
+                                        <&cpu_b0 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>,
+                                        <&cpu_b1 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;
+                       };
+                };
+          };
+    };
-- 
2.17.1


^ permalink raw reply related	[flat|nested] 5+ messages in thread

* Re: [PATCH 2/4] dt-bindings: thermal: Add the idle cooling device
  2020-03-29 22:03 ` [PATCH 2/4] dt-bindings: thermal: Add the idle cooling device Daniel Lezcano
@ 2020-04-07 13:36   ` Daniel Lezcano
  2020-04-07 14:09   ` Amit Kucheria
  2020-04-10 16:59   ` Rob Herring
  2 siblings, 0 replies; 5+ messages in thread
From: Daniel Lezcano @ 2020-04-07 13:36 UTC (permalink / raw)
  To: rafael, robh
  Cc: Zhang Rui, Amit Kucheria, Rob Herring, Mark Rutland,
	open list:THERMAL,
	open list:OPEN FIRMWARE AND FLATTENED DEVICE TREE BINDINGS,
	open list


Hi Rob,

On 30/03/2020 00:03, Daniel Lezcano wrote:
> Some devices are not able to cool down by reducing their voltage /
> frequency because it could be not available or the system does not
> allow voltage scaling. In this configuration, it is not possible to
> use this strategy and the idle injection cooling device can be used
> instead.
> 
> One idle cooling device is now present for the CPU as implemented by
> the combination of the idle injection framework belonging to the power
> capping framework and the thermal cooling device. The missing part is
> the DT binding providing a way to describe how the cooling device will
> work on the system.
> 
> A first iteration was done by making the cooling device to point to
> the idle state. Unfortunately it does not make sense because it would
> need to duplicate the idle state description for each CPU in order to
> have a different phandle and make the thermal internal framework
> happy.
> 
> It was proposed to add an cooling-cells to <3>, unfortunately the
> thermal framework is expecting a value of <2> as stated by the
> documentation and it is not possible from the cooling device generic
> code to loop this third value to the back end cooling device.
> 
> Another proposal was to add a child 'thermal-idle' node as the SCMI
> does. This approach allows to have a self-contained configuration for
> the idle cooling device without colliding with the cpufreq cooling
> device which is based on the CPU node. In addition, it allows to have
> the cpufreq cooling device and the idle cooling device to co-exist
> together as showed in the example.

The other patches of the series are acked-by.

Do you think this patch is fine? I would like to apply the series.

Thanks

  -- Daniel


[ ... ]


-- 
<http://www.linaro.org/> Linaro.org │ Open source software for ARM SoCs

Follow Linaro:  <http://www.facebook.com/pages/Linaro> Facebook |
<http://twitter.com/#!/linaroorg> Twitter |
<http://www.linaro.org/linaro-blog/> Blog

^ permalink raw reply	[flat|nested] 5+ messages in thread

* Re: [PATCH 2/4] dt-bindings: thermal: Add the idle cooling device
  2020-03-29 22:03 ` [PATCH 2/4] dt-bindings: thermal: Add the idle cooling device Daniel Lezcano
  2020-04-07 13:36   ` Daniel Lezcano
@ 2020-04-07 14:09   ` Amit Kucheria
  2020-04-10 16:59   ` Rob Herring
  2 siblings, 0 replies; 5+ messages in thread
From: Amit Kucheria @ 2020-04-07 14:09 UTC (permalink / raw)
  To: Daniel Lezcano
  Cc: Rafael J. Wysocki, Rob Herring, Zhang Rui, Rob Herring,
	Mark Rutland, open list:THERMAL,
	open list:OPEN FIRMWARE AND FLATTENED DEVICE TREE BINDINGS,
	open list

