From mboxrd@z Thu Jan 1 00:00:00 1970 Return-Path: X-Spam-Checker-Version: SpamAssassin 3.4.0 (2014-02-07) on aws-us-west-2-korg-lkml-1.web.codeaurora.org X-Spam-Level: X-Spam-Status: No, score=-3.8 required=3.0 tests=HEADER_FROM_DIFFERENT_DOMAINS, MAILING_LIST_MULTI,SPF_HELO_NONE,SPF_PASS,USER_AGENT_GIT autolearn=no autolearn_force=no version=3.4.0 Received: from mail.kernel.org (mail.kernel.org [198.145.29.99]) by smtp.lore.kernel.org (Postfix) with ESMTP id 6F3C3C43331 for ; Wed, 1 Apr 2020 05:17:05 +0000 (UTC) Received: from vger.kernel.org (vger.kernel.org [209.132.180.67]) by mail.kernel.org (Postfix) with ESMTP id 4641D2072E for ; Wed, 1 Apr 2020 05:17:05 +0000 (UTC) Received: (majordomo@vger.kernel.org) by vger.kernel.org via listexpand id S1731810AbgDAFRE (ORCPT ); Wed, 1 Apr 2020 01:17:04 -0400 Received: from alexa-out-blr-02.qualcomm.com ([103.229.18.198]:14851 "EHLO alexa-out-blr-02.qualcomm.com" rhost-flags-OK-OK-OK-OK) by vger.kernel.org with ESMTP id S1731783AbgDAFRB (ORCPT ); Wed, 1 Apr 2020 01:17:01 -0400 Received: from ironmsg02-blr.qualcomm.com ([10.86.208.131]) by alexa-out-blr-02.qualcomm.com with ESMTP/TLS/AES256-SHA; 01 Apr 2020 10:46:12 +0530 Received: from c-sanm-linux.qualcomm.com ([10.206.25.31]) by ironmsg02-blr.qualcomm.com with ESMTP; 01 Apr 2020 10:45:50 +0530 Received: by c-sanm-linux.qualcomm.com (Postfix, from userid 2343233) id 822392619; Wed, 1 Apr 2020 10:45:49 +0530 (IST) From: Sandeep Maheswaram To: Andy Gross , Bjorn Andersson , Greg Kroah-Hartman , Rob Herring , Mark Rutland , Felipe Balbi , Stephen Boyd , Doug Anderson , Matthias Kaehlcke Cc: linux-arm-msm@vger.kernel.org, linux-usb@vger.kernel.org, devicetree@vger.kernel.org, linux-kernel@vger.kernel.org, Manu Gautam , Chandana Kishori Chiluveru , Sandeep Maheswaram Subject: [PATCH v7 0/4] ADD interconnect support for Qualcomm DWC3 driver Date: Wed, 1 Apr 2020 10:45:41 +0530 Message-Id: <1585718145-29537-1-git-send-email-sanm@codeaurora.org> X-Mailer: git-send-email 2.7.4 Sender: linux-kernel-owner@vger.kernel.org Precedence: bulk List-ID: X-Mailing-List: linux-kernel@vger.kernel.org This path series aims to add interconnect support in dwc3-qcom driver on SDM845 and SC7180 SoCs. Changes from v6 -> v7 > [PATCH 2/4] Fixed review comments from Matthias in DWC3 driver. > Other patches remain unchanged. Changes from v5 -> v6 > [PATCH 1/4] Addressed comments from Rob. > [PATCH 2/4] Fixed review comments from Matthias in DWC3 driver. > [PATCH 3/4] Ignoring 80 char limit in defining interconnect paths. > Added [PATCH 4/4] in this series. Adding interconnect nodes for SC7180. Depends on patch https://patchwork.kernel.org/patch/11417989/. Changes from v4 -> v5 > [PATCH 1/3] Added the interconnect properties in yaml. This patch depends on series https://patchwork.kernel.org/cover/11372641/. > [PATCH 2/3] Fixed review comments from Matthias in DWC3 driver. > [PATCH 3/3] Modified as per the new interconnect nodes in sdm845. Depends on series https://patchwork.kernel.org/cover/11372211/. Changes from v3 -> v4 > Fixed review comments from Matthias > [PATCH 1/3] and [PATCH 3/3] remains unchanged Changes from v2 -> v3 > Fixed review comments from Matthias and Manu > changed the functions prefix from usb_* to dwc3_qcom_* Changes since V1: > Comments by Georgi Djakov on "[PATCH 2/3]" addressed > [PATCH 1/3] and [PATCH 3/3] remains unchanged Sandeep Maheswaram (4): dt-bindings: usb: qcom,dwc3: Introduce interconnect properties for Qualcomm DWC3 driver usb: dwc3: qcom: Add interconnect support in dwc3 driver arm64: dts: qcom: sdm845: Add interconnect properties for USB arm64: dts: qcom: sc7180: Add interconnect properties for USB .../devicetree/bindings/usb/qcom,dwc3.yaml | 8 ++ arch/arm64/boot/dts/qcom/sc7180.dtsi | 4 + arch/arm64/boot/dts/qcom/sdm845.dtsi | 8 ++ drivers/usb/dwc3/dwc3-qcom.c | 128 ++++++++++++++++++++- 4 files changed, 146 insertions(+), 2 deletions(-) -- QUALCOMM INDIA, on behalf of Qualcomm Innovation Center, Inc. is a member of Code Aurora Forum, hosted by The Linux Foundation