* [PATCH/RFT] arm64: dts: renesas: r8a7796: Create thermal zone to support IPA
2018-12-20 20:49 [PATCH/RFT] arm64: dts: renesas: r8a7795: Create thermal zone to support IPA Yoshihiro Kaneko
@ 2018-12-20 20:49 ` Yoshihiro Kaneko
2018-12-20 20:49 ` [PATCH/RFT] arm64: dts: renesas: r8a77965: " Yoshihiro Kaneko
` (2 subsequent siblings)
3 siblings, 0 replies; 8+ messages in thread
From: Yoshihiro Kaneko @ 2018-12-20 20:49 UTC (permalink / raw)
To: linux-renesas-soc
Cc: Simon Horman, Geert Uytterhoeven, Magnus Damm, linux-arm-kernel
From: Dien Pham <dien.pham.ry@renesas.com>
[dien.pham.ry: arm64: dts: r8a7796: Add support IPA for CA53 core]
Setup a thermal zone driven by SoC temperature sensor.
Create passive trip points and bind them to CPUFreq cooling
device that supports power extension.
In R-Car Gen3, IPA is supportted for only one channel
(on H3/M3/M3N board, it is channel THS3). Reason:
Currently, IPA controls base on only CPU temperature.
And only one thermal channel is assembled closest
CPU cores is selected as target of IPA.
If other channels are used, IPA controlling is not properly.
Signed-off-by: Hien Dang <hien.dang.eb@rvc.renesas.com>
Signed-off-by: An Huynh <an.huynh.uj@rvc.renesas.com>
[takeshi.kihara.df: fix W=1 dtc unit_address_vs_reg warnings]
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com>
---
This patch is based on the devel branch of Simon Horman's renesas tree.
arch/arm64/boot/dts/renesas/r8a7796.dtsi | 56 +++++++++++++++-----------------
1 file changed, 27 insertions(+), 29 deletions(-)
diff --git a/arch/arm64/boot/dts/renesas/r8a7796.dtsi b/arch/arm64/boot/dts/renesas/r8a7796.dtsi
index afedbf5..98f621c 100644
--- a/arch/arm64/boot/dts/renesas/r8a7796.dtsi
+++ b/arch/arm64/boot/dts/renesas/r8a7796.dtsi
@@ -160,6 +160,9 @@
power-domains = <&sysc R8A7796_PD_CA57_CPU0>;
next-level-cache = <&L2_CA57>;
enable-method = "psci";
+ dynamic-power-coefficient = <854>;
+ cooling-min-level = <0>;
+ cooling-max-level = <2>;
clocks = <&cpg CPG_CORE R8A7796_CLK_Z>;
operating-points-v2 = <&cluster0_opp>;
capacity-dmips-mhz = <1024>;
@@ -186,6 +189,10 @@
power-domains = <&sysc R8A7796_PD_CA53_CPU0>;
next-level-cache = <&L2_CA53>;
enable-method = "psci";
+ #cooling-cells = <2>;
+ dynamic-power-coefficient = <277>;
+ cooling-min-level = <0>;
+ cooling-max-level = <2>;
clocks = <&cpg CPG_CORE R8A7796_CLK_Z2>;
operating-points-v2 = <&cluster1_opp>;
capacity-dmips-mhz = <535>;
@@ -2822,76 +2829,67 @@
polling-delay-passive = <250>;
polling-delay = <1000>;
thermal-sensors = <&tsc 0>;
+ sustainable-power = <3874>;
trips {
- sensor1_passive: sensor1-passive {
- temperature = <95000>;
- hysteresis = <1000>;
- type = "passive";
- };
sensor1_crit: sensor1-crit {
temperature = <120000>;
hysteresis = <1000>;
type = "critical";
};
};
-
- cooling-maps {
- map0 {
- trip = <&sensor1_passive>;
