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From: Daniel Lezcano <daniel.lezcano@linaro.org>
To: rafael@kernel.org, robh@kernel.org
Cc: Zhang Rui <rui.zhang@intel.com>,
	Amit Kucheria <amit.kucheria@verdurent.com>,
	Rob Herring <robh+dt@kernel.org>,
	Mark Rutland <mark.rutland@arm.com>,
	"open list:THERMAL" <linux-pm@vger.kernel.org>,
	"open list:OPEN FIRMWARE AND FLATTENED DEVICE TREE BINDINGS" 
	<devicetree@vger.kernel.org>,
	open list <linux-kernel@vger.kernel.org>
Subject: Re: [PATCH 2/4] dt-bindings: thermal: Add the idle cooling device
Date: Tue, 7 Apr 2020 15:36:20 +0200
Message-ID: <723b86c4-273c-bf69-8934-b0a0ebe22409@linaro.org> (raw)
In-Reply-To: <20200329220324.8785-2-daniel.lezcano@linaro.org>


Hi Rob,

On 30/03/2020 00:03, Daniel Lezcano wrote:
> Some devices are not able to cool down by reducing their voltage /
> frequency because it could be not available or the system does not
> allow voltage scaling. In this configuration, it is not possible to
> use this strategy and the idle injection cooling device can be used
> instead.
> 
> One idle cooling device is now present for the CPU as implemented by
> the combination of the idle injection framework belonging to the power
> capping framework and the thermal cooling device. The missing part is
> the DT binding providing a way to describe how the cooling device will
> work on the system.
> 
> A first iteration was done by making the cooling device to point to
> the idle state. Unfortunately it does not make sense because it would
> need to duplicate the idle state description for each CPU in order to
> have a different phandle and make the thermal internal framework
> happy.
> 
> It was proposed to add an cooling-cells to <3>, unfortunately the
> thermal framework is expecting a value of <2> as stated by the
> documentation and it is not possible from the cooling device generic
> code to loop this third value to the back end cooling device.
> 
> Another proposal was to add a child 'thermal-idle' node as the SCMI
> does. This approach allows to have a self-contained configuration for
> the idle cooling device without colliding with the cpufreq cooling
> device which is based on the CPU node. In addition, it allows to have
> the cpufreq cooling device and the idle cooling device to co-exist
> together as showed in the example.

The other patches of the series are acked-by.

Do you think this patch is fine? I would like to apply the series.

Thanks

  -- Daniel


[ ... ]


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  reply index

Thread overview: 11+ messages / expand[flat|nested]  mbox.gz  Atom feed  top
2020-03-29 22:03 [PATCH V2 1/4] powercap/drivers/idle_inject: Specify idle state max latency Daniel Lezcano
2020-03-29 22:03 ` [PATCH 2/4] dt-bindings: thermal: Add the idle cooling device Daniel Lezcano
2020-04-07 13:36   ` Daniel Lezcano [this message]
2020-04-07 14:09   ` Amit Kucheria
2020-04-10 16:59   ` Rob Herring
2020-04-12 18:08     ` Daniel Lezcano
2020-03-29 22:03 ` [PATCH 3/4] thermal/drivers/cpuidle_cooling: Change the registration function Daniel Lezcano
2020-03-30  9:58   ` Viresh Kumar
2020-03-29 22:03 ` [PATCH 4/4] thermal: cpuidle: Register cpuidle cooling device Daniel Lezcano
2020-04-03  9:38 ` [PATCH V2 1/4] powercap/drivers/idle_inject: Specify idle state max latency Rafael J. Wysocki
2020-04-03 11:09   ` Daniel Lezcano

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