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* [PATCH v2 0/4] thermal: k3: Add support for bandgap sensors
@ 2020-02-14  6:34 Keerthy
  2020-02-14  6:34 ` [PATCH v2 1/4] dt-bindings: thermal: k3: Add VTM bindings documentation Keerthy
                   ` (3 more replies)
  0 siblings, 4 replies; 9+ messages in thread
From: Keerthy @ 2020-02-14  6:34 UTC (permalink / raw)
  To: rui.zhang, robh+dt, daniel.lezcano
  Cc: j-keerthy, amit.kucheria, t-kristo, devicetree, linux-kernel,
	linux-arm-kernel, linux-pm, mark.rutland

Add VTM thermal support. In the Voltage Thermal
Management Module(VTM), K3 AM654 supplies a voltage
reference and a temperature sensor feature that are gathered in the band
gap voltage and temperature sensor (VBGAPTS) module. The band
gap provides current and voltage reference for its internal
circuits and other analog IP blocks. The analog-to-digital
converter (ADC) produces an output value that is proportional
to the silicon temperature.

Add support for bandgap sensors. Currently reading temperatures
and trend computing is supported. 

Changes in v2:

  * Fixed yaml errors
  * renamed am654-industrial-thermal.dtsi to k3-am654-industrial-thermal.dtsi
    to follow the convention for k3 family.

Keerthy (4):
  dt-bindings: thermal: k3: Add VTM bindings documentation
  thermal: k3: Add support for bandgap sensors
  arm64: dts: ti: am654: Add thermal zones
  arm64: dts: ti: am6: Add VTM node

 .../bindings/thermal/ti,am654-thermal.yaml    |  57 +++
 arch/arm64/boot/dts/ti/k3-am65-wakeup.dtsi    |  11 +
 .../dts/ti/k3-am654-industrial-thermal.dtsi   |  45 +++
 drivers/thermal/Kconfig                       |  12 +
 drivers/thermal/Makefile                      |   1 +
 drivers/thermal/k3_bandgap.c                  | 342 ++++++++++++++++++
 6 files changed, 468 insertions(+)
 create mode 100644 Documentation/devicetree/bindings/thermal/ti,am654-thermal.yaml
 create mode 100644 arch/arm64/boot/dts/ti/k3-am654-industrial-thermal.dtsi
 create mode 100644 drivers/thermal/k3_bandgap.c

-- 
2.17.1


^ permalink raw reply	[flat|nested] 9+ messages in thread

* [PATCH v2 1/4] dt-bindings: thermal: k3: Add VTM bindings documentation
  2020-02-14  6:34 [PATCH v2 0/4] thermal: k3: Add support for bandgap sensors Keerthy
@ 2020-02-14  6:34 ` Keerthy
  2020-02-18 20:20   ` Rob Herring
  2020-02-14  6:34 ` [PATCH v2 2/4] thermal: k3: Add support for bandgap sensors Keerthy
                   ` (2 subsequent siblings)
  3 siblings, 1 reply; 9+ messages in thread
From: Keerthy @ 2020-02-14  6:34 UTC (permalink / raw)
  To: rui.zhang, robh+dt, daniel.lezcano
  Cc: j-keerthy, amit.kucheria, t-kristo, devicetree, linux-kernel,
	linux-arm-kernel, linux-pm, mark.rutland

Add VTM bindings documentation. In the Voltage Thermal
Management Module(VTM), K3 AM654 supplies a voltage
reference and a temperature sensor feature that are gathered in the band
gap voltage and temperature sensor (VBGAPTS) module. The band
gap provides current and voltage reference for its internal
circuits and other analog IP blocks. The analog-to-digital
converter (ADC) produces an output value that is proportional
to the silicon temperature.

Signed-off-by: Keerthy <j-keerthy@ti.com>
---

Changes in v2:

  * Fixed make dt_binding_check errors.

 .../bindings/thermal/ti,am654-thermal.yaml    | 57 +++++++++++++++++++
 1 file changed, 57 insertions(+)
 create mode 100644 Documentation/devicetree/bindings/thermal/ti,am654-thermal.yaml

diff --git a/Documentation/devicetree/bindings/thermal/ti,am654-thermal.yaml b/Documentation/devicetree/bindings/thermal/ti,am654-thermal.yaml
new file mode 100644
index 000000000000..1c26ad8cd505
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/ti,am654-thermal.yaml
@@ -0,0 +1,57 @@
+# SPDX-License-Identifier: (GPL-2.0-only OR BSD-2-Clause)
+%YAML 1.2
+---
+$id: http://devicetree.org/schemas/thermal/ti,am654-thermal.yaml#
+$schema: http://devicetree.org/meta-schemas/core.yaml#
+
+title: Texas Instruments AM654 VTM (DTS) binding
+
+maintainers:
+  - Keerthy <j-keerthy@ti.com>
+
+properties:
+  compatible:
+    const: ti,am654-vtm
+
+  reg:
+    maxItems: 1
+
+  power-domains:
+    maxItems: 1
+    description: phandle to the associated power domain
+
+  "#thermal-sensor-cells":
+    const: 1
+
+required:
+  - "#thermal-sensor-cells"
+  - compatible
+  - reg
+  - power-domains
+
+additionalProperties: false
+
+examples:
+  - |
+
+    vtm: wkup_vtm0@42050000 {
+        compatible = "ti,am654-vtm";
+        reg = <0x0 0x42050000 0x0 0x25c>;
+        power-domains = <&k3_pds 80 TI_SCI_PD_EXCLUSIVE>;
+        #thermal-sensor-cells = <1>;
+    };
+
+    mpu0_thermal: mpu0_thermal {
+        polling-delay-passive = <250>; /* milliseconds */
+        polling-delay = <500>; /* milliseconds */
+        thermal-sensors = <&wkup_vtm0 0>;
+
+        trips {
+                mpu0_crit: mpu0_crit {
+                        temperature = <125000>; /* milliCelsius */
+                        hysteresis = <2000>; /* milliCelsius */
+                        type = "critical";
+                };
+        };
+    };
+...
-- 
2.17.1