- cooling-device = <&a57_0 5 5>, <&a57_1 5 5>;
- };
- };
};
sensor_thermal2: sensor-thermal2 {
polling-delay-passive = <250>;
polling-delay = <1000>;
thermal-sensors = <&tsc 1>;
+ sustainable-power = <3874>;
trips {
- sensor2_passive: sensor2-passive {
- temperature = <95000>;
- hysteresis = <1000>;
- type = "passive";
- };
sensor2_crit: sensor2-crit {
temperature = <120000>;
hysteresis = <1000>;
type = "critical";
};
};
-
- cooling-maps {
- map0 {
- trip = <&sensor2_passive>;
- cooling-device = <&a57_0 5 5>, <&a57_1 5 5>;
- };
- };
};
sensor_thermal3: sensor-thermal3 {
polling-delay-passive = <250>;
polling-delay = <1000>;
thermal-sensors = <&tsc 2>;
+ sustainable-power = <3874>;
trips {
- sensor3_passive: sensor3-passive {
- temperature = <95000>;
+ threshold: trip-point0 {
+ temperature = <90000>;
hysteresis = <1000>;
type = "passive";
};
+
+ target: trip-point1 {
+ temperature = <100000>;
+ hysteresis = <1000>;
+ type = "passive";
+ };
+
sensor3_crit: sensor3-crit {
temperature = <120000>;
hysteresis = <1000>;
type = "critical";
};
};
-
cooling-maps {
map0 {
- trip = <&sensor3_passive>;
- cooling-device = <&a57_0 5 5>, <&a57_1 5 5>;
+ trip = <&target>;
+ cooling-device = <&a57_0 0 2>;
+ contribution = <1024>;
+ };
+ map1 {
+ trip = <&target>;
+ cooling-device = <&a53_0 0 2>;
+ contribution = <1024>;
};
};
};
--
1.9.1
^ permalink raw reply related [flat|nested] 8+ messages in thread* [PATCH/RFT] arm64: dts: renesas: r8a77965: Create thermal zone to support IPA
2018-12-20 20:49 [PATCH/RFT] arm64: dts: renesas: r8a7795: Create thermal zone to support IPA Yoshihiro Kaneko
2018-12-20 20:49 ` [PATCH/RFT] arm64: dts: renesas: r8a7796: " Yoshihiro Kaneko
@ 2018-12-20 20:49 ` Yoshihiro Kaneko
2018-12-20 20:49 ` [PATCH/RFT] arm64: dts: renesas: r8a77990: " Yoshihiro Kaneko
2019-01-10 16:33 ` [PATCH/RFT] arm64: dts: renesas: r8a7795: " Niklas Söderlund
3 siblings, 0 replies; 8+ messages in thread
From: Yoshihiro Kaneko @ 2018-12-20 20:49 UTC (permalink / raw)
To: linux-renesas-soc
Cc: Simon Horman, Geert Uytterhoeven, Magnus Damm, linux-arm-kernel
From: Dien Pham <dien.pham.ry@renesas.com>
Setup a thermal zone driven by SoC temperature sensor.
Create passive trip points and bind them to CPUFreq cooling
device that supports power extension.
In R-Car Gen3, IPA is supportted for only one channel
(on H3/M3/M3N board, it is channel THS3). Reason:
Currently, IPA controls base on only CPU temperature.
And only one thermal channel is assembled closest
CPU cores is selected as target of IPA.
If other channels are used, IPA controlling is not properly.
Signed-off-by: Dien Pham <dien.pham.ry@renesas.com>
Signed-off-by: An Huynh <an.huynh.uj@rvc.renesas.com>
[takeshi.kihara.df: fix W=1 dtc unit_address_vs_reg warnings]
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com>
---
This patch is based on the devel branch of Simon Horman's renesas tree.
