Re: [PATCH V3 4/4] thermal/drivers/cpu_cooling: Rename to cpufreq_cooling

[Amit Kucheria <amit.kucheria@linaro.org>]

On Tue, Dec 3, 2019 at 3:07 PM Daniel Lezcano <daniel.lezcano@linaro.org> wrote:
>
> As we introduced the idle injection cooling device called
> cpuidle_cooling, let's be consistent and rename the cpu_cooling to
> cpufreq_cooling as this one mitigates with OPPs changes.
>
> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>

Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>

> ---
>   V3:
>     - Fix missing name conversion (Viresh Kumar)
> ---
>  Documentation/driver-api/thermal/exynos_thermal.rst  | 2 +-
>  MAINTAINERS                                          | 2 +-
>  drivers/thermal/Makefile                             | 2 +-
>  drivers/thermal/clock_cooling.c                      | 2 +-
>  drivers/thermal/{cpu_cooling.c => cpufreq_cooling.c} | 6 +++---
>  include/linux/clock_cooling.h                        | 2 +-
>  6 files changed, 8 insertions(+), 8 deletions(-)
>  rename drivers/thermal/{cpu_cooling.c => cpufreq_cooling.c} (99%)
>
> diff --git a/Documentation/driver-api/thermal/exynos_thermal.rst b/Documentation/driver-api/thermal/exynos_thermal.rst
> index 5bd556566c70..d4e4a5b75805 100644
> --- a/Documentation/driver-api/thermal/exynos_thermal.rst
> +++ b/Documentation/driver-api/thermal/exynos_thermal.rst
> @@ -67,7 +67,7 @@ TMU driver description:
>  The exynos thermal driver is structured as::
>
>                                         Kernel Core thermal framework
> -                               (thermal_core.c, step_wise.c, cpu_cooling.c)
> +                               (thermal_core.c, step_wise.c, cpufreq_cooling.c)
>                                                                 ^
>                                                                 |
>                                                                 |
> diff --git a/MAINTAINERS b/MAINTAINERS
> index d2e92a0360f2..26e4be914765 100644
> --- a/MAINTAINERS
> +++ b/MAINTAINERS
> @@ -16194,7 +16194,7 @@ L:      linux-pm@vger.kernel.org
>  S:     Supported
>  F:     Documentation/driver-api/thermal/cpu-cooling-api.rst
>  F:     Documentation/driver-api/thermal/cpu-idle-cooling.rst
> -F:     drivers/thermal/cpu_cooling.c
> +F:     drivers/thermal/cpufreq_cooling.c
>  F:     drivers/thermal/cpuidle_cooling.c
>  F:     include/linux/cpu_cooling.h
>
> diff --git a/drivers/thermal/Makefile b/drivers/thermal/Makefile
> index 9c8aa2d4bd28..5c98472ffd8b 100644
> --- a/drivers/thermal/Makefile
> +++ b/drivers/thermal/Makefile
> @@ -19,7 +19,7 @@ thermal_sys-$(CONFIG_THERMAL_GOV_USER_SPACE)  += user_space.o
>  thermal_sys-$(CONFIG_THERMAL_GOV_POWER_ALLOCATOR)      += power_allocator.o
>
>  # cpufreq cooling
> -thermal_sys-$(CONFIG_CPU_FREQ_THERMAL) += cpu_cooling.o
> +thermal_sys-$(CONFIG_CPU_FREQ_THERMAL) += cpufreq_cooling.o
>  thermal_sys-$(CONFIG_CPU_IDLE_THERMAL) += cpuidle_cooling.o
>
>  # clock cooling
> diff --git a/drivers/thermal/clock_cooling.c b/drivers/thermal/clock_cooling.c
> index 3ad3256c48fd..7cb3ae4b44ee 100644
> --- a/drivers/thermal/clock_cooling.c
> +++ b/drivers/thermal/clock_cooling.c
> @@ -7,7 +7,7 @@
>   *  Copyright (C) 2013 Texas Instruments Inc.
>   *  Contact:  Eduardo Valentin <eduardo.valentin@ti.com>
>   *
> - *  Highly based on cpu_cooling.c.
> + *  Highly based on cpufreq_cooling.c.
>   *  Copyright (C) 2012 Samsung Electronics Co., Ltd(http://www.samsung.com)
>   *  Copyright (C) 2012  Amit Daniel <amit.kachhap@linaro.org>
>   */
> diff --git a/drivers/thermal/cpu_cooling.c b/drivers/thermal/cpufreq_cooling.c
> similarity index 99%
> rename from drivers/thermal/cpu_cooling.c
> rename to drivers/thermal/cpufreq_cooling.c
> index 6b9865c786ba..3a3f9cf94b6d 100644
> --- a/drivers/thermal/cpu_cooling.c
> +++ b/drivers/thermal/cpufreq_cooling.c
> @@ -1,6 +1,6 @@
>  // SPDX-License-Identifier: GPL-2.0
>  /*
> - *  linux/drivers/thermal/cpu_cooling.c
> + *  linux/drivers/thermal/cpufreq_cooling.c
>   *
>   *  Copyright (C) 2012 Samsung Electronics Co., Ltd(http://www.samsung.com)
>   *
> @@ -694,7 +694,7 @@ of_cpufreq_cooling_register(struct cpufreq_policy *policy)
>         u32 capacitance = 0;
>
>         if (!np) {
> -               pr_err("cpu_cooling: OF node not available for cpu%d\n",
> +               pr_err("cpufreq_cooling: OF node not available for cpu%d\n",
>                        policy->cpu);
>                 return NULL;
>         }
> @@ -705,7 +705,7 @@ of_cpufreq_cooling_register(struct cpufreq_policy *policy)
>
>                 cdev = __cpufreq_cooling_register(np, policy, capacitance);
>                 if (IS_ERR(cdev)) {
> -                       pr_err("cpu_cooling: cpu%d failed to register as cooling device: %ld\n",
> +                       pr_err("cpufreq_cooling: cpu%d failed to register as cooling device: %ld\n",
>                                policy->cpu, PTR_ERR(cdev));
>                         cdev = NULL;
>                 }
> diff --git a/include/linux/clock_cooling.h b/include/linux/clock_cooling.h
> index b5cebf766e02..4b0a69863656 100644
> --- a/include/linux/clock_cooling.h
> +++ b/include/linux/clock_cooling.h
> @@ -7,7 +7,7 @@
>   *  Copyright (C) 2013 Texas Instruments Inc.
>   *  Contact:  Eduardo Valentin <eduardo.valentin@ti.com>
>   *
> - *  Highly based on cpu_cooling.c.
> + *  Highly based on cpufreq_cooling.c.
>   *  Copyright (C) 2012 Samsung Electronics Co., Ltd(http://www.samsung.com)
>   *  Copyright (C) 2012  Amit Daniel <amit.kachhap@linaro.org>
>   */
> --
> 2.17.1
>