^ permalink raw reply	[flat|nested] 9+ messages in thread

* [PATCH v2 2/4] thermal: k3: Add support for bandgap sensors
  2020-02-14  6:34 [PATCH v2 0/4] thermal: k3: Add support for bandgap sensors Keerthy
  2020-02-14  6:34 ` [PATCH v2 1/4] dt-bindings: thermal: k3: Add VTM bindings documentation Keerthy
@ 2020-02-14  6:34 ` Keerthy
  2020-02-14  6:34 ` [PATCH v2 3/4] arm64: dts: ti: am654: Add thermal zones Keerthy
  2020-02-14  6:34 ` [PATCH v2 4/4] arm64: dts: ti: am6: Add VTM node Keerthy
  3 siblings, 0 replies; 9+ messages in thread
From: Keerthy @ 2020-02-14  6:34 UTC (permalink / raw)
  To: rui.zhang, robh+dt, daniel.lezcano
  Cc: j-keerthy, amit.kucheria, t-kristo, devicetree, linux-kernel,
	linux-arm-kernel, linux-pm, mark.rutland

The bandgap provides current and voltage reference for its internal
circuits and other analog IP blocks. The analog-to-digital
converter (ADC) produces an output value that is proportional
to the silicon temperature.

Currently reading temperatures and trend computing is supported
as there are no active/passive cooling agent supported.

Signed-off-by: Keerthy <j-keerthy@ti.com>
---
 drivers/thermal/Kconfig      |  12 ++
 drivers/thermal/Makefile     |   1 +
 drivers/thermal/k3_bandgap.c | 342 +++++++++++++++++++++++++++++++++++
 3 files changed, 355 insertions(+)
 create mode 100644 drivers/thermal/k3_bandgap.c

diff --git a/drivers/thermal/Kconfig b/drivers/thermal/Kconfig
index 5a05db5438d6..fa598eddc7ac 100644
--- a/drivers/thermal/Kconfig
+++ b/drivers/thermal/Kconfig
@@ -251,6 +251,18 @@ config IMX_THERMAL
 	  cpufreq is used as the cooling device to throttle CPUs when the
 	  passive trip is crossed.
 
+config K3_THERMAL
+	bool "Texas Instruments K3 thermal support"
+	depends on THERMAL
+	depends on ARCH_K3 || COMPILE_TEST
+	help
+	  If you say yes here you get thermal support for the Texas Instruments
+	  K3 SoC family. The current chip supported is:
+	   - AM654
+
+	  This includes temperature reading functionality and also trend
+	  computation.
+
 config MAX77620_THERMAL
 	tristate "Temperature sensor driver for Maxim MAX77620 PMIC"
 	depends on MFD_MAX77620
diff --git a/drivers/thermal/Makefile b/drivers/thermal/Makefile
index 9fb88e26fb10..5ad6535139ae 100644
--- a/drivers/thermal/Makefile
+++ b/drivers/thermal/Makefile
@@ -28,6 +28,7 @@ thermal_sys-$(CONFIG_CLOCK_THERMAL)	+= clock_cooling.o
 # devfreq cooling
 thermal_sys-$(CONFIG_DEVFREQ_THERMAL) += devfreq_cooling.o
 
