From mboxrd@z Thu Jan 1 00:00:00 1970 Return-Path: Received: (majordomo@vger.kernel.org) by vger.kernel.org via listexpand id S1751456AbdH2IYO (ORCPT ); Tue, 29 Aug 2017 04:24:14 -0400 Received: from szxga04-in.huawei.com ([45.249.212.190]:5482 "EHLO szxga04-in.huawei.com" rhost-flags-OK-OK-OK-OK) by vger.kernel.org with ESMTP id S1751294AbdH2IYG (ORCPT ); Tue, 29 Aug 2017 04:24:06 -0400 From: Tao Wang To: , , , , , , CC: , , , , , , , Subject: [PATCH v4 1/3] dt-bindings: Document the hi3660 thermal sensor bindings Date: Tue, 29 Aug 2017 16:17:44 +0800 Message-ID: <1503994666-13954-2-git-send-email-kevin.wangtao@hisilicon.com> X-Mailer: git-send-email 2.8.1 In-Reply-To: <1503994666-13954-1-git-send-email-kevin.wangtao@hisilicon.com> References: <1503994666-13954-1-git-send-email-kevin.wangtao@hisilicon.com> MIME-Version: 1.0 Content-Type: text/plain X-Originating-IP: [10.177.161.152] X-CFilter-Loop: Reflected X-Mirapoint-Virus-RAPID-Raw: score=unknown(0), refid=str=0001.0A090203.59A524A4.0059,ss=1,re=0.000,recu=0.000,reip=0.000,cl=1,cld=1,fgs=0, ip=0.0.0.0, so=2014-11-16 11:51:01, dmn=2013-03-21 17:37:32 X-Mirapoint-Loop-Id: bc4b412c19a7039dd17be252292c34a6 Sender: linux-kernel-owner@vger.kernel.org List-ID: X-Mailing-List: linux-kernel@vger.kernel.org From: Tao Wang This adds documentation of device tree bindings for the thermal sensor controller of hi3660 SoC. Signed-off-by: Tao Wang --- .../devicetree/bindings/thermal/hisi-tsensor.txt | 37 ++++++++++++++++++++++ 1 file changed, 37 insertions(+) create mode 100644 Documentation/devicetree/bindings/thermal/hisi-tsensor.txt diff --git a/Documentation/devicetree/bindings/thermal/hisi-tsensor.txt b/Documentation/devicetree/bindings/thermal/hisi-tsensor.txt new file mode 100644 index 0000000..4643dbe --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/hisi-tsensor.txt @@ -0,0 +1,37 @@ +* Temperature Sensor on hisilicon SoC + +Hisilicon SoC supplies temperature sensor feature, each CPU cluster and G3D +area contains a temperture sensor. The temperture sensor produces an output +value which has a linear relationship with the temperture of the area. + +for Hi3660, +sensor0 monitors the temperture of A53; +sensor1 monitors the temperture of A72; +sensor2 monitors the temperture of GPU; +sensor3 is a virtual sensor, which produces the maximum value of all sensors; +sensor4 is a virtual sensor, which produces the average value of all sensors. + +** Required properties : +- compatible: "hisilicon,thermal-tsensor". +- reg: physical reg address of thermal sensor and length of memory mapped + region. +- hisi,tsensors: number of hardware tsensors +- hisi,coef: An array of integers (one signed cell) containing + coefficients to turn adc value to temperture. +- hisi,adc-range: adc value range, minimum value is followed by maximum value. +- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a description. + +Example : +Hi3660: +tsensor: tsensor@fff30000 { + compatible = "hisilicon,hi3660-tsensor"; + #address-cells = <2>; + #size-cells = <2>; + reg = <0x0 0xfff3001c 0x0 0x4>, + <0x0 0xfff3005c 0x0 0x4>, + <0x0 0xfff3009c 0x0 0x4>; + hisi,tsensors = ; + hisi,coef = <165000 (-40000)>; + hisi,adc-range = <0x74 0x39A>; + #thermal-sensor-cells = <1>; +}; -- 2.8.1