From: Len Brown <lenb@kernel.org>
To: x86@kernel.org
Cc: linux-kernel@vger.kernel.org, Zhang Rui <rui.zhang@intel.com>,
Len Brown <len.brown@intel.com>,
linux-pm@vger.kernel.org
Subject: [PATCH 09/14] powercap/intel_rapl: Support multi-die/package
Date: Tue, 30 Apr 2019 16:55:54 -0400 [thread overview]
Message-ID: <62505b44d2610872542b6602fda9273815db595d.1553624867.git.len.brown@intel.com> (raw)
In-Reply-To: <75386dff62ee869eb7357dff1e60dfd9b3e68023.1553624867.git.len.brown@intel.com>
From: Zhang Rui <rui.zhang@intel.com>
On the new dual-die/package systems, the RAPL MSR becomes die-scope.
Thus instead of one powercap device per physical package, now there
should be one powercap device for each unique die on these systems.
This patch introduces intel_rapl driver support for new
dual-die/package systems.
On the hardwares that do not have multi-die, topology_logical_die_id()
equals topology_physical_package_id(), thus there is no functional change.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Cc: linux-pm@vger.kernel.org
---
drivers/powercap/intel_rapl.c | 4 ++--
1 file changed, 2 insertions(+), 2 deletions(-)
diff --git a/drivers/powercap/intel_rapl.c b/drivers/powercap/intel_rapl.c
index 8b2f3631aba6..38c89db15150 100644
--- a/drivers/powercap/intel_rapl.c
+++ b/drivers/powercap/intel_rapl.c
@@ -266,7 +266,7 @@ static struct rapl_domain *platform_rapl_domain; /* Platform (PSys) domain */
/* caller to ensure CPU hotplug lock is held */
static struct rapl_package *rapl_find_package_domain(int cpu)
{
- int id = topology_physical_package_id(cpu);
+ int id = topology_logical_die_id(cpu);
struct rapl_package *rp;
list_for_each_entry(rp, &rapl_packages, plist) {
@@ -1457,7 +1457,7 @@ static void rapl_remove_package(struct rapl_package *rp)
/* called from CPU hotplug notifier, hotplug lock held */
static struct rapl_package *rapl_add_package(int cpu)
{
- int id = topology_physical_package_id(cpu);
+ int id = topology_logical_die_id(cpu);
struct rapl_package *rp;
int ret;
--
2.18.0-rc0
next prev parent reply other threads:[~2019-04-30 20:56 UTC|newest]
Thread overview: 15+ messages / expand[flat|nested] mbox.gz Atom feed top
2019-04-30 20:55 [PATCH 0/18] v3 multi-die/package topology support Len Brown
2019-04-30 20:55 ` [PATCH 01/14] x86 topology: Fix doc typo Len Brown
2019-04-30 20:55 ` [PATCH 02/14] topolgy: Simplify cputopology.txt formatting and wording Len Brown
2019-04-30 20:55 ` [PATCH 03/14] x86 smpboot: Rename match_die() to match_pkg() Len Brown
2019-04-30 20:55 ` [PATCH 04/14] x86 topology: Add CPUID.1F multi-die/package support Len Brown
2019-04-30 20:55 ` [PATCH 05/14] cpu topology: Export die_id Len Brown
2019-04-30 20:55 ` [PATCH 06/14] x86 topology: Define topology_die_id() Len Brown
2019-04-30 20:55 ` [PATCH 07/14] x86 topology: Define topology_logical_die_id() Len Brown
2019-04-30 20:55 ` [PATCH 08/14] powercap/intel_rapl: Simplify rapl_find_package() Len Brown
2019-04-30 20:55 ` Len Brown [this message]
2019-04-30 20:55 ` [PATCH 10/14] thermal/x86_pkg_temp_thermal: Support multi-die/package Len Brown
2019-04-30 20:55 ` [PATCH 11/14] powercap/intel_rapl: update rapl domain name and debug messages Len Brown
2019-04-30 20:55 ` [PATCH 12/14] hwmon/coretemp: Support multi-die/package Len Brown
2019-04-30 20:55 ` [PATCH 13/14] topology: Create package_threads sysfs attribute Len Brown
2019-04-30 20:55 ` [PATCH 14/14] topology: Create core_threads " Len Brown
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