From mboxrd@z Thu Jan 1 00:00:00 1970 Return-Path: X-Spam-Checker-Version: SpamAssassin 3.4.0 (2014-02-07) on aws-us-west-2-korg-lkml-1.web.codeaurora.org X-Spam-Level: X-Spam-Status: No, score=-12.1 required=3.0 tests=DKIM_SIGNED,DKIM_VALID, DKIM_VALID_AU,FREEMAIL_FORGED_FROMDOMAIN,FREEMAIL_FROM, HEADER_FROM_DIFFERENT_DOMAINS,INCLUDES_PATCH,MAILING_LIST_MULTI, MENTIONS_GIT_HOSTING,SIGNED_OFF_BY,SPF_HELO_NONE,SPF_PASS,URIBL_BLOCKED autolearn=ham autolearn_force=no version=3.4.0 Received: from mail.kernel.org (mail.kernel.org [198.145.29.99]) by smtp.lore.kernel.org (Postfix) with ESMTP id A70F4C04AB4 for ; Thu, 16 May 2019 18:08:18 +0000 (UTC) Received: from vger.kernel.org (vger.kernel.org [209.132.180.67]) by mail.kernel.org (Postfix) with ESMTP id 7BED220833 for ; Thu, 16 May 2019 18:08:18 +0000 (UTC) Authentication-Results: mail.kernel.org; dkim=pass (2048-bit key) header.d=gmail.com header.i=@gmail.com header.b="CeCV8K2y" Received: (majordomo@vger.kernel.org) by vger.kernel.org via listexpand id S1729028AbfEPSIR (ORCPT ); Thu, 16 May 2019 14:08:17 -0400 Received: from mail-it1-f193.google.com ([209.85.166.193]:38415 "EHLO mail-it1-f193.google.com" rhost-flags-OK-OK-OK-OK) by vger.kernel.org with ESMTP id S1726339AbfEPSIR (ORCPT ); Thu, 16 May 2019 14:08:17 -0400 Received: by mail-it1-f193.google.com with SMTP id i63so7801466ita.3; Thu, 16 May 2019 11:08:16 -0700 (PDT) DKIM-Signature: v=1; a=rsa-sha256; c=relaxed/relaxed; d=gmail.com; s=20161025; h=mime-version:references:in-reply-to:from:date:message-id:subject:to :content-transfer-encoding; bh=bRGNfoi3EoTJSvk4p56wrep4PuBD3CxbFt0eKUTVRzw=; b=CeCV8K2ybHSKA8hJGlcUizvgobC7q9c5lITXgx7zK4s8nl9YZ4OmkY6mDtmP1dW/CS cTHERUxoysE7aphwMiMDMSSet9GOf6WGtQDGtflmsRFRgSY0nk8bgaczup7eFIhReRPe acCBTZxLbHFVVYkZyBo8ye0sZYBJskmMkAQuob0Q0uFGZGtkNIjlUPMAHHLqkpTZZQb/ QyOhp4S2F8ocyJJv0+DfXpoJg8j+ngxuitQ3VwDhZHmn92qF0T9ODeH17FcTHpZh7jol vSDkebBIizDb4guPMORvKiWEQ+Z0XTj8+YMr4s8CD9xGTkwkIjbWNyAS1o2j8EJzZNo+ fbCQ== X-Google-DKIM-Signature: v=1; a=rsa-sha256; c=relaxed/relaxed; d=1e100.net; s=20161025; h=x-gm-message-state:mime-version:references:in-reply-to:from:date :message-id:subject:to:content-transfer-encoding; bh=bRGNfoi3EoTJSvk4p56wrep4PuBD3CxbFt0eKUTVRzw=; b=NOAHgqItFZWDWHl7eYjS/beC2OblJBi2wHLz7qLbRQKWV7wfpAUFuFz3lfyDErDKGY nkoK5m3ZtA6fh5nf07g6w4tRug0jNRKLRVv05p2kBOYFxDdI5q98682a3gOpuzuWqaP/ j11qt1IbkKf82UmovgOpVP3N+DsAVzs0gJmX9dWgWiTr9nXZR8t8kNDmYv4yrj6J/Cg6 HNtr6/5khapOpb8Q4n+d2dwwpnihGFnP+6Qhsmd6GfaNINS9+lNu0hSy5aFSLObwAGiW LQ55CXolmCZkDetA93S1B4QZSoJMbE0lfMOZn6YLCttSVz5SZUdgZLE2hgQjX52uTBN+ 3XXQ== X-Gm-Message-State: APjAAAXsg6Ds0PgjjCA55EjW+B1Udc50p/daZkKKcEY+rW7iGCTNWrwm Alkv0zwFlU8ozASZ4gdRJ3OnM7Ds9IgBNcwIbEc= X-Google-Smtp-Source: APXvYqy4Q/t3MpMc3CX1RvTvOr9qa0nPdscFSA6XqayhsgeFsfD9dIMmCQGpwWO4Jl4bveRra/Wj5gpYhQ3VO9FMh8o= X-Received: by 2002:a24:520f:: with SMTP id d15mr13737618itb.78.1558030095932; Thu, 16 May 2019 11:08:15 -0700 (PDT) MIME-Version: 1.0 References: <20190512082614.9045-1-tiny.windzz@gmail.com> <20190512082614.9045-3-tiny.windzz@gmail.com> <20190512223955.6lhclj6jr2akmsdx@core.my.home> In-Reply-To: <20190512223955.6lhclj6jr2akmsdx@core.my.home> From: Frank Lee Date: Fri, 17 May 2019 02:08:04 +0800 Message-ID: Subject: Re: [PATCH 2/3] thermal: sun50i: add thermal driver for h6 To: Yangtao Li , rui.zhang@intel.com, Eduardo Valentin , Daniel Lezcano , robh+dt@kernel.org, Mark Rutland , Maxime Ripard , Chen-Yu Tsai , catalin.marinas@arm.com, will.deacon@arm.com, David Miller , Mauro Carvalho Chehab , Greg Kroah-Hartman , Jonathan.Cameron@huawei.com, Nicolas Ferre , paulmck@linux.ibm.com, Andy Gross , olof@lixom.net, bjorn.andersson@linaro.org, Jagan Teki , marc.w.gonzalez@free.fr, stefan.wahren@i2se.com, enric.balletbo@collabora.com, devicetree@vger.kernel.org, Linux Kernel Mailing List , Linux ARM , Linux PM Content-Type: text/plain; charset="UTF-8" Content-Transfer-Encoding: quoted-printable Sender: linux-kernel-owner@vger.kernel.org Precedence: bulk List-ID: X-Mailing-List: linux-kernel@vger.kernel.org Hi Ond=C5=99ej, On Mon, May 13, 2019 at 6:39 AM Ond=C5=99ej Jirman wrot= e: > > On Sun, May 12, 2019 at 04:26:13AM -0400, Yangtao Li wrote: > > This patch adds the support for allwinner thermal sensor, within > > allwinner SoC. It will register sensors for thermal framework > > and use device tree to bind cooling device. > > > > Based on driver code found here: > > https://megous.com/git/linux and https://github.com/Allwinner-Homlet/H6= -BSP4.9-linux > > > > Signed-off-by: Yangtao Li > > --- > > MAINTAINERS | 7 + > > drivers/thermal/Kconfig | 14 ++ > > drivers/thermal/Makefile | 1 + > > drivers/thermal/sun50i_thermal.c | 357 +++++++++++++++++++++++++++++++ > > 4 files changed, 379 insertions(+) > > create mode 100644 drivers/thermal/sun50i_thermal.c > > > > diff --git a/MAINTAINERS b/MAINTAINERS > > index 3c65228e93c5..8da56582e72a 100644 > > --- a/MAINTAINERS > > +++ b/MAINTAINERS > > @@ -674,6 +674,13 @@ L: linux-crypto@vger.kernel.org > > S: Maintained > > F: drivers/crypto/sunxi-ss/ > > > > +ALLWINNER THERMAL DRIVER > > +M: Yangtao Li > > +L: linux-pm@vger.kernel.org > > +S: Maintained > > +F: Documentation/devicetree/bindings/thermal/sun50i-thermal.txt > > +F: drivers/thermal/sun50i_thermal.c > > + > > ALLWINNER VPU DRIVER > > M: Maxime Ripard > > M: Paul Kocialkowski > > diff --git a/drivers/thermal/Kconfig b/drivers/thermal/Kconfig > > index 653aa27a25a4..2a8d1c98c6ca 100644 > > --- a/drivers/thermal/Kconfig > > +++ b/drivers/thermal/Kconfig > > @@ -252,6 +252,20 @@ config SPEAR_THERMAL > > Enable this to plug the SPEAr thermal sensor driver into the Li= nux > > thermal framework. > > > > +config SUN50I_THERMAL > > + tristate "Allwinner sun50i thermal driver" > > + depends on ARCH_SUNXI || COMPILE_TEST > > + depends on HAS_IOMEM > > + depends on NVMEM > > + depends on OF > > + depends on RESET_CONTROLLER > > + help > > + Support for the sun50i thermal sensor driver into the Linux the= rmal > > + framework. > > + > > + To compile this driver as a module, choose M here: the > > + module will be called sun50i-thermal. > > + > > config ROCKCHIP_THERMAL > > tristate "Rockchip thermal driver" > > depends on ARCH_ROCKCHIP || COMPILE_TEST > > diff --git a/drivers/thermal/Makefile b/drivers/thermal/Makefile > > index 486d682be047..a09b30b90003 100644 > > --- a/drivers/thermal/Makefile > > +++ b/drivers/thermal/Makefile > > @@ -30,6 +30,7 @@ thermal_sys-$(CONFIG_DEVFREQ_THERMAL) +=3D devfreq_co= oling.o > > # platform thermal drivers > > obj-y +=3D broadcom/ > > obj-$(CONFIG_SPEAR_THERMAL) +=3D spear_thermal.o > > +obj-$(CONFIG_SUN50I_THERMAL) +=3D sun50i_thermal.o > > obj-$(CONFIG_ROCKCHIP_THERMAL) +=3D rockchip_thermal.o > > obj-$(CONFIG_RCAR_THERMAL) +=3D rcar_thermal.o > > obj-$(CONFIG_RCAR_GEN3_THERMAL) +=3D rcar_gen3_thermal.o > > diff --git a/drivers/thermal/sun50i_thermal.c b/drivers/thermal/sun50i_= thermal.c > > new file mode 100644 > > index 000000000000..3bdb3677b3d4 > > --- /dev/null > > +++ b/drivers/thermal/sun50i_thermal.c > > @@ -0,0 +1,357 @@ > > +// SPDX-License-Identifier: GPL-2.0 > > +/* > > + * Thermal sensor driver for Allwinner SOC > > + * Copyright (C) 2019 Yangtao Li > > + * > > + * Based on the work of Icenowy Zheng > > + * Based on the work of Ondrej Jirman > > + * Based on the work of Josef Gajdusek > > + */ > > + > > +#include > > +#include > > +#include > > +#include > > +#include > > +#include > > +#include > > +#include > > +#include > > +#include > > + > > +#define MAX_SENSOR_NUM 4 > > + > > +#define FT_TEMP_MASK GENMASK(11, 0) > > +#define TEMP_CALIB_MASK GENMASK(11, 0) > > +#define TEMP_TO_REG 672 > > +#define CALIBRATE_DEFAULT 0x800 > > + > > +#define SUN50I_THS_CTRL0 0x00 > > +#define SUN50I_H6_THS_ENABLE 0x04 > > +#define SUN50I_H6_THS_PC 0x08 > > +#define SUN50I_H6_THS_MFC 0x30 > > +#define SUN50I_H6_TEMP_CALIB 0xa0 > > +#define SUN50I_H6_TEMP_DATA 0xc0 > > + > > +#define SUN50I_THS_CTRL0_T_ACQ(x) ((GENMASK(15, 0) & (x)) <= < 16) > > +#define SUN50I_THS_FILTER_EN BIT(2) > > +#define SUN50I_THS_FILTER_TYPE(x) (GENMASK(1, 0) & (x)) > > +#define SUN50I_H6_THS_PC_TEMP_PERIOD(x) ((GENMASK(19, 0) = & (x)) << 12) > > + > > +/* millidegree celsius */ > > +#define SUN50I_H6_FT_DEVIATION 7000 > > + > > +struct tsens_device; > > + > > +struct tsensor { > > + struct tsens_device *tmdev; > > + struct thermal_zone_device *tzd; > > + int id; > > +}; > > + > > +struct sun50i_thermal_chip { > > + int sensor_num; > > + int offset; > > + int scale; > > + int ft_deviation; > > + int temp_calib_base; > > + int temp_data_base; > > + int (*enable)(struct tsens_device *tmdev); > > + int (*disable)(struct tsens_device *tmdev); > > +}; > > + > > + > > +struct tsens_device { > > + const struct sun50i_thermal_chip *chip; > > + struct device *dev; > > + struct regmap *regmap; > > + struct reset_control *reset; > > + struct clk *bus_clk; > > + struct tsensor sensor[MAX_SENSOR_NUM]; > > +}; > > + > > +/* Temp Unit: millidegree