arch/arm64/boot/dts/renesas/r8a77965.dtsi | 29 +++++++++++++++++++++++++++++
1 file changed, 29 insertions(+)
diff --git a/arch/arm64/boot/dts/renesas/r8a77965.dtsi b/arch/arm64/boot/dts/renesas/r8a77965.dtsi
index 6dc9b1f..a5bf342 100644
--- a/arch/arm64/boot/dts/renesas/r8a77965.dtsi
+++ b/arch/arm64/boot/dts/renesas/r8a77965.dtsi
@@ -111,6 +111,10 @@
power-domains = <&sysc R8A77965_PD_CA57_CPU0>;
next-level-cache = <&L2_CA57>;
enable-method = "psci";
+ #cooling-cells = <2>;
+ dynamic-power-coefficient = <854>;
+ cooling-min-level = <0>;
+ cooling-max-level = <2>;
clocks = <&cpg CPG_CORE R8A77965_CLK_Z>;
operating-points-v2 = <&cluster0_opp>;
};
@@ -2236,6 +2240,7 @@
polling-delay-passive = <250>;
polling-delay = <1000>;
thermal-sensors = <&tsc 0>;
+ sustainable-power = <2439>;
trips {
sensor1_crit: sensor1-crit {
@@ -2250,6 +2255,7 @@
polling-delay-passive = <250>;
polling-delay = <1000>;
thermal-sensors = <&tsc 1>;
+ sustainable-power = <2439>;
trips {
sensor2_crit: sensor2-crit {
@@ -2264,14 +2270,37 @@
polling-delay-passive = <250>;
polling-delay = <1000>;
thermal-sensors = <&tsc 2>;
+ sustainable-power = <2439>;
trips {
+ threshold: trip-point0 {
+ /* miliCelsius */
+ temperature = <90000>;
+ hysteresis = <1000>;
+ type = "passive";
+ };
+
+ target: trip-point1 {
+ /* miliCelsius */
+ temperature = <100000>;
+ hysteresis = <1000>;
+ type = "passive";
+ };
+
sensor3_crit: sensor3-crit {
temperature = <120000>;
hysteresis = <1000>;
type = "critical";
};
};
+
+ cooling-maps {
+ map0 {
+ trip = <&target>;
+ cooling-device = <&a57_0 0 2>;
+ contribution = <1024>;
+ };
+ };
};
};
--
1.9.1
^ permalink raw reply related [flat|nested] 8+ messages in thread* [PATCH/RFT] arm64: dts: renesas: r8a77990: Create thermal zone to support IPA
2018-12-20 20:49 [PATCH/RFT] arm64: dts: renesas: r8a7795: Create thermal zone to support IPA Yoshihiro Kaneko
2018-12-20 20:49 ` [PATCH/RFT] arm64: dts: renesas: r8a7796: " Yoshihiro Kaneko
2018-12-20 20:49 ` [PATCH/RFT] arm64: dts: renesas: r8a77965: " Yoshihiro Kaneko
@ 2018-12-20 20:49 ` Yoshihiro Kaneko
2019-01-10 16:33 ` [PATCH/RFT] arm64: dts: renesas: r8a7795: " Niklas Söderlund
3 siblings, 0 replies; 8+ messages in thread
From: Yoshihiro Kaneko @ 2018-12-20 20:49 UTC (permalink / raw)
To: linux-renesas-soc
Cc: Simon Horman, Geert Uytterhoeven, Magnus Damm, linux-arm-kernel
From: Dien Pham <dien.pham.ry@renesas.com>
Setup a thermal zone driven by SoC temperature sensor.
Create passive trip points and bind them to CPUFreq cooling
device that supports power extension.
In R-Car Gen3, IPA is supportted for only one channel
(on H3/M3/M3N board, it is channel THS3). Reason:
Currently, IPA controls base on only CPU temperature.
And only one thermal channel is assembled closest
CPU cores is selected as target of IPA.
If other channels are used, IPA controlling is not properly.
Signed-off-by: Dien Pham <dien.pham.ry@renesas.com>
[takeshi.kihara.df: fix W=1 dtc unit_address_vs_reg warnings]
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com>
---
This patch is based on the devel branch of Simon Horman's renesas tree.
arch/arm64/boot/dts/renesas/r8a77990.dtsi | 28 +++++++++++++++++++++++++---
1 file changed, 25 insertions(+), 3 deletions(-)
diff --git a/arch/arm64/boot/dts/renesas/r8a77990.dtsi b/arch/arm64/boot/dts/renesas/r8a77990.dtsi
index b2f606e..c37ba9d 100644
--- a/arch/arm64/boot/dts/renesas/r8a77990.dtsi
+++ b/arch/arm64/boot/dts/renesas/r8a77990.dtsi
@@ -66,6 +66,10 @@
power-domains = <&sysc R8A77990_PD_CA53_CPU0>;
next-level-cache = <&L2_CA53>;
enable-method = "psci";
+ #cooling-cells = <2>;
+ dynamic-power-coefficient = <277>;
+ cooling-min-level = <0>;
+ cooling-max-level = <2>;
};
a53_1: cpu@1 {
@@ -1760,11 +1764,24 @@
thermal-zones {
cpu-thermal {
polling-delay-passive = <250>;
- polling-delay = <1000>;
- thermal-sensors = <&thermal>;
+ polling-delay = <0>;
+ thermal-sensors = <&thermal 0>;
+ sustainable-power = <717>;
trips {
- cpu-crit {
+ threshold: trip-point0 {
+ temperature = <90000>;
+ hysteresis = <2000>;
+ type = "passive";
+ };
+
+ target: trip-point1 {
+ temperature = <100000>;
+ hysteresis = <2000>;
+ type = "passive";
+ };
+
+ sensor1_crit: sensor1-crit {
temperature = <120000>;
hysteresis = <2000>;
type = "critical";
@@ -1772,6 +1789,11 @@
};
cooling-maps {
+ map0 {
+ trip = <&target>;
+ cooling-device = <&a53_0 0 2>;
+ contribution = <1024>;
+ };
};
};
};
--
1.9.1
^ permalink raw reply related [flat|nested] 8+ messages in thread* Re: [PATCH/RFT] arm64: dts: renesas: r8a7795: Create thermal zone to support IPA
2018-12-20 20:49 [PATCH/RFT] arm64: dts: renesas: r8a7795: Create thermal zone to support IPA Yoshihiro Kaneko
` (2 preceding siblings ...)