+obj-$(CONFIG_K3_THERMAL)	+= k3_bandgap.o
 # platform thermal drivers
 obj-y				+= broadcom/
 obj-$(CONFIG_THERMAL_MMIO)		+= thermal_mmio.o
diff --git a/drivers/thermal/k3_bandgap.c b/drivers/thermal/k3_bandgap.c
new file mode 100644
index 000000000000..35d904eb9857
--- /dev/null
+++ b/drivers/thermal/k3_bandgap.c
@@ -0,0 +1,342 @@
+// SPDX-License-Identifier: GPL-2.0
+/*
+ * TI Bandgap temperature sensor driver for K3 SoC Family
+ *
+ * Copyright (C) 2020 Texas Instruments Incorporated - http://www.ti.com/
+ */
+
+#include <linux/module.h>
+#include <linux/init.h>
+#include <linux/kernel.h>
+#include <linux/pm_runtime.h>
+#include <linux/err.h>
+#include <linux/types.h>
+#include <linux/spinlock.h>
+#include <linux/of_platform.h>
+#include <linux/io.h>
+#include <linux/workqueue.h>
+#include <linux/thermal.h>
+#include <linux/of.h>
+
+#define K3_VTM_DEVINFO_PWR0_OFFSET		0x4
+#define K3_VTM_DEVINFO_PWR0_CVD_CT_MASK	0xf
+#define K3_VTM_DEVINFO_PWR0_TEMPSENS_CT_MASK	0xf0
+#define K3_VTM_TMPSENS0_CTRL_OFFSET	0x80
+#define K3_VTM_REGS_PER_TS			0x10
+#define K3_VTM_TS_STAT_DTEMP_MASK	0x3ff
+#define K3_VTM_MAX_NUM_TS		8
+#define K3_VTM_TMPSENS_CTRL_CBIASSEL	BIT(0)
+#define K3_VTM_TMPSENS_CTRL_SOC		BIT(5)
+#define K3_VTM_TMPSENS_CTRL_CLRZ		BIT(6)
+#define K3_VTM_TMPSENS_CTRL_CLKON_REQ	BIT(7)
+
+#define K3_VTM_ADC_BEGIN_VAL		540
+#define K3_VTM_ADC_END_VAL		944
+
+static const int k3_adc_to_temp[K3_VTM_ADC_END_VAL - K3_VTM_ADC_BEGIN_VAL
+				+ 1] = {
+	-40000, -40000, -40000, -40000, -39800, -39400, -39000, -38600, -38200,
+	-37800, -37400, -37000, -36600, -36200, -35800, -35300, -34700, -34200,
+	-33800, -33400, -33000, -32600, -32200, -31800, -31400, -31000, -30600,
+	-30200, -29800, -29400, -29000, -28600, -28200, -27700, -27100, -26600,
+	-26200, -25800, -25400, -25000, -24600, -24200, -23800, -23400, -23000,
+	-22600, -22200, -21800, -21400, -21000, -20500, -19900, -19400, -19000,
+	-18600, -18200, -17800, -17400, -17000, -16600, -16200, -15800, -15400,
+	-15000, -14600, -14200, -13800, -13400, -13000, -12500, -11900, -11400,
+	-11000, -10600, -10200, -9800, -9400, -9000, -8600, -8200, -7800, -7400,
+	-7000, -6600, -6200, -5800, -5400, -5000, -4500, -3900, -3400, -3000,
+	-2600, -2200, -1800, -1400, -1000, -600, -200, 200, 600, 1000, 1400,
+	1800, 2200, 2600, 3000, 3400, 3900, 4500, 5000, 5400, 5800, 6200, 6600,
+	7000, 7400, 7800, 8200, 8600, 9000, 9400, 9800, 10200, 10600, 11000,
+	11400, 11800, 12200, 12700, 13300, 13800, 14200, 14600, 15000, 15400,
+	15800, 16200, 16600, 17000, 17400, 17800, 18200, 18600, 19000, 19400,
+	19800, 20200, 20600, 21000, 21400, 21900, 22500, 23000, 23400, 23800,
+	24200, 24600, 25000, 25400, 25800, 26200, 26600, 27000, 27400, 27800,
+	28200, 28600, 29000, 29400, 29800, 30200, 30600, 31000, 31400, 31900,
+	32500, 33000, 33400, 33800, 34200, 34600, 35000, 35400, 35800, 36200,
+	36600, 37000, 37400, 37800, 38200, 38600, 39000, 39400, 39800, 40200,
+	40600, 41000, 41400, 41800, 42200, 42600, 43100, 43700, 44200, 44600,
+	45000, 45400, 45800, 46200, 46600, 47000, 47400, 47800, 48200, 48600,
+	49000, 49400, 49800, 50200, 50600, 51000, 51400, 51800, 52200, 52600,
+	53000, 53400, 53800, 54200, 54600, 55000, 55400, 55900, 56500, 57000,
+	57400, 57800, 58200, 58600, 59000, 59400, 59800, 60200, 60600, 61000,
+	61400, 61800, 62200, 62600, 63000, 63400, 63800, 64200, 64600, 65000,
+	65400, 65800, 66200, 66600, 67000, 67400, 67800, 68200, 68600, 69000,
+	69400, 69800, 70200, 70600, 71000, 71500, 72100, 72600, 73000, 73400,
+	73800, 74200, 74600, 75000, 75400, 75800, 76200, 76600, 77000, 77400,
+	77800, 78200, 78600, 79000, 79400, 79800, 80200, 80600, 81000, 81400,
+	81800, 82200, 82600, 83000, 83400, 83800, 84200, 84600, 85000, 85400,
+	85800, 86200, 86600, 87000, 87400, 87800, 88200, 88600, 89000, 89400,
+	89800, 90200, 90600, 91000, 91400, 91800, 92200, 92600, 93000, 93400,
+	93800, 94200, 94600, 95000, 95400, 95800, 96200, 96600, 97000, 97500,
+	98100, 98600, 99000, 99400, 99800, 100200, 100600, 101000, 101400,
+	101800, 102200, 102600, 103000, 103400, 103800, 104200, 104600, 105000,
+	105400, 105800, 106200, 106600, 107000, 107400, 107800, 108200, 108600,
+	109000, 109400, 109800, 110200, 110600, 111000, 111400, 111800, 112200,
+	112600, 113000, 113400, 113800, 114200, 114600, 115000, 115400, 115800,
+	116200, 116600, 117000, 117400, 117800, 118200, 118600, 119000, 119400,
+	119800, 120200, 120600, 121000, 121400, 121800, 122200, 122600, 123000,
+	123400, 123800, 124200, 124600, 124900, 125000,
+};
+
+struct k3_thermal_data;
+
+struct k3_bandgap {
+	struct device *dev;
+	void __iomem *base;
+	const struct k3_bandgap_data *conf;
+	spinlock_t lock; /* shields this struct */
+	int ts_cnt;
+	u32 errata;
+	struct k3_thermal_data *ts_data[K3_VTM_MAX_NUM_TS];
+};
+
+struct k3_vtm_driver_data {
+	u32 errata;
+};
+
+/* common data structures */
+struct k3_thermal_data {
+	struct thermal_zone_device *ti_thermal;
+	struct thermal_cooling_device *cool_dev;
+	struct k3_bandgap *bgp;
+	enum thermal_device_mode mode;
+	struct work_struct thermal_wq;
+	int sensor_id;
+	u32 ctrl_offset;
+	u32 stat_offset;
+	int prev_temp;
+};
+
+static unsigned int vtm_get_best_value(unsigned int s0, unsigned int s1,
+				       unsigned int s2)
+{
+	int d01 = abs(s0 - s1);
+	int d02 = abs(s0 - s2);
+	int d12 = abs(s1 - s2);
+
+	if (d01 <= d02 && d01 <= d12)
+		return (s0 + s1) / 2;
+
+	if (d02 <= d01 && d02 <= d12)
+		return (s0 + s2) / 2;
+
+	return (s1 + s2) / 2;
+}
+
+static int k3_bgp_read_temp(struct k3_thermal_data *devdata,
