On Tue, Feb 10, 2015 at 02:50:36PM -0800, Randy Dunlap wrote:
> On 02/09/15 13:34, Eduardo Valentin wrote:
> 
> > +	<chapter id="introduction">
> > +		<title>Introduction</title>
> > +		<para>Thermal management is any method or technique implied to
> > +		mitigate emergencies caused by operating devices within
> > +		unsupported temperatures. The challenge consists of designing a
> 
> I would flip the ending of that sentence:
> 		                     caused by operating devices outside of
> 		supported temperatures.
> 
> > +		product keeping the junction temperature of the IC components.
> > +		The operating temperature of IC components used on products must
> > +		operate within their design limits. Besides, temperature towards
> > +		device enclosure must be in a comfort level for the user.
> > +		Therefore, thermal management, by the time of this writing,
> > +		starts in very early device design phase. Managing thermal may
> > +		involve different disciplines, at different stages, such as
> > +		temperature monitoring, floorplanning, microarchitectural
> > +		techniques, compiler techniques, OS techniques, liquid cooling,
> > +		and thermal reliability or security. This document covers what
> > +		the Linux Kernel Thermal Framework provides as abstraction to
> > +		users with respect to thermal management.  
> > +		</para>
> > +		<para>One of the first proposals to provide a solution to cover
> > +		the thermal problem appears in the Advanced Configuration and
> > +		Power Interface (ACPI) specification. ACPI provides an open
> > +		standard for device configuration and power management by the
> > +		operating system. However, several computing devices which may
> > +		have thermal issues in the market disregard the ACPI standard.
> > +		Therefore, the Linux Kernel Thermal Framework has been designed
> > +		to serve as abstraction for ACPI and non-ACPI systems. The core
> > +		concepts applies in both types of systems. 
> > +		</para>
> > +		<para>The Linux Kernel Thermal Framework has a design which
> > +		represents the different thermal constraints found in an
> 
> drop:		                                                      an^^
> 
> > +		end-products. The thermal constraints exist to serve different
> > +		purposes. There two major types of thermal constraints. The
> 
> 		          There are two
> 
> > +		first is related to components junction temperature. The second
> > +		is related to the level of comfort while end users are handling
> > +		devices.
> > +		</para>
> > +
> > +  </chapter>
> > +</book>
> > 
> 
> 
> -- 
> ~Randy

Thanks Randy for checking this up. I apologize for forgetting Ccing you
in my original post. I will fix the text as per your suggestions and
also copy you in next version.

Thanks for you time.

Eduardo Valentin