Celsius */ > > +static int tsens_reg2temp(struct tsens_device *tmdev, > > + int reg) > > +{ > > + return (reg + tmdev->chip->offset) * tmdev->chip->scale; > > +} > > + > > +static int tsens_get_temp(void *data, int *temp) > > +{ > > + struct tsensor *s =3D data; > > + struct tsens_device *tmdev =3D s->tmdev; > > + int val; > > + > > + regmap_read(tmdev->regmap, tmdev->chip->temp_data_base + > > + 0x4 * s->id, &val); > > + > > + if (unlikely(val =3D=3D 0)) > > + return -EBUSY; > > + > > + *temp =3D tsens_reg2temp(tmdev, val); > > + if (tmdev->chip->ft_deviation) > > + *temp +=3D tmdev->chip->ft_deviation; > > + > > + return 0; > > +} > > + > > +static const struct thermal_zone_of_device_ops tsens_ops =3D { > > + .get_temp =3D tsens_get_temp, > > +}; > > + > > +static const struct regmap_config config =3D { > > + .reg_bits =3D 32, > > + .val_bits =3D 32, > > + .reg_stride =3D 4, > > + .fast_io =3D true, > > +}; > > + > > +static int tsens_init(struct tsens_device *tmdev) > > +{ > > + struct device *dev =3D tmdev->dev; > > + struct platform_device *pdev =3D to_platform_device(dev); > > + struct resource *mem; > > + void __iomem *base; > > + > > + mem =3D platform_get_resource(pdev, IORESOURCE_MEM, 0); > > + base =3D devm_ioremap_resource(dev, mem); > > + if (IS_ERR(base)) > > + return PTR_ERR(base); > > + > > + tmdev->regmap =3D devm_regmap_init_mmio_clk(dev, "bus", > > + base, > > + &config); > > + if (IS_ERR(tmdev->regmap)) > > + return PTR_ERR(tmdev->regmap); > > + > > + tmdev->reset =3D devm_reset_control_get(dev, "bus"); > > + if (IS_ERR(tmdev->reset)) > > + return PTR_ERR(tmdev->reset); > > + > > + tmdev->bus_clk =3D devm_clk_get(&pdev->dev, "bus"); > > + if (IS_ERR(tmdev->bus_clk)) > > + return PTR_ERR(tmdev->bus_clk); > > + > > + return 0; > > +} > > + > > +/* > > + * Even if the external calibration data stored in sid is not accessib= le, > > + * the THS hardware can still work, although the data won't be so accu= rate. > > + * The default value of calibration register is 0x800 for every sensor= , > > + * and the calibration value is usually 0x7xx or 0x8xx, so they won't = be > > + * away from the default value for a lot. > > + * > > + * So here we do not return error if the calibartion data is > > + * not available, except the probe needs deferring. > > + */ > > +static int tsens_calibrate(struct tsens_device *tmdev) > > +{ > > + struct nvmem_cell *calcell; > > + struct device *dev =3D tmdev->dev; > > + u16 *caldata; > > + size_t callen; > > + int ft_temp; > > + int i =3D 0; > > + > > + calcell =3D devm_nvmem_cell_get(dev, "calib"); > > + if (IS_ERR(calcell)) { > > + if (PTR_ERR(calcell) =3D=3D -EPROBE_DEFER) > > + return -EPROBE_DEFER; > > + > > + goto out; > > + } > > + > > + caldata =3D nvmem_cell_read(calcell, &callen); > > + if (IS_ERR(caldata)) > > + goto out; > > + > > + if (!caldata[0] || callen < 2 + 2 * tmdev->chip->sensor_num) > > + goto out_free; > > + > > + /* > > + * The calbration data on H6 is stored as