On Mon, Mar 30, 2020 at 3:37 AM Daniel Lezcano
<daniel.lezcano@linaro.org> wrote:
>
> Some devices are not able to cool down by reducing their voltage /
> frequency because it could be not available or the system does not
> allow voltage scaling. In this configuration, it is not possible to
> use this strategy and the idle injection cooling device can be used
> instead.
>
> One idle cooling device is now present for the CPU as implemented by
> the combination of the idle injection framework belonging to the power
> capping framework and the thermal cooling device. The missing part is
> the DT binding providing a way to describe how the cooling device will
> work on the system.
>
> A first iteration was done by making the cooling device to point to
> the idle state. Unfortunately it does not make sense because it would
> need to duplicate the idle state description for each CPU in order to
> have a different phandle and make the thermal internal framework
> happy.
>
> It was proposed to add an cooling-cells to <3>, unfortunately the
> thermal framework is expecting a value of <2> as stated by the
> documentation and it is not possible from the cooling device generic
> code to loop this third value to the back end cooling device.
>
> Another proposal was to add a child 'thermal-idle' node as the SCMI
> does. This approach allows to have a self-contained configuration for
> the idle cooling device without colliding with the cpufreq cooling
> device which is based on the CPU node. In addition, it allows to have
> the cpufreq cooling device and the idle cooling device to co-exist
> together as showed in the example.

typo: shown

>
> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
> ---
>  .../bindings/thermal/thermal-idle.yaml        | 145 ++++++++++++++++++
>  1 file changed, 145 insertions(+)
>  create mode 100644 Documentation/devicetree/bindings/thermal/thermal-idle.yaml
>
> diff --git a/Documentation/devicetree/bindings/thermal/thermal-idle.yaml b/Documentation/devicetree/bindings/thermal/thermal-idle.yaml
> new file mode 100644
> index 000000000000..f9f59cfa3c36
> --- /dev/null
> +++ b/Documentation/devicetree/bindings/thermal/thermal-idle.yaml
> @@ -0,0 +1,145 @@
> +# SPDX-License-Identifier: (GPL-2.0)
> +# Copyright 2020 Linaro Ltd.
> +%YAML 1.2
> +---
> +$id: http://devicetree.org/schemas/thermal/thermal-idle.yaml#
> +$schema: http://devicetree.org/meta-schemas/core.yaml#
> +
> +title: Thermal idle cooling device binding
> +
> +maintainers:
> +  - Daniel Lezcano <daniel.lezcano@linaro.org>
> +
> +description: |
> +  The thermal idle cooling device allows the system to passively
> +  mitigate the temperature on the device by injecting idle cycles,
> +  forcing it to cool down.
> +
> +  This binding describes the thermal idle node.
> +
> +properties:
> +   $nodename:
> +     const: thermal-idle
> +     description: |
> +        A /thermal-idle node describes the idle cooling device properties to
> +        cool down efficiently the attached thermal zone.
> +
> +   '#cooling-cells':
> +      const: 2
> +      description: |
> +         Must be 2, in order to specify minimum and maximum cooling state used in
> +         the cooling-maps reference. The first cell is the minimum cooling state
> +         and the second cell is the maximum cooling state requested.
> +
> +   duration:
> +      $ref: /schemas/types.yaml#/definitions/uint32
> +      description: |
> +         The idle duration in microsecond the device begins to cool down.

s/begins to /should/?

> +
> +   latency:
> +      $ref: /schemas/types.yaml#/definitions/uint32
> +      description: |
> +         The exit latency constraint in microsecond for the injected
> +         idle state for the device.

I haven't yet checked this entire series, but what does this property
mean? Is it the latency constraint to apply when selecting an idle
state from among all the states described to cpuidle?

Shouldn't we just name the property exit-latency?

> +
> +required:
> +  - '#cooling-cells'
> +
> +examples:
> +  - |
> +    #include <dt-bindings/thermal/thermal.h>
> +
> +    // Example: Combining idle cooling device on big CPUs with cpufreq cooling device
> +    cpus {
> +            #address-cells = <2>;
> +            #size-cells = <0>;
> +
> +            /* ... */
> +
> +                 cpu_b0: cpu@100 {
> +                         device_type = "cpu";
> +                         compatible = "arm,cortex-a72";
> +                         reg = <0x0 0x100>;
> +                         enable-method = "psci";
> +                         capacity-dmips-mhz = <1024>;
> +                         dynamic-power-coefficient = <436>;
> +                         #cooling-cells = <2>; /* min followed by max */
> +                         cpu-idle-states = <&CPU_SLEEP &CLUSTER_SLEEP>;
> +                         idle-thermal {

thermal-idle?

