From: Xinwei Kong <kong.kongxinwei@hisilicon.com>
To: <rui.zhuang@intel.com>, <edubezval@gmail.com>,
<mporter@konsulko.com>, <jorge.ramirez-ortiz@linaro.org>,
<haojian.zhuang@linaro.org>, <linux-pm@vger.kernel.org>
Cc: <linux-kernel@vger.kernel.org>,
<linux-arm-kernel@lists.infradead.org>, <linuxarm@huawei.com>,
<devicetree@vger.kernel.org>, <liguozhu@hisilicon.com>,
<xuwei5@hisilicon.com>
Subject: [PATCH v3 0/2] 96boards: add thermal senor support to hikey board
Date: Tue, 7 Apr 2015 18:40:50 +0800 [thread overview]
Message-ID: <1428403252-8208-1-git-send-email-kong.kongxinwei@hisilicon.com> (raw)
From: kongxinwei <kong.kongxinwei@hisilicon.com>
Thank you all for giving this v2 patches stages some comments. Here is v3
patches and address all the issues raised as part of v2 review.
The Linaro connect introduce 96boards series in Hong Kong,The HiKey board
is the first board to be certified 96Boards Consumer Edition compatible.
This board is based on the HiSilicon SoC. you can get more information
from https://www.96boards.org.
The hisilicon SoC contains thermal module, this thermal module has 4 sensors,
- sensor 0: local sensor;
- sensor 1: remote sensor for ACPU cluster 1;
- sensor 2: remote sensor for ACPU cluster 2;
- sensor 3: remote sensor for GPU;
It can obtain this device temperature by operating this hardware. The new
sensor driver satisfies thermal framework and to realize the ACPU ,GPU and
so on to cool function.
Changes v0->v1;
* Delete this hi6220 dtsi.
* Fix documentation and error checks.
* Modify this driver which makes use of kernel to decide how to dynamically
bind the interrupt to hottest sensor.
* Delete "sensor-thres-temp" property and read thermal_zone trips points
replace of it.
* Delete "sensor-reset-temp" property and define the fixed value replace
of it.
Changes v1->v2;
* change patch's position between binding document and driver file
* clean up some regiser for enabling thermal sensor
* use mutex lock to replace the spin lock
Changes v2->v3;
* delete sensor id property in binding document
* fix sensor driver to satisfy sensor register after deleting sensor id
property
kongxinwei (2):
dt-bindings: Document the hi6220 thermal sensor bindings
thermal: hisilicon: add new hisilicon thermal sensor driver
.../bindings/thermal/hisilicon-thermal.txt | 23 ++
drivers/thermal/Kconfig | 8 +
drivers/thermal/Makefile | 1 +
drivers/thermal/hisi_thermal.c | 438 +++++++++++++++++++++
4 files changed, 470 insertions(+)
create mode 100644 Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt
create mode 100644 drivers/thermal/hisi_thermal.c
--
1.9.1
WARNING: multiple messages have this Message-ID (diff)
From: Xinwei Kong <kong.kongxinwei@hisilicon.com>
To: rui.zhuang@intel.com, edubezval@gmail.com, mporter@konsulko.com,
jorge.ramirez-ortiz@linaro.org, haojian.zhuang@linaro.org,
linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org,
linux-arm-kernel@lists.infradead.org, linuxarm@huawei.com,
devicetree@vger.kernel.org, liguozhu@hisilicon.com,
xuwei5@hisilicon.com
Subject: [PATCH v3 0/2] 96boards: add thermal senor support to hikey board
Date: Tue, 7 Apr 2015 18:40:50 +0800 [thread overview]
Message-ID: <1428403252-8208-1-git-send-email-kong.kongxinwei@hisilicon.com> (raw)
From: kongxinwei <kong.kongxinwei@hisilicon.com>
Thank you all for giving this v2 patches stages some comments. Here is v3
patches and address all the issues raised as part of v2 review.
The Linaro connect introduce 96boards series in Hong Kong,The HiKey board
is the first board to be certified 96Boards Consumer Edition compatible.
This board is based on the HiSilicon SoC. you can get more information
from https://www.96boards.org.
The hisilicon SoC contains thermal module, this thermal module has 4 sensors,
- sensor 0: local sensor;
- sensor 1: remote sensor for ACPU cluster 1;
- sensor 2: remote sensor for ACPU cluster 2;
- sensor 3: remote sensor for GPU;
It can obtain this device temperature by operating this hardware. The new
sensor driver satisfies thermal framework and to realize the ACPU ,GPU and
so on to cool function.
