linux-pm.vger.kernel.org archive mirror

 messages from 2021-04-21 17:41:58 to 2021-04-28 11:35:11 UTC [more...]

[PATCH] cpuidle/pseries: Fixup CEDE0 latency only for POWER10 onwards
 2021-04-28 11:34 UTC  (12+ messages)

[PATCH 0/2] tools/power/turbostat: Fix long time duration RAPL calculation
 2021-04-28  9:09 UTC  (3+ messages)
` [PATCH 1/2] tools/power/turbostat: Fix turbostat for AMD Zen CPUs
` [PATCH 2/2] tools/power turbostat: Fix offset overflow issue in index converting

[PATCH v16 0/7] soc: mediatek: SVS: introduce MTK SVS
 2021-04-28  6:54 UTC  (8+ messages)
` [PATCH v16 1/7] dt-bindings: soc: mediatek: add mtk svs dt-bindings
` [PATCH v16 2/7] arm64: dts: mt8183: add svs device information
` [PATCH v16 3/7] soc: mediatek: SVS: introduce MTK SVS engine
` [PATCH v16 4/7] soc: mediatek: SVS: add debug commands
` [PATCH v16 5/7] dt-bindings: soc: mediatek: add mt8192 svs dt-bindings
` [PATCH v16 6/7] arm64: dts: mt8192: add svs device information
` [PATCH v16 7/7] soc: mediatek: SVS: add mt8192 SVS GPU driver

[PATCH] power: supply: sbs-battery: do not use global variables
 2021-04-28  4:08 UTC  (2+ messages)
` [PATCH v2] power: supply: sbs-battery: cache constant string properties

[PATCH v2 1/1] thermal: ti-soc-thermal: Remove duplicated header file inclusion
 2021-04-27 19:44 UTC  (2+ messages)
` [thermal: thermal/next] thermal/drivers/ti-soc-thermal/ti-bandgap: Rearrange all the included header files alphabetically

[PATCH V3] thermal: intel: introduce tcc cooling driver
 2021-04-27 19:44 UTC  (2+ messages)
` [thermal: thermal/next] thermal/drivers/intel: Introduce "

[PATCH -next] thermal/drivers/hisi: Remove redundant dev_err call in hisi_thermal_probe()
 2021-04-27 19:44 UTC  (2+ messages)
` [thermal: thermal/next] "

[PATCH] thermal: tegra: Use devm_platform_ioremap_resource_byname
 2021-04-27 19:44 UTC  (2+ messages)
` [thermal: thermal/next] thermal/drivers/tegra: "

[PATCH v2 1/3] iwlwifi: mvm: tt: Replace thermal_notify_framework
 2021-04-27 19:44 UTC  (2+ messages)
` [thermal: thermal/next] "

[PATCH] dt-bindings: thermal: thermal-sensor: require "#thermal-sensor-cells"
 2021-04-27 19:44 UTC  (2+ messages)
` [thermal: thermal/next] "

[PATCH V2] dt-bindings: thermal: brcm,ns-thermal: convert to the json-schema
 2021-04-27 19:44 UTC  (2+ messages)
` [thermal: thermal/next] dt-bindings: thermal: brcm,ns-thermal: Convert "

[PATCH v3] thermal: ti-soc-thermal: Remove unused variable 'val'
 2021-04-27 19:44 UTC  (8+ messages)
        ` 答复: "
` [thermal: thermal/next] thermal/drivers/ti-soc-thermal/bandgap "

[PATCH v2 2/3] drivers: thermal: Remove thermal_notify_framework
 2021-04-27 19:44 UTC  (2+ messages)
` [thermal: thermal/next] thermal/core: "

[PATCH v2 3/3] Documentation: driver-api: thermal: Remove thermal_notify_framework from documentation
 2021-04-27 19:44 UTC  (2+ messages)
` [thermal: thermal/next] "

[thermal PATCH v15 1/9] drivers: thermal: tsens: Don't hardcode sensor slope
 2021-04-27 19:44 UTC  (2+ messages)
` [thermal: thermal/next] thermal/drivers/tsens: "