> +                                 #cooling-cells = <2>;
> +                                 duration = <10000>;
> +                                 latency = <500>;
> +                         };
> +                };
> +
> +                cpu_b1: cpu@101 {
> +                        device_type = "cpu";
> +                        compatible = "arm,cortex-a72";
> +                        reg = <0x0 0x101>;
> +                        enable-method = "psci";
> +                        capacity-dmips-mhz = <1024>;
> +                        dynamic-power-coefficient = <436>;
> +                        #cooling-cells = <2>; /* min followed by max */
> +                        cpu-idle-states = <&CPU_SLEEP &CLUSTER_SLEEP>;
> +                        idle-thermal {

thermal-idle?

> +                                #cooling-cells = <2>;
> +                                duration = <10000>;
> +                                latency = <500>;
> +                        };
> +                 };
> +
> +          /* ... */
> +
> +    };
> +
> +    /* ... */
> +
> +    thermal_zones {
> +         cpu_thermal: cpu {
> +                polling-delay-passive = <100>;
> +                polling-delay = <1000>;
> +
> +                /* ... */
> +
> +                trips {
> +                        cpu_alert0: cpu_alert0 {
> +                                    temperature = <65000>;
> +                                    hysteresis = <2000>;
> +                                    type = "passive";
> +                        };
> +
> +                        cpu_alert1: cpu_alert1 {
> +                                    temperature = <70000>;
> +                                    hysteresis = <2000>;
> +                                    type = "passive";
> +                        };
> +
> +                        cpu_alert2: cpu_alert2 {
> +                                    temperature = <75000>;
> +                                    hysteresis = <2000>;
> +                                    type = "passive";
> +                        };
> +
> +                        cpu_crit: cpu_crit {
> +                                    temperature = <95000>;
> +                                    hysteresis = <2000>;
> +                                    type = "critical";
> +                        };
> +                };
> +
> +                cooling-maps {
> +                        map0 {
> +                             trip = <&cpu_alert1>;
> +                             cooling-device = <&{/cpus/cpu@100/idle-thermal} 0 15 >,
> +                                              <&{/cpus/cpu@101/idle-thermal} 0 15>;
> +                        };
> +
> +                        map1 {
> +                             trip = <&cpu_alert2>;
> +                             cooling-device =
> +                                        <&cpu_b0 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>,
> +                                        <&cpu_b1 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;
> +                       };
> +                };
> +          };
> +    };
> --
> 2.17.1
>

^ permalink raw reply	[flat|nested] 5+ messages in thread

* Re: [PATCH 2/4] dt-bindings: thermal: Add the idle cooling device
  2020-03-29 22:03 ` [PATCH 2/4] dt-bindings: thermal: Add the idle cooling device Daniel Lezcano
  2020-04-07 13:36   ` Daniel Lezcano
  2020-04-07 14:09   ` Amit Kucheria
@ 2020-04-10 16:59   ` Rob Herring
  2020-04-12 18:08     ` Daniel Lezcano
  2 siblings, 1 reply; 5+ messages in thread
From: Rob Herring @ 2020-04-10 16:59 UTC (permalink / raw)
  To: Daniel Lezcano
  Cc: rafael, Zhang Rui, Amit Kucheria, Mark Rutland,
	open list:THERMAL,
	open list:OPEN FIRMWARE AND FLATTENED DEVICE TREE BINDINGS,
	open list

