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([2a01:e34:ed2f:f020:a9e1:bc04:469:f21b]) by smtp.googlemail.com with ESMTPSA id 189sm10523997wma.22.2020.11.30.01.40.38 (version=TLS1_3 cipher=TLS_AES_128_GCM_SHA256 bits=128/128); Mon, 30 Nov 2020 01:40:39 -0800 (PST) Subject: Re: [RFC 1/2] dt-bindings: thermal: sprd: Add virtual thermal documentation To: gao yunxiao , Lukasz Luba Cc: rui.zhang@intel.com, amitk@kernel.org, robh+dt@kernel.org, javi.merino@kernel.org, linux-pm@vger.kernel.org, kernel-team@android.com, linux-kernel@vger.kernel.org, devicetree@vger.kernel.org, orsonzhai@gmail.com, zhang.lyra@gmail.com, "jeson.gao" References: <1606466112-31584-1-git-send-email-gao.yunxiao6@gmail.com> <724ddf78-483c-2cf3-441c-4885af8425a9@arm.com> <1af5220c-f598-58f4-488e-fdd505477ed5@linaro.org> From: Daniel Lezcano Message-ID: Date: Mon, 30 Nov 2020 10:40:37 +0100 User-Agent: Mozilla/5.0 (X11; Linux x86_64; rv:68.0) Gecko/20100101 Thunderbird/68.10.0 MIME-Version: 1.0 In-Reply-To: Content-Type: text/plain; charset=utf-8 Content-Language: en-US Content-Transfer-Encoding: 8bit Precedence: bulk List-ID: X-Mailing-List: linux-kernel@vger.kernel.org On 30/11/2020 10:03, gao yunxiao wrote: > Hi Daniel > > Thank you for your the new information > > I have a question trouble to you > We should choose which per-core thermal zone as the IPA's input > reference temperature in the current kernel version? thank you. Can you give a pointer to a DT describing your hardware ? > On 27/11/2020, Lukasz Luba wrote: >> >> >> On 11/27/20 1:26 PM, Daniel Lezcano wrote: >>> >>> Hi Lukasz, >>> >>> On 27/11/2020 10:27, Lukasz Luba wrote: >>>> >>>> >>>> On 11/27/20 8:35 AM, gao.yunxiao6@gmail.com wrote: >>>>> From: "jeson.gao" >>>>> >>>>> virtual thermal node definition description in dts file >>>>> >>>>> Signed-off-by: jeson.gao >>>>> --- >>> >>> [ ... ] >>> >>>> It's coming back. There were attempts to solve this problem. >>>> Javi tried to solved this using hierarchical thermal zones [1]. >>>> It was even agreed (IIRC during LPC) but couldn't continue. Then Eduardo >>>> was going to continue this (last message at [3]). Unfortunately, >>>> development stopped. >>>> >>>> I also have out-of-tree similar implementation for my Odroid-xu4, >>>> which does no have an 'SoC' sensor, but have CPU sensors and needs >>>> some aggregation function to get temperature. >>>> >>>> I can pick up Javi's patches and continue 'hierarchical thermal zones' >>>> approach. >>>> >>>> Javi, Daniel, Rui what do you think? >>> >>> I already worked on the hierarchical thermal zones and my opinion is >>> that fits not really well. >>> >>> We want to define a new feature because the thermal framework is built >>> on the 1:1 relationship between a governor and a thermal zone. >>> >>> Practically speaking, we want to mitigate two thermal zones from one >>> governor, especially here the IPA governor. >>> >>> The DTPM framework is being implemented to solve that by providing an >>> automatic power rebalancing between the power manageable capable devices. >>> >>> In our case, the IPA would stick on the 'sustainable-power' resulting on >>> the aggregation of the two performance domains and set the power limit >>> on the parent node. The automatic power rebalancing will ensure maximum >>> throughput between the two performance domains instead of capping the >>> whole. >>> >>> >> >> Make sense. Thank you for sharing valuable opinion. >> >> Regards, >> Lukasz >> -- Linaro.org │ Open source software for ARM SoCs Follow Linaro: Facebook | Twitter | Blog