2018-12-20 20:49 ` [PATCH/RFT] arm64: dts: renesas: r8a77990: " Yoshihiro Kaneko
@ 2019-01-10 16:33 ` Niklas Söderlund
2019-04-08 12:29 ` Simon Horman
3 siblings, 1 reply; 8+ messages in thread
From: Niklas Söderlund @ 2019-01-10 16:33 UTC (permalink / raw)
To: Yoshihiro Kaneko
Cc: linux-renesas-soc, Simon Horman, Geert Uytterhoeven, Magnus Damm,
linux-arm-kernel
Hi Keneko-san,
Thanks for your work.
Comments to this patch applies to all patches in this series.
On 2018-12-21 05:49:39 +0900, Yoshihiro Kaneko wrote:
> From: Dien Pham <dien.pham.ry@renesas.com>
>
> [dien.pham.ry: arm64: dts: r8a7795: Add support IPA for CA53 core]
>
> Setup a thermal zone driven by SoC temperature sensor.
> Create passive trip points and bind them to CPUFreq cooling
> device that supports power extension.
>
> In R-Car Gen3, IPA is supportted for only one channel
> (on H3/M3/M3N board, it is channel THS3). Reason:
> Currently, IPA controls base on only CPU temperature.
> And only one thermal channel is assembled closest
> CPU cores is selected as target of IPA.
> If other channels are used, IPA controlling is not properly.
>
> Signed-off-by: Keita Kobayashi <keita.kobayashi.ym@renesas.com>
> [gaku.inami.xw: fix the trip temperature for cooling-device]
> [gaku.inami.xw: fix the power coefficient]
> Signed-off-by: Gaku Inami <gaku.inami.xw@bp.renesas.com>
> Signed-off-by: Hien Dang <hien.dang.eb@rvc.renesas.com>
> Signed-off-by: An Huynh <an.huynh.uj@rvc.renesas.com>
> [takeshi.kihara.df: fix W=1 dtc unit_address_vs_reg warnings]
> Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
> Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com>
> ---
>
> This patch is based on the devel branch of Simon Horman's renesas tree.
>
> arch/arm64/boot/dts/renesas/r8a7795.dtsi | 64 ++++++++++++++------------------
> 1 file changed, 27 insertions(+), 37 deletions(-)
>
> diff --git a/arch/arm64/boot/dts/renesas/r8a7795.dtsi b/arch/arm64/boot/dts/renesas/r8a7795.dtsi
> index af9605d..dd52b50 100644
> --- a/arch/arm64/boot/dts/renesas/r8a7795.dtsi
> +++ b/arch/arm64/boot/dts/renesas/r8a7795.dtsi
> @@ -155,6 +155,9 @@
> power-domains = <&sysc R8A7795_PD_CA57_CPU0>;
> next-level-cache = <&L2_CA57>;
> enable-method = "psci";
> + dynamic-power-coefficient = <854>;
> + cooling-min-level = <0>;
> + cooling-max-level = <2>;
I can't find any documentation or code which makes use of the
cooling-min-level and cooling-max-level properties on v5.0-rc1. What is
the intended usage for these properties?