On Mon, Mar 30, 2020 at 12:03:18AM +0200, Daniel Lezcano wrote:
> Some devices are not able to cool down by reducing their voltage /
> frequency because it could be not available or the system does not
> allow voltage scaling. In this configuration, it is not possible to
> use this strategy and the idle injection cooling device can be used
> instead.
> 
> One idle cooling device is now present for the CPU as implemented by
> the combination of the idle injection framework belonging to the power
> capping framework and the thermal cooling device. The missing part is
> the DT binding providing a way to describe how the cooling device will
> work on the system.
> 
> A first iteration was done by making the cooling device to point to
> the idle state. Unfortunately it does not make sense because it would
> need to duplicate the idle state description for each CPU in order to
> have a different phandle and make the thermal internal framework
> happy.
> 
> It was proposed to add an cooling-cells to <3>, unfortunately the
> thermal framework is expecting a value of <2> as stated by the
> documentation and it is not possible from the cooling device generic
> code to loop this third value to the back end cooling device.
> 
> Another proposal was to add a child 'thermal-idle' node as the SCMI
> does. This approach allows to have a self-contained configuration for
> the idle cooling device without colliding with the cpufreq cooling
> device which is based on the CPU node. In addition, it allows to have
> the cpufreq cooling device and the idle cooling device to co-exist
> together as showed in the example.
> 
> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
> ---
>  .../bindings/thermal/thermal-idle.yaml        | 145 ++++++++++++++++++
>  1 file changed, 145 insertions(+)
>  create mode 100644 Documentation/devicetree/bindings/thermal/thermal-idle.yaml
> 
> diff --git a/Documentation/devicetree/bindings/thermal/thermal-idle.yaml b/Documentation/devicetree/bindings/thermal/thermal-idle.yaml
> new file mode 100644
> index 000000000000..f9f59cfa3c36
> --- /dev/null
> +++ b/Documentation/devicetree/bindings/thermal/thermal-idle.yaml
> @@ -0,0 +1,145 @@
> +# SPDX-License-Identifier: (GPL-2.0)

Dual license please.

> +# Copyright 2020 Linaro Ltd.
> +%YAML 1.2
> +---
> +$id: http://devicetree.org/schemas/thermal/thermal-idle.yaml#
> +$schema: http://devicetree.org/meta-schemas/core.yaml#
> +
> +title: Thermal idle cooling device binding
> +
> +maintainers:
> +  - Daniel Lezcano <daniel.lezcano@linaro.org>
> +
> +description: |
> +  The thermal idle cooling device allows the system to passively
> +  mitigate the temperature on the device by injecting idle cycles,
> +  forcing it to cool down.
> +
> +  This binding describes the thermal idle node.
> +
> +properties:
> +   $nodename:
> +     const: thermal-idle
> +     description: |
> +        A /thermal-idle node describes the idle cooling device properties to

/thermal-idle would be at the root node.

> +        cool down efficiently the attached thermal zone.
> +
> +   '#cooling-cells':
> +      const: 2
> +      description: |
> +         Must be 2, in order to specify minimum and maximum cooling state used in
> +         the cooling-maps reference. The first cell is the minimum cooling state
> +         and the second cell is the maximum cooling state requested.
> +
> +   duration:
> +      $ref: /schemas/types.yaml#/definitions/uint32
> +      description: |
> +         The idle duration in microsecond the device begins to cool down.
> +
> +   latency:
> +      $ref: /schemas/types.yaml#/definitions/uint32
> +      description: |
> +         The exit latency constraint in microsecond for the injected
> +         idle state for the device.

Both of these should have unit suffix. And then they don't need a type 
def.

> +
> +required:
> +  - '#cooling-cells'
> +
> +examples:
> +  - |
> +    #include <dt-bindings/thermal/thermal.h>
> +
> +    // Example: Combining idle cooling device on big CPUs with cpufreq cooling device
> +    cpus {
> +            #address-cells = <2>;
> +            #size-cells = <0>;
> +
> +            /* ... */
> +
> +                 cpu_b0: cpu@100 {
> +                         device_type = "cpu";
> +                         compatible = "arm,cortex-a72";
> +                         reg = <0x0 0x100>;
> +                         enable-method = "psci";
> +                         capacity-dmips-mhz = <1024>;
> +                         dynamic-power-coefficient = <436>;
> +                         #cooling-cells = <2>; /* min followed by max */
> +                         cpu-idle-states = <&CPU_SLEEP &CLUSTER_SLEEP>;
> +                         idle-thermal {

thermal-idle...

