From: Daniel Lezcano <daniel.lezcano@linaro.org>
To: lukasz.luba@arm.com, linux-kernel@vger.kernel.org,
rui.zhang@intel.com, linux-pm@vger.kernel.org,
linux-doc@vger.kernel.org
Cc: amit.kucheria@verdurent.com, corbet@lwn.net, dietmar.eggemann@arm.com
Subject: Re: [PATCH 0/3] Thermal extensions for flexibility in cooling device bindings
Date: Fri, 13 Mar 2020 14:33:00 +0100 [thread overview]
Message-ID: <11b6ccb2-ddd8-39cf-a3c8-4dd53e7e50d8@linaro.org> (raw)
In-Reply-To: <20191216140622.25467-1-lukasz.luba@arm.com>
Hi Lukasz,
On 16/12/2019 15:06, lukasz.luba@arm.com wrote:
> From: Lukasz Luba <lukasz.luba@arm.com>
>
> Hi all,
>
> This patch set adds extensions to existing thermal zones and cooling devices
> binding. Currently they are pinned using static definitions e.g. DT cooling
> maps. These changes enable userspace like trusted middleware to change the
> layout of cooling maps unbinding and binding the cooling devices.
> It might be helpful for drivers loaded as a modules. They can be added to
> existing thermal zones to take part of the power split.
> It is based on the current work in thermal branch thermal/linux-next
> https://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux.git/log/?h=thermal/linux-next
I've been keeping this series out of the previous merge because it did
not raise any comments and we are touching the sysfs.
For this release, I still don't know what to do with it.
Anyone a comment on this series? Rui ?
> Lukasz Luba (3):
> docs: thermal: Add bind, unbind information together with trip point
> thermal: Make cooling device trip point writable from sysfs
> thermal: Add sysfs binding for cooling device and thermal zone
>
> .../driver-api/thermal/sysfs-api.rst | 30 +++++++-
> drivers/thermal/thermal_core.c | 3 +-
> drivers/thermal/thermal_core.h | 2 +
> drivers/thermal/thermal_sysfs.c | 77 +++++++++++++++++++
> 4 files changed, 109 insertions(+), 3 deletions(-)
>
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next prev parent reply other threads:[~2020-03-13 13:33 UTC|newest]
Thread overview: 6+ messages / expand[flat|nested] mbox.gz Atom feed top
2019-12-16 14:06 [PATCH 0/3] Thermal extensions for flexibility in cooling device bindings lukasz.luba
2019-12-16 14:06 ` [PATCH 1/3] docs: thermal: Add bind, unbind information together with trip point lukasz.luba
2019-12-16 14:06 ` [PATCH 2/3] thermal: Make cooling device trip point writable from sysfs lukasz.luba
2019-12-16 14:06 ` [PATCH 3/3] thermal: Add sysfs binding for cooling device and thermal zone lukasz.luba
2020-03-13 13:33 ` Daniel Lezcano [this message]
2020-03-13 15:28 ` [PATCH 0/3] Thermal extensions for flexibility in cooling device bindings Lukasz Luba
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