> clocks = <&cpg CPG_CORE R8A7795_CLK_Z>;
> operating-points-v2 = <&cluster0_opp>;
> capacity-dmips-mhz = <1024>;
> @@ -207,6 +210,10 @@
> power-domains = <&sysc R8A7795_PD_CA53_CPU0>;
> next-level-cache = <&L2_CA53>;
> enable-method = "psci";
> + #cooling-cells = <2>;
> + dynamic-power-coefficient = <277>;
> + cooling-min-level = <0>;
> + cooling-max-level = <2>;
> clocks = <&cpg CPG_CORE R8A7795_CLK_Z2>;
> operating-points-v2 = <&cluster1_opp>;
> capacity-dmips-mhz = <535>;
> @@ -3098,58 +3105,30 @@
> polling-delay-passive = <250>;
> polling-delay = <1000>;
> thermal-sensors = <&tsc 0>;
> + sustainable-power = <6313>;
>
> trips {
> - sensor1_passive: sensor1-passive {
> - temperature = <95000>;
> - hysteresis = <1000>;
> - type = "passive";
> - };
> sensor1_crit: sensor1-crit {
> temperature = <120000>;
> hysteresis = <1000>;
> type = "critical";
> };
> };
> -
> - cooling-maps {
> - map0 {
> - trip = <&sensor1_passive>;
> - cooling-device = <&a57_0 4 4>,
> - <&a57_1 4 4>,
> - <&a57_2 4 4>,
> - <&a57_3 4 4>;
> - };
> - };
> };
>
> sensor_thermal2: sensor-thermal2 {
> polling-delay-passive = <250>;
> polling-delay = <1000>;
> thermal-sensors = <&tsc 1>;
> + sustainable-power = <6313>;
>
> trips {
> - sensor2_passive: sensor2-passive {
> - temperature = <95000>;
> - hysteresis = <1000>;
> - type = "passive";
> - };
> sensor2_crit: sensor2-crit {
> temperature = <120000>;
> hysteresis = <1000>;
> type = "critical";
> };
> };
> -
> - cooling-maps {
> - map0 {
> - trip = <&sensor2_passive>;
> - cooling-device = <&a57_0 4 4>,
> - <&a57_1 4 4>,
> - <&a57_2 4 4>,
> - <&a57_3 4 4>;
> - };
> - };
> };
>
> sensor_thermal3: sensor-thermal3 {
> @@ -3158,11 +3137,18 @@
> thermal-sensors = <&tsc 2>;
>
> trips {
> - sensor3_passive: sensor3-passive {
> - temperature = <95000>;
> + threshold: trip-point0 {
> + temperature = <90000>;
> + hysteresis = <1000>;
> + type = "passive";
> + };
What is the usage of trip-point0? The label threshold is never
referenced anywhere, or am I missing something?
> +
> + target: trip-point1 {
> + temperature = <100000>;
> hysteresis = <1000>;
> type = "passive";
> };
> +
> sensor3_crit: sensor3-crit {
> temperature = <120000>;
> hysteresis = <1000>;
> @@ -3172,11 +3158,15 @@
>
> cooling-maps {
> map0 {
> - trip = <&sensor3_passive>;
> - cooling-device = <&a57_0 4 4>,
> - <&a57_1 4 4>,
> - <&a57_2 4 4>,
> - <&a57_3 4 4>;
> + trip = <&target>;
> + cooling-device = <&a57_0 0 2>;
We have 5 (0-4) cooling states for the A57s on this SoC. Out of
curiosity why allow states 0-2 here and not force it do more cooling or
keep the to max cooling (4) as before this change as this is set to a
trip point with a rather large temperature? Not saying this is wrong
only curious :-)
> + contribution = <1024>;
> + };
> +
> + map1 {
> + trip = <&target>;
> + cooling-device = <&a53_0 0 2>;
> + contribution = <1024>;
> };
> };
> };
> --
> 1.9.1
>
--
Regards,
Niklas Söderlund
^ permalink raw reply [flat|nested] 8+ messages in thread* Re: [PATCH/RFT] arm64: dts: renesas: r8a7795: Create thermal zone to support IPA
2019-01-10 16:33 ` [PATCH/RFT] arm64: dts: renesas: r8a7795: " Niklas Söderlund
@ 2019-04-08 12:29 ` Simon Horman
2019-04-11 16:47 ` Niklas Söderlund
2019-04-24 7:17 ` Geert Uytterhoeven
0 siblings, 2 replies; 8+ messages in thread
From: Simon Horman @ 2019-04-08 12:29 UTC (permalink / raw)
To: Niklas Söderlund
Cc: Yoshihiro Kaneko, linux-renesas-soc, Geert Uytterhoeven,
Magnus Damm, linux-arm-kernel
On Thu, Jan 10, 2019 at 05:33:57PM +0100, Niklas Söderlund wrote:
> Hi Keneko-san,
>
> Thanks for your work.