+			    int *temp)
+{
+	struct k3_bandgap *bgp;
+	unsigned int dtemp, s0, s1, s2;
+
+	bgp = devdata->bgp;
+	/**
+	 * Errata is applicable for am654 pg 1.0 silicon. There
+	 * is a variation of the order for 8-10 degree centigrade.
+	 * Work around that by getting the average of two closest
+	 * readings out of three readings everytime we want to
+	 * report temperatures.
+	 *
+	 * Errata workaround.
+	 */
+
+	if (bgp->errata) {
+		s0 = readl(bgp->base + devdata->stat_offset) &
+			K3_VTM_TS_STAT_DTEMP_MASK;
+		s1 = readl(bgp->base + devdata->stat_offset) &
+			K3_VTM_TS_STAT_DTEMP_MASK;
+		s2 = readl(bgp->base + devdata->stat_offset) &
+			K3_VTM_TS_STAT_DTEMP_MASK;
+		dtemp = vtm_get_best_value(s0, s1, s2);
+	} else {
+		dtemp = readl(bgp->base + devdata->stat_offset) &
+				K3_VTM_TS_STAT_DTEMP_MASK;
+	}
+
+	if (dtemp < K3_VTM_ADC_BEGIN_VAL || dtemp > K3_VTM_ADC_END_VAL)
+		return -EINVAL;
+
+	*temp = k3_adc_to_temp[dtemp - K3_VTM_ADC_BEGIN_VAL];
+
+	return 0;
+}
+
+/* thermal zone ops */
+/* Get temperature callback function for thermal zone */
+static int k3_thermal_get_temp(void *devdata, int *temp)
+{
+	struct k3_thermal_data *data = devdata;
+	int ret = 0;
+
+	ret = k3_bgp_read_temp(data, temp);
+	if (ret)
+		return ret;
+
+	data->prev_temp = *temp;
+
+	return ret;
+}
+
+static int k3_thermal_get_trend(void *p, int trip, enum thermal_trend *trend)
+{
+	struct k3_thermal_data *data = p;
+	struct k3_bandgap *bgp;
+	int ret = 0, temp = 0;
+
+	bgp = data->bgp;
+
+	ret = k3_bgp_read_temp(data, &temp);
+	if (ret)
+		return ret;
+
+	if (temp > data->prev_temp)
+		*trend = THERMAL_TREND_RAISING;
+	else if (temp < data->prev_temp)
+		*trend = THERMAL_TREND_DROPPING;
+	else
+		*trend = THERMAL_TREND_STABLE;
+
+	return 0;
+}
+
+static const struct thermal_zone_of_device_ops k3_of_thermal_ops = {
+	.get_temp = k3_thermal_get_temp,
+	.get_trend = k3_thermal_get_trend,
+};
+
+static void k3_thermal_work(struct work_struct *work)
+{
+	struct k3_thermal_data *data = container_of(work,
+					struct k3_thermal_data, thermal_wq);
+
+	thermal_zone_device_update(data->ti_thermal, THERMAL_EVENT_UNSPECIFIED);
+
+	dev_dbg(&data->ti_thermal->device, "updated thermal zone %s\n",
+		data->ti_thermal->type);
+}
+
+static const struct of_device_id of_k3_bandgap_match[];
+
+static int k3_bandgap_probe(struct platform_device *pdev)
+{
+	int ret = 0, cnt, val, id, reg_cnt = 0;
+	struct resource *res;
+	struct device *dev = &pdev->dev;
+	struct k3_bandgap *bgp;
+	struct k3_thermal_data *data;
+	const struct k3_vtm_driver_data *drv_data;
+
+	bgp = devm_kzalloc(&pdev->dev, sizeof(*bgp), GFP_KERNEL);
+	if (!bgp)
+		return -ENOMEM;
+
+	drv_data = of_device_get_match_data(&pdev->dev);
+	if (drv_data)
+		bgp->errata = drv_data->errata;
+
+	bgp->dev = dev;
+	res = platform_get_resource(pdev, IORESOURCE_MEM, 0);
+	bgp->base = devm_ioremap_resource(dev, res);
+	if (IS_ERR(bgp->base))
+		return PTR_ERR(bgp->base);
+
+	pm_runtime_enable(dev);
+	ret = pm_runtime_get_sync(dev);
+	if (ret < 0) {
+		pm_runtime_put_noidle(dev);
+		pm_runtime_disable(dev);
+		return ret;
+	}
+
+	/* Get the sensor count in the VTM */
+	val = readl(bgp->base + K3_VTM_DEVINFO_PWR0_OFFSET);
+	cnt = val & K3_VTM_DEVINFO_PWR0_TEMPSENS_CT_MASK;
+	cnt >>= __ffs(K3_VTM_DEVINFO_PWR0_TEMPSENS_CT_MASK);
+	bgp->ts_cnt = cnt;
+
+	data = devm_kcalloc(bgp->dev, cnt, sizeof(*data), GFP_KERNEL);
+	if (!data) {
+		ret = -ENOMEM;
+		goto err_alloc;
+	}
+
+	/* Register the thermal sensors */
+	for (id = 0; id < cnt; id++) {
+		data[id].sensor_id = id;
+		data[id].bgp = bgp;
+		data[id].ctrl_offset = K3_VTM_TMPSENS0_CTRL_OFFSET +
+					id * K3_VTM_REGS_PER_TS;
+		data[id].stat_offset = data[id].ctrl_offset + 0x8;
+		INIT_WORK(&data[id].thermal_wq, k3_thermal_work);
+
+		val = readl(data[id].bgp->base + data[id].ctrl_offset);
+		val |= (K3_VTM_TMPSENS_CTRL_SOC |
+			K3_VTM_TMPSENS_CTRL_CLRZ |
+			K3_VTM_TMPSENS_CTRL_CLKON_REQ);
+		val &= ~K3_VTM_TMPSENS_CTRL_CBIASSEL;
+		writel(val, data[id].bgp->base + data[id].ctrl_offset);
+
+		bgp->ts_data[id] = &data[id];
+		data[id].ti_thermal =
+		devm_thermal_zone_of_sensor_register(bgp->dev, id,
+						     &data[id],
+						     &k3_of_thermal_ops);
+		if (IS_ERR(data[id].ti_thermal)) {
+			dev_err(bgp->dev, "thermal zone device is NULL\n");
+			ret = PTR_ERR(data[id].ti_thermal);
+			goto err_alloc;
+		}
+
+		reg_cnt++;
+
+		/* Initialize Previous temp */
+		k3_thermal_get_temp(&data[id], &data[id].prev_temp);
+	}
+
+	platform_set_drvdata(pdev, bgp);
+
+	return 0;
+
+err_alloc:
+	pm_runtime_put_sync(&pdev->dev);
+	pm_runtime_disable(&pdev->dev);
+
+	return ret;
+}
+
+static int k3_bandgap_remove(struct platform_device *pdev)
+{
+	pm_runtime_put_sync(&pdev->dev);
+	pm_runtime_disable(&pdev->dev);
+
+	return 0;
+}
+
+static const struct k3_vtm_driver_data am654_data = {
+	.errata = 1,
+};
+
+static const struct of_device_id of_k3_bandgap_match[] = {
+	{
+		.compatible = "ti,am654-vtm",
+		.data = &am654_data,
+	},
+	{ /* sentinel */ },
+};
+MODULE_DEVICE_TABLE(of, of_k3_bandgap_match);
+
+static struct platform_driver k3_bandgap_sensor_driver = {
+	.probe = k3_bandgap_probe,
+	.remove = k3_bandgap_remove,
+	.driver = {
+		.name = "k3-soc-thermal",
+		.of_match_table	= of_k3_bandgap_match,
+	},
+};
+
+module_platform_driver(k3_bandgap_sensor_driver);
+
+MODULE_DESCRIPTION("K3 bandgap temperature sensor driver");
+MODULE_LICENSE("GPL v2");
+MODULE_AUTHOR("J Keerthy <j-keerthy@ti.com>");
-- 
2.17.1


