From mboxrd@z Thu Jan 1 00:00:00 1970 Return-Path: Received: (majordomo@vger.kernel.org) by vger.kernel.org via listexpand id S1752688AbbCaG64 (ORCPT ); Tue, 31 Mar 2015 02:58:56 -0400 Received: from szxga03-in.huawei.com ([119.145.14.66]:35239 "EHLO szxga03-in.huawei.com" rhost-flags-OK-OK-OK-OK) by vger.kernel.org with ESMTP id S1750910AbbCaG6y (ORCPT ); Tue, 31 Mar 2015 02:58:54 -0400 From: Xinwei Kong To: , CC: , , , , , , , , , Subject: [PATCH v2 0/2] 96boards: add thermal senor support to hikey board Date: Tue, 31 Mar 2015 14:59:20 +0800 Message-ID: <1427785162-15172-1-git-send-email-kong.kongxinwei@hisilicon.com> X-Mailer: git-send-email 1.9.4.msysgit.2 MIME-Version: 1.0 Content-Type: text/plain X-Originating-IP: [10.46.108.143] X-CFilter-Loop: Reflected X-Mirapoint-Virus-RAPID-Raw: score=unknown(0), refid=str=0001.0A020203.551A45A1.00AF,ss=1,re=0.001,recu=0.000,reip=0.000,cl=1,cld=1,fgs=0, ip=0.0.0.0, so=2013-05-26 15:14:31, dmn=2013-03-21 17:37:32 X-Mirapoint-Loop-Id: 4c7b2342dc655d45810d034fd55c2755 Sender: linux-kernel-owner@vger.kernel.org List-ID: X-Mailing-List: linux-kernel@vger.kernel.org From: kongxinwei Thank you all for giving this v1 patches stages some comments. Here is v2 patches and address all the issues raised as part of v1 review. The Linaro connect introduce 96boards series in Hong Kong,The HiKey board is the first board to be certified 96Boards Consumer Edition compatible. This board is based on the HiSilicon SoC. you can get more information from https://www.96boards.org. The hisilicon SoC contains thermal module, this thermal module has 4 sensors, - sensor 0: local sensor; - sensor 1: remote sensor for ACPU cluster 1; - sensor 2: remote sensor for ACPU cluster 2; - sensor 3: remote sensor for GPU; It can obtain this device temperature by operating this hardware. The new sensor driver satisfies thermal framework and to realize the ACPU ,GPU and so on to cool function. Changes v0->v1; * Delete this hi6220 dtsi. * Fix documentation and error checks. * Modify this driver which makes use of kernel to decide how to dynamically bind the interrupt to hottest sensor. * Delete "sensor-thres-temp" property and read thermal_zone trips points replace of it. * Delete "sensor-reset-temp" property and define the fixed value replace of it. Changes v1->v2; * change patch's situation between binding document and driver file * clean up some regiser for enabling thermal sensor * use mutex lock to replace the spin lock kongxinwei (2): dt-bindings: Document the hi6220 thermal sensor bindings thermal: hisilicon: add new hisilicon thermal sensor driver .../bindings/thermal/hisilicon-thermal.txt | 45 ++ drivers/thermal/Kconfig | 8 + drivers/thermal/Makefile | 1 + drivers/thermal/hisi_thermal.c | 475 +++++++++++++++++++++ 4 files changed, 529 insertions(+) create mode 100644 Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt create mode 100644 drivers/thermal/hisi_thermal.c -- 1.9.1