>
> Comments to this patch applies to all patches in this series.
>
> On 2018-12-21 05:49:39 +0900, Yoshihiro Kaneko wrote:
> > From: Dien Pham <dien.pham.ry@renesas.com>
> >
> > [dien.pham.ry: arm64: dts: r8a7795: Add support IPA for CA53 core]
> >
> > Setup a thermal zone driven by SoC temperature sensor.
> > Create passive trip points and bind them to CPUFreq cooling
> > device that supports power extension.
> >
> > In R-Car Gen3, IPA is supportted for only one channel
> > (on H3/M3/M3N board, it is channel THS3). Reason:
> > Currently, IPA controls base on only CPU temperature.
> > And only one thermal channel is assembled closest
> > CPU cores is selected as target of IPA.
> > If other channels are used, IPA controlling is not properly.
> >
> > Signed-off-by: Keita Kobayashi <keita.kobayashi.ym@renesas.com>
> > [gaku.inami.xw: fix the trip temperature for cooling-device]
> > [gaku.inami.xw: fix the power coefficient]
> > Signed-off-by: Gaku Inami <gaku.inami.xw@bp.renesas.com>
> > Signed-off-by: Hien Dang <hien.dang.eb@rvc.renesas.com>
> > Signed-off-by: An Huynh <an.huynh.uj@rvc.renesas.com>
> > [takeshi.kihara.df: fix W=1 dtc unit_address_vs_reg warnings]
> > Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
> > Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com>
> > ---
> >
> > This patch is based on the devel branch of Simon Horman's renesas tree.
> >
> > arch/arm64/boot/dts/renesas/r8a7795.dtsi | 64 ++++++++++++++------------------
> > 1 file changed, 27 insertions(+), 37 deletions(-)
> >
> > diff --git a/arch/arm64/boot/dts/renesas/r8a7795.dtsi b/arch/arm64/boot/dts/renesas/r8a7795.dtsi
> > index af9605d..dd52b50 100644
> > --- a/arch/arm64/boot/dts/renesas/r8a7795.dtsi
> > +++ b/arch/arm64/boot/dts/renesas/r8a7795.dtsi
> > @@ -155,6 +155,9 @@
> > power-domains = <&sysc R8A7795_PD_CA57_CPU0>;
> > next-level-cache = <&L2_CA57>;
> > enable-method = "psci";
> > + dynamic-power-coefficient = <854>;
> > + cooling-min-level = <0>;
> > + cooling-max-level = <2>;
>
> I can't find any documentation or code which makes use of the
> cooling-min-level and cooling-max-level properties on v5.0-rc1. What is
> the intended usage for these properties?
It looks like these properties were removed in v4.17-rc1 by
bbcf071969b2 ("cpufreq: cpu0: rename driver and internals to 'cpufreq_dt'")
and should be dropped from this and similar patches.
>
> > clocks = <&cpg CPG_CORE R8A7795_CLK_Z>;
> > operating-points-v2 = <&cluster0_opp>;
> > capacity-dmips-mhz = <1024>;
> > @@ -207,6 +210,10 @@
> > power-domains = <&sysc R8A7795_PD_CA53_CPU0>;
> > next-level-cache = <&L2_CA53>;
> > enable-method = "psci";
> > + #cooling-cells = <2>;
> > + dynamic-power-coefficient = <277>;
> > + cooling-min-level = <0>;
> > + cooling-max-level = <2>;
> > clocks = <&cpg CPG_CORE R8A7795_CLK_Z2>;
> > operating-points-v2 = <&cluster1_opp>;
> > capacity-dmips-mhz = <535>;
> > @@ -3098,58 +3105,30 @@
> > polling-delay-passive = <250>;
> > polling-delay = <1000>;
> > thermal-sensors = <&tsc 0>;
> > + sustainable-power = <6313>;
> >
> > trips {
> > - sensor1_passive: sensor1-passive {
> > - temperature = <95000>;
> > - hysteresis = <1000>;
> > - type = "passive";
> > - };
> > sensor1_crit: sensor1-crit {
> > temperature = <120000>;
> > hysteresis = <1000>;
> > type = "critical";
> > };
> > };
> > -
> > - cooling-maps {
> > - map0 {
> > - trip = <&sensor1_passive>;
> > - cooling-device = <&a57_0 4 4>,
> > - <&a57_1 4 4>,
> > - <&a57_2 4 4>,