^ permalink raw reply	[flat|nested] 9+ messages in thread

* [PATCH v2 3/4] arm64: dts: ti: am654: Add thermal zones
  2020-02-14  6:34 [PATCH v2 0/4] thermal: k3: Add support for bandgap sensors Keerthy
  2020-02-14  6:34 ` [PATCH v2 1/4] dt-bindings: thermal: k3: Add VTM bindings documentation Keerthy
  2020-02-14  6:34 ` [PATCH v2 2/4] thermal: k3: Add support for bandgap sensors Keerthy
@ 2020-02-14  6:34 ` Keerthy
  2020-02-14  6:34 ` [PATCH v2 4/4] arm64: dts: ti: am6: Add VTM node Keerthy
  3 siblings, 0 replies; 9+ messages in thread
From: Keerthy @ 2020-02-14  6:34 UTC (permalink / raw)
  To: rui.zhang, robh+dt, daniel.lezcano
  Cc: j-keerthy, amit.kucheria, t-kristo, devicetree, linux-kernel,
	linux-arm-kernel, linux-pm, mark.rutland

The am654 SoC has three thermal zones namely MPU0, MPU1 and MCU
zones

Signed-off-by: Keerthy <j-keerthy@ti.com>
---

Changes in v2:

  * Renamed am654-industrial-thermal.dtsi to k3-am654-industrial-thermal.dtsi

 .../dts/ti/k3-am654-industrial-thermal.dtsi   | 45 +++++++++++++++++++
 1 file changed, 45 insertions(+)
 create mode 100644 arch/arm64/boot/dts/ti/k3-am654-industrial-thermal.dtsi

diff --git a/arch/arm64/boot/dts/ti/k3-am654-industrial-thermal.dtsi b/arch/arm64/boot/dts/ti/k3-am654-industrial-thermal.dtsi
new file mode 100644
index 000000000000..cdc3d40c3f60
--- /dev/null
+++ b/arch/arm64/boot/dts/ti/k3-am654-industrial-thermal.dtsi
@@ -0,0 +1,45 @@
+// SPDX-License-Identifier: GPL-2.0
+
+#include <dt-bindings/thermal/thermal.h>
+
+mpu0_thermal: mpu0_thermal {
+	polling-delay-passive = <250>; /* milliseconds */
+	polling-delay = <500>; /* milliseconds */
+	thermal-sensors = <&wkup_vtm0 0>;
+
+	trips {
+		mpu0_crit: mpu0_crit {
+			temperature = <125000>; /* milliCelsius */
+			hysteresis = <2000>; /* milliCelsius */
+			type = "critical";
+		};
+	};
+};
+
+mpu1_thermal: mpu1_thermal {
+	polling-delay-passive = <250>; /* milliseconds */
+	polling-delay = <500>; /* milliseconds */
+	thermal-sensors = <&wkup_vtm0 1>;
+
+	trips {
+		mpu1_crit: mpu1_crit {
+			temperature = <125000>; /* milliCelsius */
+			hysteresis = <2000>; /* milliCelsius */
+			type = "critical";
+		};
+	};
+};
+
+mcu_thermal: mcu_thermal {
+	polling-delay-passive = <250>; /* milliseconds */
+	polling-delay = <500>; /* milliseconds */
+	thermal-sensors = <&wkup_vtm0 2>;
+
+	trips {
+		mcu_crit: mcu_crit {
+			temperature = <125000>; /* milliCelsius */
+			hysteresis = <2000>; /* milliCelsius */
+			type = "critical";
+		};
+	};
+};
-- 
2.17.1


