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Subject: Re: [linux-sunxi] Re: [PATCH v3 27/30] ARM: dts: sun8i: h3: use calibration for ths
To: maxime.ripard@bootlin.com,
        Maxime Ripard <maxime.ripard@bootlin.com>,
        Philipp Rossak <embed3d@gmail.com>
CC: Emmanuel Vadot <manu@bidouilliste.com>, lee.jones@linaro.org,
        robh+dt@kernel.org, mark.rutland@arm.com, wens@csie.org,
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From: Icenowy Zheng <icenowy@aosc.io>
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于 2018年9月6日 GMT+08:00 下午7:51:15, Maxime Ripard <maxime.ripard@bootlin.com> 写到:
>On Thu, Sep 06, 2018 at 01:47:47PM +0200, Philipp Rossak wrote:
>> On 04.09.2018 18:46, Emmanuel Vadot wrote:
>> > > +			/* Data cells */
>> > > +			thermal_calibration: calib@234 {
>> > > +				reg = <0x234 0x8>;
>> > > +			};
>> >   You are declaring 8 bytes of calibration data but to my knowledge
>it's
>> > only 2 bytes per sensor, so 2 bytes for H3.
>> >   Am I missing something ?
>> > 
>> >   Thanks,
>> 
>> Emmanuel you are right, it is 2 bytes per Sensor and should be 2
>bytes for
>> H3, but the thermal calibration data field is on all chips 64 bit
>wide - so
>> 8 bytes. So I'm reading here the complete calibration data field.
>
>Having one cell per channel would make more sense I guess.

I have mentioned that this is impossible because of wrong
addressing caused by LE2BE in SID driver.

>
>Maxime