> > - <&a57_3 4 4>;
> > - };
> > - };
> > };
> >
> > sensor_thermal2: sensor-thermal2 {
> > polling-delay-passive = <250>;
> > polling-delay = <1000>;
> > thermal-sensors = <&tsc 1>;
> > + sustainable-power = <6313>;
> >
> > trips {
> > - sensor2_passive: sensor2-passive {
> > - temperature = <95000>;
> > - hysteresis = <1000>;
> > - type = "passive";
> > - };
> > sensor2_crit: sensor2-crit {
> > temperature = <120000>;
> > hysteresis = <1000>;
> > type = "critical";
> > };
> > };
> > -
> > - cooling-maps {
> > - map0 {
> > - trip = <&sensor2_passive>;
> > - cooling-device = <&a57_0 4 4>,
> > - <&a57_1 4 4>,
> > - <&a57_2 4 4>,
> > - <&a57_3 4 4>;
> > - };
> > - };
> > };
> >
> > sensor_thermal3: sensor-thermal3 {
> > @@ -3158,11 +3137,18 @@
> > thermal-sensors = <&tsc 2>;
> >
> > trips {
> > - sensor3_passive: sensor3-passive {
> > - temperature = <95000>;
> > + threshold: trip-point0 {
> > + temperature = <90000>;
> > + hysteresis = <1000>;
> > + type = "passive";
> > + };
>
> What is the usage of trip-point0? The label threshold is never
> referenced anywhere, or am I missing something?
Good point. Given this patch in its current form I think trip-point0
should be dropped.
>
> > +
> > + target: trip-point1 {
> > + temperature = <100000>;
> > hysteresis = <1000>;
> > type = "passive";
> > };
> > +
> > sensor3_crit: sensor3-crit {
> > temperature = <120000>;
> > hysteresis = <1000>;
> > @@ -3172,11 +3158,15 @@
> >
> > cooling-maps {
> > map0 {
> > - trip = <&sensor3_passive>;
> > - cooling-device = <&a57_0 4 4>,
> > - <&a57_1 4 4>,
> > - <&a57_2 4 4>,
> > - <&a57_3 4 4>;
> > + trip = <&target>;
> > + cooling-device = <&a57_0 0 2>;
>
> We have 5 (0-4) cooling states for the A57s on this SoC. Out of
> curiosity why allow states 0-2 here and not force it do more cooling or
> keep the to max cooling (4) as before this change as this is set to a
> trip point with a rather large temperature? Not saying this is wrong
> only curious :-)
This I do not know. Do you think it would be worth following-up on
internally?
> > + contribution = <1024>;
> > + };
> > +
> > + map1 {
> > + trip = <&target>;
> > + cooling-device = <&a53_0 0 2>;
> > + contribution = <1024>;
> > };
> > };
> > };
> > --
> > 1.9.1
> >
>
> --
> Regards,
> Niklas Söderlund
>
^ permalink raw reply [flat|nested] 8+ messages in thread* Re: [PATCH/RFT] arm64: dts: renesas: r8a7795: Create thermal zone to support IPA
2019-04-08 12:29 ` Simon Horman
@ 2019-04-11 16:47 ` Niklas Söderlund
2019-04-24 7:17 ` Geert Uytterhoeven
1 sibling, 0 replies; 8+ messages in thread
From: Niklas Söderlund @ 2019-04-11 16:47 UTC (permalink / raw)
To: Simon Horman
Cc: Yoshihiro Kaneko, linux-renesas-soc, Geert Uytterhoeven,
Magnus Damm, linux-arm-kernel
Hi Simon,
On 2019-04-08 14:29:41 +0200, Simon Horman wrote:
> > > @@ -3172,11 +3158,15 @@
> > >
> > > cooling-maps {
> > > map0 {
> > > - trip = <&sensor3_passive>;
> > > - cooling-device = <&a57_0 4 4>,
> > > - <&a57_1 4 4>,
> > > - <&a57_2 4 4>,
> > > - <&a57_3 4 4>;
> > > + trip = <&target>;
> > > + cooling-device = <&a57_0 0 2>;
> >
> > We have 5 (0-4) cooling states for the A57s on this SoC. Out of
> > curiosity why allow states 0-2 here and not force it do more cooling or
> > keep the to max cooling (4) as before this change as this is set to a
> > trip point with a rather large temperature? Not saying this is wrong
> > only curious :-)
>
> This I do not know. Do you think it would be worth following-up on
> internally?