^ permalink raw reply	[flat|nested] 9+ messages in thread

* [PATCH v2 4/4] arm64: dts: ti: am6: Add VTM node
  2020-02-14  6:34 [PATCH v2 0/4] thermal: k3: Add support for bandgap sensors Keerthy
                   ` (2 preceding siblings ...)
  2020-02-14  6:34 ` [PATCH v2 3/4] arm64: dts: ti: am654: Add thermal zones Keerthy
@ 2020-02-14  6:34 ` Keerthy
  3 siblings, 0 replies; 9+ messages in thread
From: Keerthy @ 2020-02-14  6:34 UTC (permalink / raw)
  To: rui.zhang, robh+dt, daniel.lezcano
  Cc: j-keerthy, amit.kucheria, t-kristo, devicetree, linux-kernel,
	linux-arm-kernel, linux-pm, mark.rutland

VTM stands for voltage and thermal management. Add the vtm node and
the associated thermal zones on the SoC.

Signed-off-by: Keerthy <j-keerthy@ti.com>
---
 arch/arm64/boot/dts/ti/k3-am65-wakeup.dtsi | 11 +++++++++++
 1 file changed, 11 insertions(+)

diff --git a/arch/arm64/boot/dts/ti/k3-am65-wakeup.dtsi b/arch/arm64/boot/dts/ti/k3-am65-wakeup.dtsi
index f4227e2743f2..e7ef96b621b3 100644
--- a/arch/arm64/boot/dts/ti/k3-am65-wakeup.dtsi
+++ b/arch/arm64/boot/dts/ti/k3-am65-wakeup.dtsi
@@ -89,4 +89,15 @@
 		clocks = <&k3_clks 59 0>;
 		clock-names = "gpio";
 	};
+
+	wkup_vtm0: wkup_vtm0@42050000 {
+		compatible = "ti,am654-vtm";
+		reg = <0x42050000 0x25c>;
+		power-domains = <&k3_pds 80 TI_SCI_PD_EXCLUSIVE>;
+		#thermal-sensor-cells = <1>;
+	};
+
+	thermal_zones: thermal-zones {
+		#include "k3-am654-industrial-thermal.dtsi"
+	};
 };
-- 
2.17.1


^ permalink raw reply	[flat|nested] 9+ messages in thread

* Re: [PATCH v2 1/4] dt-bindings: thermal: k3: Add VTM bindings documentation
  2020-02-14  6:34 ` [PATCH v2 1/4] dt-bindings: thermal: k3: Add VTM bindings documentation Keerthy
@ 2020-02-18 20:20   ` Rob Herring
  2020-02-19  7:40     ` Keerthy
  0 siblings, 1 reply; 9+ messages in thread
From: Rob Herring @ 2020-02-18 20:20 UTC (permalink / raw)
  To: Keerthy
  Cc: rui.zhang, robh+dt, daniel.lezcano, j-keerthy, amit.kucheria,
	t-kristo, devicetree, linux-kernel, linux-arm-kernel, linux-pm,
	mark.rutland

On Fri, 14 Feb 2020 12:04:40 +0530, Keerthy wrote:
> Add VTM bindings documentation. In the Voltage Thermal
> Management Module(VTM), K3 AM654 supplies a voltage
> reference and a temperature sensor feature that are gathered in the band
> gap voltage and temperature sensor (VBGAPTS) module. The band
> gap provides current and voltage reference for its internal
> circuits and other analog IP blocks. The analog-to-digital
> converter (ADC) produces an output value that is proportional
> to the silicon temperature.
> 
> Signed-off-by: Keerthy <j-keerthy@ti.com>
> ---
> 
> Changes in v2:
> 
>   * Fixed make dt_binding_check errors.
> 
>  .../bindings/thermal/ti,am654-thermal.yaml    | 57 +++++++++++++++++++
>  1 file changed, 57 insertions(+)
>  create mode 100644 Documentation/devicetree/bindings/thermal/ti,am654-thermal.yaml
> 

My bot found errors running 'make dt_binding_check' on your patch:

Documentation/devicetree/bindings/display/simple-framebuffer.example.dts:21.16-37.11: Warning (chosen_node_is_root): /example-0/chosen: chosen node must be at root node
Error: Documentation/devicetree/bindings/thermal/ti,am654-thermal.example.dts:21.41-42 syntax error
FATAL ERROR: Unable to parse input tree
scripts/Makefile.lib:300: recipe for target 'Documentation/devicetree/bindings/thermal/ti,am654-thermal.example.dt.yaml' failed
make[1]: *** [Documentation/devicetree/bindings/thermal/ti,am654-thermal.example.dt.yaml] Error 1
Makefile:1263: recipe for target 'dt_binding_check' failed
make: *** [dt_binding_check] Error 2

See https://patchwork.ozlabs.org/patch/1237882
Please check and re-submit.

