From: Stephan Gerhold <stephan.gerhold@kernkonzept.com>
To: Daniel Lezcano <daniel.lezcano@linaro.org>
Cc: Amit Kucheria <amitk@kernel.org>,
Thara Gopinath <thara.gopinath@gmail.com>,
Andy Gross <agross@kernel.org>,
Bjorn Andersson <andersson@kernel.org>,
Konrad Dybcio <konrad.dybcio@linaro.org>,
"Rafael J. Wysocki" <rafael@kernel.org>,
Zhang Rui <rui.zhang@intel.com>,
Dmitry Baryshkov <dmitry.baryshkov@linaro.org>,
Rob Herring <robh+dt@kernel.org>,
Krzysztof Kozlowski <krzysztof.kozlowski+dt@linaro.org>,
Conor Dooley <conor+dt@kernel.org>,
linux-arm-msm@vger.kernel.org, linux-pm@vger.kernel.org,
linux-kernel@vger.kernel.org, devicetree@vger.kernel.org,
Stephan Gerhold <stephan@gerhold.net>,
Stephan Gerhold <stephan.gerhold@kernkonzept.com>,
Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Subject: [PATCH v5 0/6] thermal: qcom: tsens: Fix MDM9607, add MSM8909
Date: Wed, 07 Jun 2023 12:47:43 +0200 [thread overview]
Message-ID: <20230508-msm8909-tsens-v5-0-5eb632235ba7@kernkonzept.com> (raw)
Make the MDM9607 thermal sensor support consistent with Qualcomm's
vendor kernel (msm-3.18) by applying the correct default slope values
and adding "correction factors" to the factory calibration values in the
fuses. Use the same functionality to add the very similar MSM8909 SoC to
the tsens driver.
---
Changes in v5:
- Rebase on top of MSM8226 series that way applied by Daniel
(https://lore.kernel.org/linux-arm-msm/4097223e-5297-1536-18bb-512ef28c8329@linaro.org/)
- Add review tags from Dmitry
- Link to v4: https://lore.kernel.org/r/20230508-msm8909-tsens-v4-0-d9119622cb19@kernkonzept.com
Changes in v4:
- Mostly just resend, explicitly initialize zero values for
the MSM8909 p1/p2_calib_offset for better clarity (Konrad)
- Link to v3: https://lore.kernel.org/r/20230315103950.2679317-1-stephan.gerhold@kernkonzept.com
Changes in v3:
- Drop now unused definition reported by kernel test robot
Changes in v2:
- Rewrite on top of per-sensor nvmem cell changes that landed in 6.3
- Add patches to fix existing support for MDM9607
---
Stephan Gerhold (6):
thermal: qcom: tsens: Drop unused legacy structs
thermal: qcom: tsens-v0_1: Fix mdm9607 slope values
thermal: qcom: tsens-v0_1: Add mdm9607 correction offsets
dt-bindings: thermal: qcom-tsens: Drop redundant compatibles
dt-bindings: thermal: qcom-tsens: Add MSM8909 compatible
thermal: qcom: tsens-v0_1: Add MSM8909 data
.../devicetree/bindings/thermal/qcom-tsens.yaml | 23 +----
drivers/thermal/qcom/tsens-v0_1.c | 101 +++++++++++++--------
drivers/thermal/qcom/tsens-v1.c | 22 -----
drivers/thermal/qcom/tsens.c | 19 +++-
drivers/thermal/qcom/tsens.h | 6 +-
5 files changed, 88 insertions(+), 83 deletions(-)
---
base-commit: 7e25e9706bbade1b3dc670fad44a920d087064df
change-id: 20230508-msm8909-tsens-6733a6d415be
Best regards,
--
Stephan Gerhold
Kernkonzept GmbH at Dresden, Germany, HRB 31129, CEO Dr.-Ing. Michael Hohmuth
next reply other threads:[~2023-06-07 10:48 UTC|newest]
Thread overview: 8+ messages / expand[flat|nested] mbox.gz Atom feed top
2023-06-07 10:47 Stephan Gerhold [this message]
2023-06-07 10:47 ` [PATCH v5 1/6] thermal: qcom: tsens: Drop unused legacy structs Stephan Gerhold
2023-06-07 11:08 ` Dmitry Baryshkov
2023-06-07 10:47 ` [PATCH v5 2/6] thermal: qcom: tsens-v0_1: Fix mdm9607 slope values Stephan Gerhold
2023-06-07 10:47 ` [PATCH v5 3/6] thermal: qcom: tsens-v0_1: Add mdm9607 correction offsets Stephan Gerhold
2023-06-07 10:47 ` [PATCH v5 4/6] dt-bindings: thermal: qcom-tsens: Drop redundant compatibles Stephan Gerhold
2023-06-07 10:47 ` [PATCH v5 5/6] dt-bindings: thermal: qcom-tsens: Add MSM8909 compatible Stephan Gerhold
2023-06-07 10:47 ` [PATCH v5 6/6] thermal: qcom: tsens-v0_1: Add MSM8909 data Stephan Gerhold
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