It was <2020-08-25 wto 20:51>, when Krzysztof Kozlowski wrote:
> On Tue, Aug 25, 2020 at 07:03:11PM +0200, Łukasz Stelmach wrote:
>> Enable ax88796c driver for the ethernet chip on Exynos3250-based
>> ARTIK5 boards.
>> 
>> Signed-off-by: Łukasz Stelmach <l.stelmach@samsung.com>
>> ---
>>  arch/arm/configs/exynos_defconfig   | 2 ++
>>  arch/arm/configs/multi_v7_defconfig | 2 ++
>>  2 files changed, 4 insertions(+)
>> 
>> Please DO NOT merge before these two
>
> Sure, it can wait but shouldn't actually DT wait? It's only defconfig so
> it does not change anything except automated systems booting these
> defconfigs... The boards might be broken by DT.

I was told, to ask for deferred merge of defconfig and it makes sense to
me. DT won't break anything if the driver isn't compiled. However, I can
see that you have a word you may decide about DT too. My point is to
wait until spi-s3c64xx patches are merged and not to break ARTIK5
boards.

>> 
>>   https://lore.kernel.org/lkml/20200821161401.11307-2-l.stelmach@samsung.com/
>>   https://lore.kernel.org/lkml/20200821161401.11307-3-l.stelmach@samsung.com/
>> 
>> diff --git a/arch/arm/configs/exynos_defconfig b/arch/arm/configs/exynos_defconfig
>> index 6e8b5ff0859c..82480b2bf545 100644
>> --- a/arch/arm/configs/exynos_defconfig
>> +++ b/arch/arm/configs/exynos_defconfig
>> @@ -107,6 +107,8 @@ CONFIG_MD=y
>>  CONFIG_BLK_DEV_DM=y
>>  CONFIG_DM_CRYPT=m
>>  CONFIG_NETDEVICES=y
>> +CONFIG_NET_VENDOR_ASIX=y
>> +CONFIG_SPI_AX88796C=y
>>  CONFIG_SMSC911X=y
>>  CONFIG_USB_RTL8150=m
>>  CONFIG_USB_RTL8152=y
>> diff --git a/arch/arm/configs/multi_v7_defconfig b/arch/arm/configs/multi_v7_defconfig
>> index e9e76e32f10f..a8b4e95d4148 100644
>> --- a/arch/arm/configs/multi_v7_defconfig
>> +++ b/arch/arm/configs/multi_v7_defconfig
>> @@ -241,6 +241,8 @@ CONFIG_SATA_HIGHBANK=y
>>  CONFIG_SATA_MV=y
>>  CONFIG_SATA_RCAR=y
>>  CONFIG_NETDEVICES=y
>> +CONFIG_NET_VENDOR_ASIX=y
>> +CONFIG_SPI_AX88796C=m
>>  CONFIG_VIRTIO_NET=y
>>  CONFIG_B53_SPI_DRIVER=m
>>  CONFIG_B53_MDIO_DRIVER=m
>> -- 
>> 2.26.2
>> 
>
>

-- 
Łukasz Stelmach
Samsung R&D Institute Poland
Samsung Electronics