^ permalink raw reply	[flat|nested] 9+ messages in thread

* Re: [PATCH v2 1/4] dt-bindings: thermal: k3: Add VTM bindings documentation
  2020-02-18 20:20   ` Rob Herring
@ 2020-02-19  7:40     ` Keerthy
  2020-02-20 20:28       ` Rob Herring
  0 siblings, 1 reply; 9+ messages in thread
From: Keerthy @ 2020-02-19  7:40 UTC (permalink / raw)
  To: Rob Herring
  Cc: rui.zhang, robh+dt, daniel.lezcano, amit.kucheria, t-kristo,
	devicetree, linux-kernel, linux-arm-kernel, linux-pm,
	mark.rutland



On 19/02/20 1:50 am, Rob Herring wrote:
> On Fri, 14 Feb 2020 12:04:40 +0530, Keerthy wrote:
>> Add VTM bindings documentation. In the Voltage Thermal
>> Management Module(VTM), K3 AM654 supplies a voltage
>> reference and a temperature sensor feature that are gathered in the band
>> gap voltage and temperature sensor (VBGAPTS) module. The band
>> gap provides current and voltage reference for its internal
>> circuits and other analog IP blocks. The analog-to-digital
>> converter (ADC) produces an output value that is proportional
>> to the silicon temperature.
>>
>> Signed-off-by: Keerthy <j-keerthy@ti.com>
>> ---
>>
>> Changes in v2:
>>
>>    * Fixed make dt_binding_check errors.
>>
>>   .../bindings/thermal/ti,am654-thermal.yaml    | 57 +++++++++++++++++++
>>   1 file changed, 57 insertions(+)
>>   create mode 100644 Documentation/devicetree/bindings/thermal/ti,am654-thermal.yaml
>>
> 
> My bot found errors running 'make dt_binding_check' on your patch:
> 
> Documentation/devicetree/bindings/display/simple-framebuffer.example.dts:21.16-37.11: Warning (chosen_node_is_root): /example-0/chosen: chosen node must be at root node
> Error: Documentation/devicetree/bindings/thermal/ti,am654-thermal.example.dts:21.41-42 syntax error
> FATAL ERROR: Unable to parse input tree
> scripts/Makefile.lib:300: recipe for target 'Documentation/devicetree/bindings/thermal/ti,am654-thermal.example.dt.yaml' failed
> make[1]: *** [Documentation/devicetree/bindings/thermal/ti,am654-thermal.example.dt.yaml] Error 1
> Makefile:1263: recipe for target 'dt_binding_check' failed
> make: *** [dt_binding_check] Error 2
> 
> See https://patchwork.ozlabs.org/patch/1237882
> Please check and re-submit.

Rob,

I am using:

Tree: https//github.com/devicetree-org/dt-schema.git
branch: master

I have make dt_binding_check working for 
Documentation/devicetree/bindings/thermal/ti,am654-thermal.example.dt.yaml

Documentation/devicetree/bindings/thermal/ti,am654-thermal.example.dts
is created without any errors :

https://pastebin.ubuntu.com/p/6MkMbKPpbY/

I did not see any errors as the other files erred out.

Today i tried with DT_SCHEMA_FILES option and then finally reproduced 
the errors. It is a bit confusing for the first time users.

Now i have it compiled without any errors.

Posting v3 in a bit.

- Keerthy


> 

^ permalink raw reply	[flat|nested] 9+ messages in thread

* Re: [PATCH v2 1/4] dt-bindings: thermal: k3: Add VTM bindings documentation
  2020-02-19  7:40     ` Keerthy
@ 2020-02-20 20:28       ` Rob Herring
  2020-02-24  1:12         ` J, KEERTHY
  0 siblings, 1 reply; 9+ messages in thread
From: Rob Herring @ 2020-02-20 20:28 UTC (permalink / raw)
  To: Keerthy
  Cc: Zhang Rui, Daniel Lezcano, Amit Kucheria, Tero Kristo,
	devicetree, linux-kernel,
	moderated list:ARM/FREESCALE IMX / MXC ARM ARCHITECTURE,
	open list:THERMAL, Mark Rutland

On Wed, Feb 19, 2020 at 1:40 AM Keerthy <j-keerthy@ti.com> wrote:
>
>
>
> On 19/02/20 1:50 am, Rob Herring wrote:
> > On Fri, 14 Feb 2020 12:04:40 +0530, Keerthy wrote:
> >> Add VTM bindings documentation. In the Voltage Thermal
> >> Management Module(VTM), K3 AM654 supplies a voltage
> >> reference and a temperature sensor feature that are gathered in the band
> >> gap voltage and temperature sensor (VBGAPTS) module. The band
> >> gap provides current and voltage reference for its internal
> >> circuits and other analog IP blocks. The analog-to-digital
> >> converter (ADC) produces an output value that is proportional
> >> to the silicon temperature.
> >>
> >> Signed-off-by: Keerthy <j-keerthy@ti.com>
> >> ---
> >>
> >> Changes in v2:
> >>
> >>    * Fixed make dt_binding_check errors.
> >>
> >>   .../bindings/thermal/ti,am654-thermal.yaml    | 57 +++++++++++++++++++
> >>   1 file changed, 57 insertions(+)
> >>   create mode 100644 Documentation/devicetree/bindings/thermal/ti,am654-thermal.yaml
> >>
> >
> > My bot found errors running 'make dt_binding_check' on your patch:
> >
> > Documentation/devicetree/bindings/display/simple-framebuffer.example.dts:21.16-37.11: Warning (chosen_node_is_root): /example-0/chosen: chosen node must be at root node
> > Error: Documentation/devicetree/bindings/thermal/ti,am654-thermal.example.dts:21.41-42 syntax error
> > FATAL ERROR: Unable to parse input tree
> > scripts/Makefile.lib:300: recipe for target 'Documentation/devicetree/bindings/thermal/ti,am654-thermal.example.dt.yaml' failed
> > make[1]: *** [Documentation/devicetree/bindings/thermal/ti,am654-thermal.example.dt.yaml] Error 1
> > Makefile:1263: recipe for target 'dt_binding_check' failed
> > make: *** [dt_binding_check] Error 2
> >
> > See https://patchwork.ozlabs.org/patch/1237882
> > Please check and re-submit.
>
> Rob,
>
> I am using:
>
> Tree: https//github.com/devicetree-org/dt-schema.git
> branch: master
>
> I have make dt_binding_check working for
> Documentation/devicetree/bindings/thermal/ti,am654-thermal.example.dt.yaml
>
> Documentation/devicetree/bindings/thermal/ti,am654-thermal.example.dts
> is created without any errors :
>
> https://pastebin.ubuntu.com/p/6MkMbKPpbY/
>
> I did not see any errors as the other files erred out.

