From mboxrd@z Thu Jan 1 00:00:00 1970 Return-Path: Received: (majordomo@vger.kernel.org) by vger.kernel.org via listexpand id S1760070AbbBJAh6 (ORCPT ); Mon, 9 Feb 2015 19:37:58 -0500 Received: from mail-pd0-f170.google.com ([209.85.192.170]:38307 "EHLO mail-pd0-f170.google.com" rhost-flags-OK-OK-OK-OK) by vger.kernel.org with ESMTP id S932686AbbBJAhz (ORCPT ); Mon, 9 Feb 2015 19:37:55 -0500 From: Eduardo Valentin To: Rui Zhang , ezequiel.garcia@free-electrons.com, amit.kachhap@linaro.org, viresh.kumar@linaro.org, amit.daniel@samsung.com, hongbo.zhang@linaro.com, andrew@lunn.ch, durgadoss.r@intel.com, peter@piie.net, shawn.guo@linaro.org, aaron.lu@intel.com, caesar.wang@rock-chips.com, b.zolnierkie@samsung.com, l.majewski@samsung.com, vincenzo.frascino@st.com, mperttunen@nvidia.com, mikko.perttunen@kapsi.fi, srinivas.pandruvada@linux.intel.com, jacob.jun.pan@linux.intel.com, bcousson@baylibre.com Cc: LKML , Linux PM , Eduardo Valentin Subject: [PATCH RFC 02/12] Documentation: thermal docbook: add glossary Date: Mon, 9 Feb 2015 17:34:03 -0400 Message-Id: <1423517653-11359-3-git-send-email-edubezval@gmail.com> X-Mailer: git-send-email 2.1.3 In-Reply-To: <1423517653-11359-1-git-send-email-edubezval@gmail.com> References: <1423517653-11359-1-git-send-email-edubezval@gmail.com> Sender: linux-kernel-owner@vger.kernel.org List-ID: X-Mailing-List: linux-kernel@vger.kernel.org This change introduces a section in the Introduction Chapter to list concepts used by the Thermal Framework. Signed-off-by: Eduardo Valentin --- Documentation/DocBook/thermal.tmpl | 129 ++++++++++++++++++++++++++++++++++++- 1 file changed, 128 insertions(+), 1 deletion(-) diff --git a/Documentation/DocBook/thermal.tmpl b/Documentation/DocBook/thermal.tmpl index f8fb8a2..66efed3 100644 --- a/Documentation/DocBook/thermal.tmpl +++ b/Documentation/DocBook/thermal.tmpl @@ -84,5 +84,132 @@ devices. - + + Glossary + The Linux Kernel Thermal Framework uses a + specific terminology to represent the entities involved + in thermal constrained environments. This section + summaries the terminology as dictionary. These terms are + in use within the present document and in the source + code of the Linux Kernel Thermal Framework. + + + + Thermal Zone + + Thermal zones represent + what is the current status of a + thermal constrained zone in the + hardware. The zone usually is a + device or component. The status + of a thermal zone is mainly with + respect to temperature. + Currently, the Linux Kernel + Thermal Framework represents + temperature in miliCelsius. The + current abstraction covers for + non negative temperatures and + constraints. + + + + + Thermal Sensors + + Thermal sensors provide + temperature sensing capabilities + on thermal zones. Typical + devices are I2C ADC converters + and bandgaps. These are nodes + providing temperature data to + thermal zones. Thermal sensor + devices may control one or more + internal sensors. + + + + + Trips Points + + The trip node describes a + point in the temperature domain + in which the system takes an + action. This item describes just + the point, not the action. Trip + points are represented as + temperature in miliCelsius. The + current abstraction covers for + non negative temperatures. + + + + + Thermal Governor + + Thermal Governors + represent a policy to manage the + thermal zone device temperature. + The governor targets to keep + temperature in an acceptable + range which correlates to the + power budget, while maximizing + the performance. Governors can + be implemented in Kernel Space + or in User Space. + + + + + Thermal Cooling Device + + Cooling devices provide + control on power dissipation. + There are essentially two ways + to provide control on power + dissipation. First is by means + of regulating device + performance, which is known as + passive cooling. A typical + passive cooling is a CPU that + has dynamic voltage and + frequency scaling (DVFS), and + uses lower frequencies as + cooling states. Second is by + means of activating devices in + order to remove the dissipated + heat, which is known as active + cooling, e.g. regulating fan + speeds. In both cases, cooling + devices shall have a way to + determine the state of cooling + in which the device is. + + + + + Cooling State + + Any cooling device has a + range of cooling states (i.e. + different levels of heat + dissipation). For example a + fan's cooling states correspond + to the different fan speeds + possible. Cooling states are + referred to by single unsigned + integers, where larger numbers + mean greater heat dissipation. + The precise set of cooling + states associated with a device + (as referred to be the + cooling-min-state and + cooling-max-state properties) + should be defined in a + particular device's binding. + + + + + + -- 2.1.3