[thermal PATCH v15 2/9] drivers: thermal: tsens: Convert msm8960 to reg_field
 2021-04-27 19:44 UTC  (2+ messages)
` [thermal: thermal/next] thermal/drivers/tsens: "

[thermal PATCH v15 3/9] drivers: thermal: tsens: Add VER_0 tsens version
 2021-04-27 19:44 UTC  (2+ messages)
` [thermal: thermal/next] thermal/drivers/tsens: "

[thermal PATCH v15 4/9] drivers: thermal: tsens: Use init_common for msm8960
 2021-04-27 19:44 UTC  (2+ messages)
` [thermal: thermal/next] thermal/drivers/tsens: "

[thermal PATCH v15 5/9] drivers: thermal: tsens: Fix bug in sensor enable for msm8960
 2021-04-27 19:44 UTC  (2+ messages)
` [thermal: thermal/next] thermal/drivers/tsens: "

[thermal PATCH v15 6/9] drivers: thermal: tsens: Replace custom 8960 apis with generic apis
 2021-04-27 19:44 UTC  (2+ messages)
` [thermal: thermal/next] thermal/drivers/tsens: "

[thermal PATCH v15 7/9] drivers: thermal: tsens: Drop unused define for msm8960
 2021-04-27 19:44 UTC  (2+ messages)
` [thermal: thermal/next] thermal/drivers/tsens: "

[thermal PATCH v15 8/9] drivers: thermal: tsens: Add support for ipq8064-tsens
 2021-04-27 19:44 UTC  (2+ messages)
` [thermal: thermal/next] thermal/drivers/tsens: "

[PATCH v4 0/3] Improve IPA mechanisms in low temperature state
 2021-04-27 19:44 UTC  (9+ messages)
` [PATCH v4 1/3] thermal: create a helper __thermal_cdev_update() without a lock
  ` [thermal: thermal/next] thermal/core: Create "
` [PATCH v4 2/3] thermal: power_allocator: maintain the device statistics from going stale
  ` [thermal: thermal/next] thermal/core/power_allocator: Maintain "
` [PATCH v4 3/3] thermal: power_allocator: update once cooling devices when temp is low
  ` [thermal: thermal/next] thermal/core/power_allocator: Update "

[thermal PATCH v15 9/9] dt-bindings: thermal: tsens: Document ipq8064 bindings
 2021-04-27 19:44 UTC  (2+ messages)
` [thermal: thermal/next] "

[PATCH] thermal: mtk_thermal: remove redundant initializations of several variables
 2021-04-27 19:44 UTC  (2+ messages)
` [thermal: thermal/next] thermal/drivers/mtk_thermal: Remove "

[PATCH 0/3] Thermal governors improvements and a fix
 2021-04-27 19:44 UTC  (10+ messages)
` [PATCH 1/3] thermal: fair share: lock thermal zone while looping over instances
  ` [thermal: thermal/next] thermal/core/fair share: Lock the "
` [PATCH 2/3] thermal: fair share: use __thermal_cdev_update()
  ` [thermal: thermal/next] thermal/core/fair share: Use the lockless __thermal_cdev_update() function
` [PATCH 3/3] thermal: power allocator: use __thermal_cdev_update()
  ` [thermal: thermal/next] thermal/core/power allocator: Use the lockless __thermal_cdev_update() function

[GIT PULL] power-supply changes for 5.13
 2021-04-27 18:51 UTC 

[PATCH v2] clk: Skip clk provider registration when np is NULL
 2021-04-27 14:57 UTC  (3+ messages)

[Resend PATCH v2] soc: ti: smartreflex after the relocation to maintain
 2021-04-27 11:41 UTC 

[0/3] Add SC7280 interconnect provider driver
 2021-04-27 10:01 UTC  (4+ messages)
` [1/3] dt-bindings: interconnect: Add Qualcomm SC7280 DT bindings

[v2 0/3] Add SC7280 interconnect provider driver
 2021-04-27  9:50 UTC  (4+ messages)
` [v2 1/3] dt-bindings: interconnect: Add Qualcomm SC7280 DT bindings
` [v2 2/3] interconnect: qcom: Add SC7280 interconnect provider driver
` [v2 3/3] arm64: dts: sc7280: Add interconnect provider DT nodes