'make -k' is your friend.

What branch are you on. Only linux-next breaks generally.

> Today i tried with DT_SCHEMA_FILES option and then finally reproduced
> the errors. It is a bit confusing for the first time users.
>
> Now i have it compiled without any errors.
>
> Posting v3 in a bit.
>
> - Keerthy
>
>
> >

^ permalink raw reply	[flat|nested] 9+ messages in thread

* Re: [PATCH v2 1/4] dt-bindings: thermal: k3: Add VTM bindings documentation
  2020-02-20 20:28       ` Rob Herring
@ 2020-02-24  1:12         ` J, KEERTHY
  0 siblings, 0 replies; 9+ messages in thread
From: J, KEERTHY @ 2020-02-24  1:12 UTC (permalink / raw)
  To: Rob Herring
  Cc: Zhang Rui, Daniel Lezcano, Amit Kucheria, Tero Kristo,
	devicetree, linux-kernel,
	moderated list:ARM/FREESCALE IMX / MXC ARM ARCHITECTURE,
	open list:THERMAL, Mark Rutland



On 2/21/2020 1:58 AM, Rob Herring wrote:
> On Wed, Feb 19, 2020 at 1:40 AM Keerthy <j-keerthy@ti.com> wrote:
>>
>>
>>
>> On 19/02/20 1:50 am, Rob Herring wrote:
>>> On Fri, 14 Feb 2020 12:04:40 +0530, Keerthy wrote:
>>>> Add VTM bindings documentation. In the Voltage Thermal
>>>> Management Module(VTM), K3 AM654 supplies a voltage
>>>> reference and a temperature sensor feature that are gathered in the band
>>>> gap voltage and temperature sensor (VBGAPTS) module. The band
>>>> gap provides current and voltage reference for its internal
>>>> circuits and other analog IP blocks. The analog-to-digital
>>>> converter (ADC) produces an output value that is proportional
>>>> to the silicon temperature.
>>>>
>>>> Signed-off-by: Keerthy <j-keerthy@ti.com>
>>>> ---
>>>>
>>>> Changes in v2:
>>>>
>>>>     * Fixed make dt_binding_check errors.
>>>>
>>>>    .../bindings/thermal/ti,am654-thermal.yaml    | 57 +++++++++++++++++++
>>>>    1 file changed, 57 insertions(+)
>>>>    create mode 100644 Documentation/devicetree/bindings/thermal/ti,am654-thermal.yaml
>>>>
>>>
>>> My bot found errors running 'make dt_binding_check' on your patch:
>>>
>>> Documentation/devicetree/bindings/display/simple-framebuffer.example.dts:21.16-37.11: Warning (chosen_node_is_root): /example-0/chosen: chosen node must be at root node
>>> Error: Documentation/devicetree/bindings/thermal/ti,am654-thermal.example.dts:21.41-42 syntax error
>>> FATAL ERROR: Unable to parse input tree
>>> scripts/Makefile.lib:300: recipe for target 'Documentation/devicetree/bindings/thermal/ti,am654-thermal.example.dt.yaml' failed
>>> make[1]: *** [Documentation/devicetree/bindings/thermal/ti,am654-thermal.example.dt.yaml] Error 1
>>> Makefile:1263: recipe for target 'dt_binding_check' failed
>>> make: *** [dt_binding_check] Error 2
>>>
>>> See https://patchwork.ozlabs.org/patch/1237882
>>> Please check and re-submit.
>>
>> Rob,
>>
>> I am using:
>>
>> Tree: https//github.com/devicetree-org/dt-schema.git
>> branch: master
>>
>> I have make dt_binding_check working for
>> Documentation/devicetree/bindings/thermal/ti,am654-thermal.example.dt.yaml
>>
>> Documentation/devicetree/bindings/thermal/ti,am654-thermal.example.dts
>> is created without any errors :
>>
>> https://pastebin.ubuntu.com/p/6MkMbKPpbY/
>>
>> I did not see any errors as the other files erred out.
> 
> 'make -k' is your friend.
> 

Okay

> What branch are you on. Only linux-next breaks generally.

linux-next

Thanks,
Keerthy
> 
>> Today i tried with DT_SCHEMA_FILES option and then finally reproduced
>> the errors. It is a bit confusing for the first time users.
>>
>> Now i have it compiled without any errors.
>>
>> Posting v3 in a bit.
>>
>> - Keerthy
>>
>>
>>>

^ permalink raw reply	[flat|nested] 9+ messages in thread

end of thread, back to index

Thread overview: 9+ messages (download: mbox.gz / follow: Atom feed)
-- links below jump to the message on this page --
2020-02-14  6:34 [PATCH v2 0/4] thermal: k3: Add support for bandgap sensors Keerthy
2020-02-14  6:34 ` [PATCH v2 1/4] dt-bindings: thermal: k3: Add VTM bindings documentation Keerthy
2020-02-18 20:20   ` Rob Herring
2020-02-19  7:40     ` Keerthy
2020-02-20 20:28       ` Rob Herring
2020-02-24  1:12         ` J, KEERTHY
2020-02-14  6:34 ` [PATCH v2 2/4] thermal: k3: Add support for bandgap sensors Keerthy
2020-02-14  6:34 ` [PATCH v2 3/4] arm64: dts: ti: am654: Add thermal zones Keerthy
2020-02-14  6:34 ` [PATCH v2 4/4] arm64: dts: ti: am6: Add VTM node Keerthy

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