> +                                 #cooling-cells = <2>;
> +                                 duration = <10000>;
> +                                 latency = <500>;
> +                         };
> +                };
> +
> +                cpu_b1: cpu@101 {
> +                        device_type = "cpu";
> +                        compatible = "arm,cortex-a72";
> +                        reg = <0x0 0x101>;
> +                        enable-method = "psci";
> +                        capacity-dmips-mhz = <1024>;
> +                        dynamic-power-coefficient = <436>;
> +                        #cooling-cells = <2>; /* min followed by max */
> +                        cpu-idle-states = <&CPU_SLEEP &CLUSTER_SLEEP>;
> +                        idle-thermal {
> +                                #cooling-cells = <2>;
> +                                duration = <10000>;
> +                                latency = <500>;
> +                        };
> +                 };
> +
> +          /* ... */
> +
> +    };
> +
> +    /* ... */
> +
> +    thermal_zones {
> +         cpu_thermal: cpu {
> +                polling-delay-passive = <100>;
> +                polling-delay = <1000>;
> +
> +                /* ... */
> +
> +                trips {
> +                        cpu_alert0: cpu_alert0 {
> +                                    temperature = <65000>;
> +                                    hysteresis = <2000>;
> +                                    type = "passive";
> +                        };
> +
> +                        cpu_alert1: cpu_alert1 {
> +                                    temperature = <70000>;
> +                                    hysteresis = <2000>;
> +                                    type = "passive";
> +                        };
> +
> +                        cpu_alert2: cpu_alert2 {
> +                                    temperature = <75000>;
> +                                    hysteresis = <2000>;
> +                                    type = "passive";
> +                        };
> +
> +                        cpu_crit: cpu_crit {
> +                                    temperature = <95000>;
> +                                    hysteresis = <2000>;
> +                                    type = "critical";
> +                        };
> +                };
> +
> +                cooling-maps {
> +                        map0 {
> +                             trip = <&cpu_alert1>;
> +                             cooling-device = <&{/cpus/cpu@100/idle-thermal} 0 15 >,
> +                                              <&{/cpus/cpu@101/idle-thermal} 0 15>;
> +                        };
> +
> +                        map1 {
> +                             trip = <&cpu_alert2>;
> +                             cooling-device =
> +                                        <&cpu_b0 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>,
> +                                        <&cpu_b1 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;
> +                       };
> +                };
> +          };
> +    };
> -- 
> 2.17.1
> 

^ permalink raw reply	[flat|nested] 5+ messages in thread

* Re: [PATCH 2/4] dt-bindings: thermal: Add the idle cooling device
  2020-04-10 16:59   ` Rob Herring
@ 2020-04-12 18:08     ` Daniel Lezcano
  0 siblings, 0 replies; 5+ messages in thread
From: Daniel Lezcano @ 2020-04-12 18:08 UTC (permalink / raw)
  To: Rob Herring
  Cc: rafael, Zhang Rui, Amit Kucheria, Mark Rutland,
	open list:THERMAL,
	open list:OPEN FIRMWARE AND FLATTENED DEVICE TREE BINDINGS,
	open list


Hi Rob,

thanks for the review.

On 10/04/2020 18:59, Rob Herring wrote:
> On Mon, Mar 30, 2020 at 12:03:18AM +0200, Daniel Lezcano wrote:

[ ... ]

>> +   '#cooling-cells':
>> +      const: 2
>> +      description: |
>> +         Must be 2, in order to specify minimum and maximum cooling state used in
>> +         the cooling-maps reference. The first cell is the minimum cooling state
>> +         and the second cell is the maximum cooling state requested.
>> +
>> +   duration:
>> +      $ref: /schemas/types.yaml#/definitions/uint32
>> +      description: |
>> +         The idle duration in microsecond the device begins to cool down.
>> +
>> +   latency:
>> +      $ref: /schemas/types.yaml#/definitions/uint32
>> +      description: |
>> +         The exit latency constraint in microsecond for the injected
>> +         idle state for the device.
> 
> Both of these should have unit suffix. And then they don't need a type 
> def.

Do you mean I should remove the $ref:
/schemas/types.yaml#/definitions/uint32 and change the name to
duration_us and latency_us ?

[ ... ]


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^ permalink raw reply	[flat|nested] 5+ messages in thread

end of thread, other threads:[~2020-04-12 18:15 UTC | newest]

Thread overview: 5+ messages (download: mbox.gz / follow: Atom feed)
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2020-03-29 22:03 ` [PATCH 2/4] dt-bindings: thermal: Add the idle cooling device Daniel Lezcano
2020-04-07 13:36   ` Daniel Lezcano
2020-04-07 14:09   ` Amit Kucheria
2020-04-10 16:59   ` Rob Herring
2020-04-12 18:08     ` Daniel Lezcano

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