[PATCH 1/2] thermal: imx_sc: add missing of_node_put for loop iteration
 2021-04-27  8:55 UTC  (4+ messages)
` [PATCH 2/2] thermal: sprd: "

[PATCH V2 0/4] Add support for PMK8350 PON_HLOS PMIC peripheral
 2021-04-27  8:37 UTC  (6+ messages)
` [PATCH V2 3/4] dt-bindings: power: reset: qcom-pon: Convert qcom PON binding to yaml

[pm:bleeding-edge] BUILD SUCCESS 3c44d15e5ffdbc1b9d31d098b65c5cb50211d802
 2021-04-27  3:14 UTC 

pm/testing sleep: 7 runs, 1 regressions (v5.12-rc8-168-g3c44d15e5ffdb)
 2021-04-27  1:01 UTC 

pm/testing baseline: 113 runs, 1 regressions (v5.12-rc8-168-g3c44d15e5ffdb)
 2021-04-27  0:46 UTC 

pm/testing build: 7 builds: 0 failed, 7 passed, 1 warning (v5.12-rc8-168-g3c44d15e5ffdb)
 2021-04-27  0:03 UTC 

[GIT PULL] ACPI updates for v5.13-rc1
 2021-04-26 22:51 UTC  (2+ messages)

[GIT PULL] Power management updates for v5.13-rc1
 2021-04-26 22:51 UTC  (2+ messages)

[PATCH V2 0/3] Add DT bindings and device tree nodes for TSENS in SC7280
 2021-04-26 21:53 UTC  (7+ messages)
` [PATCH V2 1/3] dt-bindings: thermal: tsens: Add compatible string to TSENS binding for SC7280
` [PATCH V2 2/3] ARM: dts: qcom: Add device node support for TSENS in SC7280
` [PATCH V2 3/3] ARM: dts: qcom: Add Thermal zone support "

[PATCH] thermal: brcmstb_thermal: Interrupt is optional
 2021-04-26 21:36 UTC 

[PATCH v2] soc: ti: smartreflex after the relocation to maintain consistency
 2021-04-26 14:47 UTC  (2+ messages)

[RFC PATCH 0/4] Support for passing runtime state idle time to TF-A
 2021-04-26 13:11 UTC  (14+ messages)
` [RFC PATCH 1/4] firmware/psci: add support for PSCI function SET_STATE_IDLE_TIME
` [RFC PATCH 2/4] cpuidle: menu: add idle_time to cpuidle_state
` [RFC PATCH 3/4] cpuidle: psci: pass state idle time before state enter callback
` [RFC PATCH 4/4] arm64: dts: tegra194: Add CPU idle states

[PATCH] PM: runtime: document common mistake with pm_runtime_get_sync()
 2021-04-26 11:45 UTC  (5+ messages)

[RFC PATCH] axp209 PMIC: setting constant_charge_current to 0 disables battery charging
 2021-04-26  8:40 UTC  (2+ messages)

[RFC v4 0/2] CPU-Idle latency selftest framework
 2021-04-25 20:49 UTC  (5+ messages)
` [RFC v4 1/2] cpuidle: Extract IPI based and timer based wakeup latency from idle states
` [RFC v4 2/2] selftest/cpuidle: Add support for cpuidle latency measurement

[PATCH v4] x86, sched: Fix the AMD CPPC maximum perf on some specific generations
 2021-04-25  7:34 UTC 

[PATCH v2] x86, sched: Fix the AMD CPPC maximum perf on some specific generations
 2021-04-25  7:18 UTC  (5+ messages)

[PATCH v3] x86, sched: Fix the AMD CPPC maximum perf on some specific generations
 2021-04-25  7:11 UTC  (7+ messages)

[PATCH v4 2/2] cpupower: Fix to return negative value if no permisssion for read_msr
 2021-04-25  2:51 UTC 

