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Date:   Wed, 9 Mar 2022 15:30:28 -0500
From:   Alyssa Rosenzweig <alyssa@rosenzweig.io>
To:     Hector Martin <marcan@marcan.st>
Cc:     Thomas Gleixner <tglx@linutronix.de>,
        Marc Zyngier <maz@kernel.org>,
        Rob Herring <robh+dt@kernel.org>,
        Sven Peter <sven@svenpeter.dev>,
        Mark Kettenis <mark.kettenis@xs4all.nl>,
        linux-arm-kernel@lists.infradead.org, linux-kernel@vger.kernel.org,
        devicetree@vger.kernel.org
Subject: Re: [PATCH v3 0/7] irqchip/apple-aic: Add support for AICv2
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> This also adds support for multi-die AIC2 controllers. While no
> multi-die products exist yet, the AIC2 in t600x is built to support
> up to 2 dies, and it's pretty clear how it works, so let's implement
> it. If we're lucky, when multi-die products roll around, this will
> let us support them with only DT changes. In order to support the
> extra die dimension, this introduces a 4-argument IRQ phandle form
> (3-argument is always supported and just implies die 0).

Given you have a multidie device in the mail, it's probably best to
defer merging this series until the multidie code paths are confirmed
working there?