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[92.88.46.147]) by smtp.googlemail.com with ESMTPSA id 63-v6sm4679052wmd.5.2018.10.11.01.23.15 (version=TLS1_2 cipher=ECDHE-RSA-AES128-GCM-SHA256 bits=128/128); Thu, 11 Oct 2018 01:23:16 -0700 (PDT) Subject: Re: [RFC PATCH 0/7] Introduce thermal pressure To: Lukasz Luba , Thara Gopinath , linux-kernel@vger.kernel.org Cc: mingo@redhat.com, peterz@infradead.org, rui.zhang@intel.com, gregkh@linuxfoundation.org, rafael@kernel.org, amit.kachhap@gmail.com, viresh.kumar@linaro.org, javi.merino@kernel.org, edubezval@gmail.com, linux-pm@vger.kernel.org, quentin.perret@arm.com, ionela.voinescu@arm.com, vincent.guittot@linaro.org, Bartlomiej Zolnierkiewicz References: <1539102302-9057-1-git-send-email-thara.gopinath@linaro.org> <20181010153553eucas1p1b8f74f4aa45751ef029805fd118affc1~cSUmU58-F2963929639eucas1p1L@eucas1p1.samsung.com> <20181011073510eucas1p100bfadd6055a523cd1e92b07bfacfc10~cfaLHcbIo1401014010eucas1p1d@eucas1p1.samsung.com> From: Daniel Lezcano Message-ID: Date: Thu, 11 Oct 2018 10:23:14 +0200 User-Agent: Mozilla/5.0 (X11; Linux x86_64; rv:52.0) Gecko/20100101 Thunderbird/52.9.1 MIME-Version: 1.0 In-Reply-To: <20181011073510eucas1p100bfadd6055a523cd1e92b07bfacfc10~cfaLHcbIo1401014010eucas1p1d@eucas1p1.samsung.com> Content-Type: text/plain; charset=utf-8 Content-Language: en-US Content-Transfer-Encoding: 8bit Sender: linux-kernel-owner@vger.kernel.org Precedence: bulk List-ID: X-Mailing-List: linux-kernel@vger.kernel.org On 11/10/2018 09:35, Lukasz Luba wrote: > Hi Daniel, > > On 10/10/2018 06:54 PM, Daniel Lezcano wrote: >> On 10/10/2018 17:35, Lukasz Luba wrote: >>> Hi Thara, >>> >>> I have run it on Exynos5433 mainline. >>> When it is enabled with step_wise thermal governor, >>> some of my tests are showing ~30-50% regression (i.e. hackbench), >>> dhrystone ~10%. >>> >>> Could you tell me which thermal governor was used in your case? >>> Please also share the name of that benchmark, i will give it a try. >>> Is it single threaded compute-intensive? >> >> aobench AFAICT >> >> It would be interesting if you can share the thermal profile of your board. >> > Thanks for the benchmark name. > It was tested on Samsung TM2 device with Exynos 5433 with debian. > Thermal stuff you can find in mainline: > arch/arm64/boot/dts/exynos/exynos5433-tmu.dtsi By thermal profile, I was meaning a figure with the temperature regulation (temperature idle, then workload, then temperature increase, mitigated temperature, end of workload, temperature decrease). The thermal description looks wrong in the DT. I suggest to experiment the series with the DT fixed. eg. from hi6220.dtsi thermal-zones { cls0: cls0 { polling-delay = <1000>; polling-delay-passive = <100>; sustainable-power = <3326>; /* sensor ID */ thermal-sensors = <&tsensor 2>; trips { threshold: trip-point@0 { temperature = <65000>; hysteresis = <0>; type = "passive"; }; target: trip-point@1 { temperature = <75000>; hysteresis = <0>; type = "passive"; }; }; cooling-maps { map0 { trip = <&target>; cooling-device = <&cpu0 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>; }; }; }; }; Note the cooling devices are *passive* -- Linaro.org │ Open source software for ARM SoCs Follow Linaro: Facebook | Twitter | Blog