[PATCH 1/2] cpupower: Fix amd cpu (family < 0x17) active state issue
 2021-04-25  2:41 UTC  (2+ messages)

[PATCH 1/2] dt-bindings: rockchip-thermal: Support the RK3568 SoC compatible
 2021-04-24 18:57 UTC  (11+ messages)
` [PATCH 2/2] thermal/rockchip: Support RK3568 SoCs in the thermal driver

[PATCH v2] tools/power turbostat: Fix RAPL summary collection on AMD processors
 2021-04-24  1:34 UTC  (20+ messages)

[PATCH 0/2] clk: Do not register provider with a NULL dev->of_node
 2021-04-24  1:17 UTC  (9+ messages)
` [PATCH 1/2] "
` [PATCH 2/2] clk: bcm: rpi: Do not call devm_of_clk_add_hw_provider "
` [PATCH] clk: Skip clk provider registration when np is NULL

[PATCH v2] power: supply: cpcap-charger: get the battery inserted infomation from cpcap-battery
 2021-04-23 13:00 UTC 

[PATCH v2] power: supply: cpcap-battery: invalidate empty->counter_uah and charge_full when charge_now indicates that they are grossly wrong
 2021-04-23 12:58 UTC 

[PATCH] PM: Use pm_pr_dbg() instead of pr_debug()
 2021-04-23 12:16 UTC  (3+ messages)

[pm:bleeding-edge] BUILD SUCCESS 07ca763aa24938bc9d16edae9174df3edfe20ef0
 2021-04-23  1:55 UTC 

[PATCH] interconnect: qcom: bcm-voter: add a missing of_node_put()
 2021-04-22 23:46 UTC  (3+ messages)

[PATCH V1 0/2] ARM: dts: qcom: Add device node support for TSENS in SC7280
 2021-04-22 17:45 UTC  (5+ messages)
` [PATCH V1 1/2] ARM: dts: qcom: Add device node support for TSENS in
` [PATCH V1 2/2] dt-bindings: thermal: tsens: Add configuration in yaml

[PATCH] PM / wakeup: remove redundant assignment to variable retval
 2021-04-22 13:26 UTC  (2+ messages)

[Bug 210993] New: Intel frequency scaling causes electrical noise on 10th gen CPUs
 2021-04-22 13:23 UTC  (2+ messages)
` [Bug 210993] "

pm/testing sleep: 5 runs, 1 regressions (v5.12-rc8-166-ge5e331f4da127)
 2021-04-22 11:59 UTC 

[PATCH 1/2] thermal/drivers/tegra: Remove a pointless call get_thermal_instance()
 2021-04-22 11:53 UTC  (3+ messages)
` [PATCH 2/2] thermal/core: Remove unused EXPORT_SYMBOLS

pm/testing build: 7 builds: 0 failed, 7 passed, 1 warning (v5.12-rc8-166-ge5e331f4da127)
 2021-04-22 11:01 UTC 

[PATCH v3 0/3] Improve IPA mechanisms in low temperature state
 2021-04-22 10:26 UTC  (7+ messages)
` [PATCH v3 1/3] thermal: power_allocator: maintain the device statistics from going stale
` [PATCH v3 2/3] thermal: power_allocator: update once cooling devices when temp is low
` [PATCH v3 3/3] thermal: create a helper __thermal_cdev_update() without a lock

[PATCH v8 00/10] Extend regulator notification support
 2021-04-22  9:27 UTC  (4+ messages)
` [PATCH v8 03/10] thermal: Use generic HW-protection shutdown API

[v3,0/3] thermal: mediatek: Add LVTS architecture thermal controller
 2021-04-22  8:47 UTC  (5+ messages)
` [v3,1/3] thermal: mediatek: Relocate driver to mediatek folder

cpu governor and cpufreq
 2021-04-22  5:22 UTC 

[pm:bleeding-edge] BUILD SUCCESS 6e7bc7ebb752591ddd10e8f935604885bdb9728b
 2021-04-22  5:20 UTC 

[PATCH v2] power: supply: cpcap-battery: fix invalid usage of list cursor
 2021-04-21 21:09 UTC  (4+ messages)