From: Rob Herring <robh@kernel.org>
To: Daniel Lezcano <daniel.lezcano@linaro.org>
Cc: daniel.lezcano@linaro.org, rui.zhang@intel.com,
amit.kucheria@verdurent.com, Mark Rutland <mark.rutland@arm.com>,
"open list:THERMAL" <linux-pm@vger.kernel.org>,
"open list:OPEN FIRMWARE AND FLATTENED DEVICE TREE BINDINGS"
<devicetree@vger.kernel.org>,
open list <linux-kernel@vger.kernel.org>
Subject: Re: [PATCH v3 2/4] dt-bindings: thermal: Add the idle cooling device
Date: Mon, 20 Apr 2020 16:14:48 -0500 [thread overview]
Message-ID: <20200420211448.GA16458@bogus> (raw)
In-Reply-To: <20200414220837.9284-2-daniel.lezcano@linaro.org>
On Wed, 15 Apr 2020 00:08:31 +0200, Daniel Lezcano wrote:
> Some devices are not able to cool down by reducing their voltage /
> frequency because it could be not available or the system does not
> allow voltage scaling. In this configuration, it is not possible to
> use this strategy and the idle injection cooling device can be used
> instead.
>
> One idle cooling device is now present for the CPU as implemented by
> the combination of the idle injection framework belonging to the power
> capping framework and the thermal cooling device. The missing part is
> the DT binding providing a way to describe how the cooling device will
> work on the system.
>
> A first iteration was done by making the cooling device to point to
> the idle state. Unfortunately it does not make sense because it would
> need to duplicate the idle state description for each CPU in order to
> have a different phandle and make the thermal internal framework
> happy.
>
> It was proposed to add an cooling-cells to <3>, unfortunately the
> thermal framework is expecting a value of <2> as stated by the
> documentation and it is not possible from the cooling device generic
> code to loop this third value to the back end cooling device.
>
> Another proposal was to add a child 'thermal-idle' node as the SCMI
> does. This approach allows to have a self-contained configuration for
> the idle cooling device without colliding with the cpufreq cooling
> device which is based on the CPU node. In addition, it allows to have
> the cpufreq cooling device and the idle cooling device to co-exist
> together as shown in the example.
>
> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
> ---
> - V3:
> - Removed extra line with tab inside
> - V2:
> - Fixed comment type
> - Added dual license
> - Fixed description s/begins to/should/
> - Changed name s/duration/duration-us/
> - Changed name s/latency/exit-latency-us/
> - Removed types for latency / duration
> - Fixed s/idle-thermal/thermal-idle/
> ---
> .../bindings/thermal/thermal-idle.yaml | 145 ++++++++++++++++++
> 1 file changed, 145 insertions(+)
> create mode 100644 Documentation/devicetree/bindings/thermal/thermal-idle.yaml
>
Reviewed-by: Rob Herring <robh@kernel.org>
prev parent reply other threads:[~2020-04-20 21:14 UTC|newest]
Thread overview: 2+ messages / expand[flat|nested] mbox.gz Atom feed top
[not found] <20200414220837.9284-1-daniel.lezcano@linaro.org>
2020-04-14 22:08 ` [PATCH v3 2/4] dt-bindings: thermal: Add the idle cooling device Daniel Lezcano
2020-04-20 21:14 ` Rob Herring [this message]
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