temperature-value > > + * pair when being filled at factory test stage. > > + * The unit of stored FT temperature is 0.1 degreee celusis. > > + */ > > + ft_temp =3D caldata[0] & FT_TEMP_MASK; > > + > > + for (; i < tmdev->chip->sensor_num; i++) { > > + int reg =3D (int)caldata[i + 1]; > > + int sensor_temp =3D tsens_reg2temp(tmdev, reg); > > + int delta, cdata, calib_offest; > > + > > + /* > > + * To calculate the calibration value: > > + * > > + * X(in Celsius) =3D Ts - ft_temp > > + * delta =3D X * 10000 / TEMP_TO_REG > > + * cdata =3D CALIBRATE_DEFAULT - delta > > + * > > + * cdata: calibration value > > + */ > > + delta =3D (sensor_temp - ft_temp * 100) * 10 / TEMP_TO_RE= G; > > + cdata =3D CALIBRATE_DEFAULT - delta; > > + if (cdata & ~TEMP_CALIB_MASK) { > > + dev_warn(dev, "sensor%d calibration value error",= i); > > + > > + continue; > > + } > > + > > + calib_offest =3D tmdev->chip->temp_calib_base + (i / 2) *= 0x4; > > + > > + if (i % 2) { > > + int val; > > + > > + regmap_read(tmdev->regmap, calib_offest, &val); > > + val =3D (val & TEMP_CALIB_MASK) | (cdata << 16); > > + regmap_write(tmdev->regmap, calib_offest, val); > > + } else > > + regmap_write(tmdev->regmap, calib_offest, cdata); > > + } > > + > > +out_free: > > + kfree(caldata); > > +out: > > + return 0; > > +} > > + > > +static int tsens_register(struct tsens_device *tmdev) > > +{ > > + struct thermal_zone_device *tzd; > > + int i =3D 0; > > + > > + for (; i < tmdev->chip->sensor_num; i++) { > > + tmdev->sensor[i].tmdev =3D tmdev; > > + tmdev->sensor[i].id =3D i; > > + tmdev->sensor[i].tzd =3D devm_thermal_zone_of_sensor_regi= ster( > > + tmdev->dev, i, &tmdev->sensor[i], > > + &tsens_ops); > > + if (IS_ERR(tmdev->sensor[i].tzd)) > > + return PTR_ERR(tzd); > > + } > > + > > + return 0; > > +} > > + > > +static int tsens_probe(struct platform_device *pdev) > > +{ > > + struct tsens_device *tmdev; > > + struct device *dev =3D &pdev->dev; > > + int ret; > > + > > + tmdev =3D devm_kzalloc(dev, sizeof(*tmdev), GFP_KERNEL); > > + if (!tmdev) > > + return -ENOMEM; > > + > > + tmdev->dev =3D dev; > > + tmdev->chip =3D of_device_get_match_data(&pdev->dev); > > + if (!tmdev->chip) > > + return -EINVAL; > > + > > + ret =3D tsens_init(tmdev); > > + if (ret) > > + return ret; > > + > > + ret =3D tsens_register(tmdev); > > + if (ret) > > + return ret; > > + > > + ret =3D tmdev->chip->enable(tmdev); > > + if (ret) > > + return ret; > > + > > + platform_set_drvdata(pdev, tmdev); > > + > > + return ret; > > +} > > + > > +static int tsens_remove(struct platform_device *pdev) > > +{ > > + struct tsens_device *tmdev =3D platform_get_drvdata(pdev); > > + > > + tmdev->chip->disable(tmdev); > > + > > + return 0; > > +} > > + > > +static int sun50i_thermal_enable(struct tsens_device *tmdev) > > +{ > > + int ret, val; > > + > > + ret =3D reset_control_deassert(tmdev->reset); > > + if (ret) > > + return ret; > > + > > + ret =3D clk_prepare_enable(tmdev->bus_clk); > > + if (ret) > > + goto