I'm no expert on this but I think it could be educational to learn why
not the full range is used. Still this might be correct so I don't want
to block this patch based on my ignorance.
--
Regards,
Niklas Söderlund
^ permalink raw reply [flat|nested] 8+ messages in thread* Re: [PATCH/RFT] arm64: dts: renesas: r8a7795: Create thermal zone to support IPA
2019-04-08 12:29 ` Simon Horman
2019-04-11 16:47 ` Niklas Söderlund
@ 2019-04-24 7:17 ` Geert Uytterhoeven
1 sibling, 0 replies; 8+ messages in thread
From: Geert Uytterhoeven @ 2019-04-24 7:17 UTC (permalink / raw)
To: Simon Horman
Cc: Niklas Söderlund, Yoshihiro Kaneko, Linux-Renesas,
Magnus Damm, Linux ARM
Hi Simon,
On Mon, Apr 8, 2019 at 2:29 PM Simon Horman <horms@verge.net.au> wrote:
> On Thu, Jan 10, 2019 at 05:33:57PM +0100, Niklas Söderlund wrote:
> > On 2018-12-21 05:49:39 +0900, Yoshihiro Kaneko wrote:
> > > From: Dien Pham <dien.pham.ry@renesas.com>
> > >
> > > [dien.pham.ry: arm64: dts: r8a7795: Add support IPA for CA53 core]
> > >
> > > Setup a thermal zone driven by SoC temperature sensor.
> > > Create passive trip points and bind them to CPUFreq cooling
> > > device that supports power extension.
> > >
> > > In R-Car Gen3, IPA is supportted for only one channel
> > > (on H3/M3/M3N board, it is channel THS3). Reason:
> > > Currently, IPA controls base on only CPU temperature.
> > > And only one thermal channel is assembled closest
> > > CPU cores is selected as target of IPA.
> > > If other channels are used, IPA controlling is not properly.
> > >
> > > Signed-off-by: Keita Kobayashi <keita.kobayashi.ym@renesas.com>
> > > [gaku.inami.xw: fix the trip temperature for cooling-device]
> > > [gaku.inami.xw: fix the power coefficient]
> > > Signed-off-by: Gaku Inami <gaku.inami.xw@bp.renesas.com>
> > > Signed-off-by: Hien Dang <hien.dang.eb@rvc.renesas.com>
> > > Signed-off-by: An Huynh <an.huynh.uj@rvc.renesas.com>
> > > [takeshi.kihara.df: fix W=1 dtc unit_address_vs_reg warnings]
> > > Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
> > > Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com>
> > > ---
> > >
> > > This patch is based on the devel branch of Simon Horman's renesas tree.
> > >
> > > arch/arm64/boot/dts/renesas/r8a7795.dtsi | 64 ++++++++++++++------------------
> > > 1 file changed, 27 insertions(+), 37 deletions(-)
> > >
> > > diff --git a/arch/arm64/boot/dts/renesas/r8a7795.dtsi b/arch/arm64/boot/dts/renesas/r8a7795.dtsi
> > > index af9605d..dd52b50 100644
> > > --- a/arch/arm64/boot/dts/renesas/r8a7795.dtsi
> > > +++ b/arch/arm64/boot/dts/renesas/r8a7795.dtsi
> > > @@ -155,6 +155,9 @@
> > > power-domains = <&sysc R8A7795_PD_CA57_CPU0>;
> > > next-level-cache = <&L2_CA57>;
> > > enable-method = "psci";
> > > + dynamic-power-coefficient = <854>;
> > > + cooling-min-level = <0>;
> > > + cooling-max-level = <2>;
> >
> > I can't find any documentation or code which makes use of the
> > cooling-min-level and cooling-max-level properties on v5.0-rc1. What is
> > the intended usage for these properties?
>
> It looks like these properties were removed in v4.17-rc1 by
> bbcf071969b2 ("cpufreq: cpu0: rename driver and internals to 'cpufreq_dt'")
> and should be dropped from this and similar patches.
See commit e04907dbc25930b8 ("dt-bindings: thermal: Remove
"cooling-{min|max}-level" properties").
Gr{oetje,eeting}s,
Geert
--
Geert Uytterhoeven -- There's lots of Linux beyond ia32 -- geert@linux-m68k.org
In personal conversations with technical people, I call myself a hacker. But
when I'm talking to journalists I just say "programmer" or something like that.
-- Linus Torvalds
^ permalink raw reply [flat|nested] 8+ messages in thread