From mboxrd@z Thu Jan 1 00:00:00 1970 Return-Path: Received: (majordomo@vger.kernel.org) by vger.kernel.org via listexpand id S1754066AbbKBPyb (ORCPT ); Mon, 2 Nov 2015 10:54:31 -0500 Received: from fw-tnat.cambridge.arm.com ([217.140.96.140]:57284 "EHLO cam-smtp0.cambridge.arm.com" rhost-flags-OK-OK-OK-FAIL) by vger.kernel.org with ESMTP id S1752066AbbKBPy3 (ORCPT ); Mon, 2 Nov 2015 10:54:29 -0500 From: Punit Agrawal To: Viresh Kumar Cc: Dawei Chien , "Rafael J. Wysocki" , Rob Herring , Pawel Moll , Mark Rutland , Ian Campbell , Kumar Gala , Matthias Brugger , Daniel Kurtz , Sascha Hauer , Daniel Lezcano , devicetree@vger.kernel.org, linux-arm-kernel@lists.infradead.org, linux-kernel@vger.kernel.org, linux-pm@vger.kernel.org, linux-mediatek@lists.infradead.org, srv_heupstream@mediatek.com, Sascha Hauer Subject: Re: [PATCH v3 0/2] thermal: mediatek: Add cpu power cooling model References: <1445515359-8587-1-git-send-email-dawei.chien@mediatek.com> <20151028154449.GH3716@ubuntu> Date: Mon, 02 Nov 2015 15:53:33 +0000 In-Reply-To: <20151028154449.GH3716@ubuntu> (Viresh Kumar's message of "Wed, 28 Oct 2015 21:14:49 +0530") Message-ID: <9hh4mh4bdoi.fsf@e105922-lin.cambridge.arm.com> User-Agent: Gnus/5.13 (Gnus v5.13) Emacs/24.5 (gnu/linux) MIME-Version: 1.0 Content-Type: text/plain Sender: linux-kernel-owner@vger.kernel.org List-ID: X-Mailing-List: linux-kernel@vger.kernel.org Viresh Kumar writes: > On 22-10-15, 20:02, Dawei Chien wrote: >> Use Intelligent Power Allocation (IPA) technical to add static/dynamic power model for binding CPU thermal zone. >> The power allocator governor allocates power budget to control CPU temperature. >> >> Power Allocator governor is able to keep SOC temperature within a >> defined temperature range to avoid SOC overheat and keep it's >> performance. mt8173-cpufreq.c need to register its' own power model >> with power allocator thermal governor, so that power allocator >> governor can allocates suitable power budget to control CPU >> temperature. >> >> PATCH1 is base on >> https://patchwork.kernel.org/patch/7034601/ >> >> PATCH2 is base on Sascha's thermal driver V9 >> https://patchwork.kernel.org/patch/7249821/ >> https://patchwork.kernel.org/patch/7249861/ >> https://patchwork.kernel.org/patch/7249891/ >> >> Change since V1: >> include mt8171.h and sort header file for mt8173.dtsi >> >> Change since V2: >> Move dynamic/static power model in device tree >> >> Dawei.Chien (2): >> thermal: mediatek: Add cpu power cooling model. >> arm64: dts: mt8173: Add thermal zone node for mt8173. > > Sorry for being extremely late in reviewing this stuff. You are > already on v3 and I haven't reviewed it once. Mostly due to bad timing > of my holidays and other work pressure. > > Now, there are few things that I feel are not properly addressed here, > and I may be wrong: > - Where are the bindings for static-power-points and > dynamic-power-coefficient. Sorry I failed to see them in this or > other series you mentioned. For dynamic power, I had posted some patches[0][1][2] introducing the binding as well as updating cooling device registration via cpufreq driver. Now that the SCPI hwmon driver is merged, I should re-send the remaining patches. [0] http://lkml.iu.edu/hypermail/linux/kernel/1508.0/01020.html [1] http://lkml.iu.edu/hypermail/linux/kernel/1508.0/01022.html [3] http://lkml.iu.edu/hypermail/linux/kernel/1508.0/01031.html > - Even then, why should we be adding another table into DT for > voltage/power ? And not reuse and extend the opp-v2 stuff which is > already mainlined now. > - There are few issues with the code as well, but I want to see where > the bindings should go first. And then only discuss the code > further.