assert_reset; > > + > > + ret =3D tsens_calibrate(tmdev); > > + if (ret) > > + return ret; > > + > > + /* > > + * clkin =3D 24MHz > > + * T acquire =3D clkin / (SUN50I_THS_CTRL0_T_ACQ + 1) > > + * =3D 20us > > + */ > > + regmap_write(tmdev->regmap, SUN50I_THS_CTRL0, > > + SUN50I_THS_CTRL0_T_ACQ(479)); > > + /* average over 4 samples */ > > + regmap_write(tmdev->regmap, SUN50I_H6_THS_MFC, > > + SUN50I_THS_FILTER_EN | > > + SUN50I_THS_FILTER_TYPE(1)); > > + /* period =3D (SUN50I_H6_THS_PC_TEMP_PERIOD + 1) * 4096 / clkin; = ~10ms */ > > + regmap_write(tmdev->regmap, SUN50I_H6_THS_PC, > > + SUN50I_H6_THS_PC_TEMP_PERIOD(58)); > > Also this math is not all that clear: > > period =3D (SUN50I_H6_THS_PC_TEMP_PERIOD + 1) * 4096 / clkin; ~10ms > > SUN50I_H6_THS_PC_TEMP_PERIOD is a macro with an argument. So how does > this work? > > Also, related to this, I've noticed that you removed the interrupt > processing from the original driver. Without that you have to make sure > that OF contains non-zero polling-delay and polling-delay-passive. > > Nonzero values are necessary for enabling polling mode of the tz core, > otherwise tz core will not read values periodically from your driver. > > You should documment it in the DT bindings, too. Or keep the interrupt > handling for THS. See v2. Thx, Yangtao > > regards, > o. > > > + /* enable sensor */ > > + val =3D GENMASK(tmdev->chip->sensor_num - 1, 0); > > + regmap_write(tmdev->regmap, SUN50I_H6_THS_ENABLE, val); > > + > > + return 0; > > + > > +assert_reset: > > + reset_control_assert(tmdev->reset); > > + > > + return ret; > > +} > > + > > +static int sun50i_thermal_disable(struct tsens_device *tmdev) > > +{ > > + clk_disable_unprepare(tmdev->bus_clk); > > + reset_control_assert(tmdev->reset); > > + > > + return 0; > > +} > > + > > +static const struct sun50i_thermal_chip sun50i_h6_ths =3D { > > + .sensor_num =3D 2, > > + .offset =3D -2794, > > + .scale =3D -67, > > + .ft_deviation =3D SUN50I_H6_FT_DEVIATION, > > + .temp_calib_base =3D SUN50I_H6_TEMP_CALIB, > > + .temp_data_base =3D SUN50I_H6_TEMP_DATA, > > + .enable =3D sun50i_thermal_enable, > > + .disable =3D sun50i_thermal_disable, > > +}; > > + > > +static const struct of_device_id of_tsens_match[] =3D { > > + { .compatible =3D "allwinner,sun50i-h6-ths", .data =3D &sun50i_h6= _ths }, > > + { /* sentinel */ }, > > +}; > > +MODULE_DEVICE_TABLE(of, of_tsens_match); > > + > > +static struct platform_driver tsens_driver =3D { > > + .probe =3D tsens_probe, > > + .remove =3D tsens_remove, > > + .driver =3D { > > + .name =3D "sun50i-thermal", > > + .of_match_table =3D of_tsens_match, > > + }, > > +}; > > +module_platform_driver(tsens_driver); > > + > > +MODULE_DESCRIPTION("Thermal sensor driver for Allwinner SOC"); > > +MODULE_LICENSE("GPL v2"); > > -- > > 2.17.0 > > > > > > _______________________________________________ > > linux-arm-kernel mailing list > > linux-arm-kernel@lists.infradead.org > > http://lists.infradead.org/mailman/listinfo/linux-arm-kernel