From mboxrd@z Thu Jan 1 00:00:00 1970 Return-Path: Received: (majordomo@vger.kernel.org) by vger.kernel.org via listexpand id S1753299AbbKBKq2 (ORCPT ); Mon, 2 Nov 2015 05:46:28 -0500 Received: from mailgw02.mediatek.com ([210.61.82.184]:58030 "EHLO mailgw02.mediatek.com" rhost-flags-OK-FAIL-OK-FAIL) by vger.kernel.org with ESMTP id S1753197AbbKBKqZ (ORCPT ); Mon, 2 Nov 2015 05:46:25 -0500 X-Listener-Flag: 11101 Message-ID: <1446461181.10039.28.camel@mtksdaap41> Subject: Re: [PATCH v3 0/2] thermal: mediatek: Add cpu power cooling model From: dawei chien To: Viresh Kumar CC: "Rafael J. Wysocki" , Rob Herring , Pawel Moll , Mark Rutland , Ian Campbell , "Kumar Gala" , Matthias Brugger , Daniel Kurtz , Sascha Hauer , Daniel Lezcano , , , , , , , Sascha Hauer Date: Mon, 2 Nov 2015 18:46:21 +0800 In-Reply-To: <20151028154449.GH3716@ubuntu> References: <1445515359-8587-1-git-send-email-dawei.chien@mediatek.com> <20151028154449.GH3716@ubuntu> Content-Type: text/plain; charset="UTF-8" X-Mailer: Evolution 3.2.3-0ubuntu6 Content-Transfer-Encoding: 7bit MIME-Version: 1.0 X-MTK: N Sender: linux-kernel-owner@vger.kernel.org List-ID: X-Mailing-List: linux-kernel@vger.kernel.org Hi Viresh, On Wed, 2015-10-28 at 21:14 +0530, Viresh Kumar wrote: > On 22-10-15, 20:02, Dawei Chien wrote: > > Use Intelligent Power Allocation (IPA) technical to add static/dynamic power model for binding CPU thermal zone. > > The power allocator governor allocates power budget to control CPU temperature. > > > > Power Allocator governor is able to keep SOC temperature within a defined temperature range to avoid SOC overheat and keep it's performance. mt8173-cpufreq.c need to register its' own power model with power allocator thermal governor, so that power allocator governor can allocates suitable power budget to control CPU temperature. > > > > PATCH1 is base on > > https://patchwork.kernel.org/patch/7034601/ > > > > PATCH2 is base on Sascha's thermal driver V9 > > https://patchwork.kernel.org/patch/7249821/ > > https://patchwork.kernel.org/patch/7249861/ > > https://patchwork.kernel.org/patch/7249891/ > > > > Change since V1: > > include mt8171.h and sort header file for mt8173.dtsi > > > > Change since V2: > > Move dynamic/static power model in device tree > > > > Dawei.Chien (2): > > thermal: mediatek: Add cpu power cooling model. > > arm64: dts: mt8173: Add thermal zone node for mt8173. > > Sorry for being extremely late in reviewing this stuff. You are > already on v3 and I haven't reviewed it once. Mostly due to bad timing > of my holidays and other work pressure. You're welcome, truly thank you for your kindly reviewing > Now, there are few things that I feel are not properly addressed here, > and I may be wrong: > - Where are the bindings for static-power-points and > dynamic-power-coefficient. Sorry I failed to see them in this or > other series you mentioned. Please refer to following document (2-1,2-2) for dynamic-power & static-power in detail. Besides, do I need to add another document for our own MT8173 IC. http://lxr.free-electrons.com/source/Documentation/thermal/cpu-cooling-api.txt > - Even then, why should we be adding another table into DT for > voltage/power ? And not reuse and extend the opp-v2 stuff which is > already mainlined now. We could reuse opp-v2 for static power points after OPPV2 back port to our currently branch. However, as far as I know, there is no "power" in opp.c (suck like opp-hz) as far, so I need to add something in opp.c for my purpose, suck like add power in _opp_add_static_v2, and add something for return "power", right? I may be wrong, please kindly give me your suggestion, thank you. Actually, I am considering to remove the part of static power point since it is optional for Power Model. Could you agree with this? > - There are few issues with the code as well, but I want to see where > the bindings should go first. And then only discuss the code > further. >