Changes v0->v1;
* Delete this hi6220 dtsi.
* Fix documentation and error checks.
* Modify this driver which makes use of kernel to decide how to dynamically
bind the interrupt to hottest sensor.
* Delete "sensor-thres-temp" property and read thermal_zone trips points
replace of it.
* Delete "sensor-reset-temp" property and define the fixed value replace
of it.
Changes v1->v2;
* change patch's position between binding document and driver file
* clean up some regiser for enabling thermal sensor
* use mutex lock to replace the spin lock
Changes v2->v3;
* delete sensor id property in binding document
* fix sensor driver to satisfy sensor register after deleting sensor id
property
kongxinwei (2):
dt-bindings: Document the hi6220 thermal sensor bindings
thermal: hisilicon: add new hisilicon thermal sensor driver
.../bindings/thermal/hisilicon-thermal.txt | 23 ++
drivers/thermal/Kconfig | 8 +
drivers/thermal/Makefile | 1 +
drivers/thermal/hisi_thermal.c | 438 +++++++++++++++++++++
4 files changed, 470 insertions(+)
create mode 100644 Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt
create mode 100644 drivers/thermal/hisi_thermal.c
--
1.9.1
WARNING: multiple messages have this Message-ID (diff)
From: kong.kongxinwei@hisilicon.com (Xinwei Kong)
To: linux-arm-kernel@lists.infradead.org
Subject: [PATCH v3 0/2] 96boards: add thermal senor support to hikey board
Date: Tue, 7 Apr 2015 18:40:50 +0800 [thread overview]
Message-ID: <1428403252-8208-1-git-send-email-kong.kongxinwei@hisilicon.com> (raw)
From: kongxinwei <kong.kongxinwei@hisilicon.com>
Thank you all for giving this v2 patches stages some comments. Here is v3
patches and address all the issues raised as part of v2 review.
The Linaro connect introduce 96boards series in Hong Kong,The HiKey board
is the first board to be certified 96Boards Consumer Edition compatible.
This board is based on the HiSilicon SoC. you can get more information
from https://www.96boards.org.
The hisilicon SoC contains thermal module, this thermal module has 4 sensors,
- sensor 0: local sensor;
- sensor 1: remote sensor for ACPU cluster 1;
- sensor 2: remote sensor for ACPU cluster 2;
- sensor 3: remote sensor for GPU;
It can obtain this device temperature by operating this hardware. The new
sensor driver satisfies thermal framework and to realize the ACPU ,GPU and
so on to cool function.
Changes v0->v1;
* Delete this hi6220 dtsi.
* Fix documentation and error checks.
* Modify this driver which makes use of kernel to decide how to dynamically
bind the interrupt to hottest sensor.
* Delete "sensor-thres-temp" property and read thermal_zone trips points
replace of it.
* Delete "sensor-reset-temp" property and define the fixed value replace
of it.
Changes v1->v2;
* change patch's position between binding document and driver file
* clean up some regiser for enabling thermal sensor
* use mutex lock to replace the spin lock
Changes v2->v3;
* delete sensor id property in binding document
* fix sensor driver to satisfy sensor register after deleting sensor id
property
kongxinwei (2):
dt-bindings: Document the hi6220 thermal sensor bindings
thermal: hisilicon: add new hisilicon thermal sensor driver
.../bindings/thermal/hisilicon-thermal.txt | 23 ++
drivers/thermal/Kconfig | 8 +
drivers/thermal/Makefile | 1 +
drivers/thermal/hisi_thermal.c | 438 +++++++++++++++++++++
4 files changed, 470 insertions(+)
create mode 100644 Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt
create mode 100644 drivers/thermal/hisi_thermal.c
--
1.9.1
next reply other threads:[~2015-04-07 10:40 UTC|newest]
Thread overview: 16+ messages / expand[flat|nested] mbox.gz Atom feed top
2015-04-07 10:40 Xinwei Kong [this message]
2015-04-07 10:40 ` [PATCH v3 0/2] 96boards: add thermal senor support to hikey board Xinwei Kong
2015-04-07 10:40 ` Xinwei Kong
2015-04-07 10:40 ` [PATCH v3 1/2] dt-bindings: Document the hi6220 thermal sensor bindings Xinwei Kong
2015-04-07 10:40 ` Xinwei Kong
2015-04-07 10:40 ` Xinwei Kong
2015-04-07 10:40 ` [PATCH v3 2/2] thermal: hisilicon: add new hisilicon thermal sensor driver Xinwei Kong
2015-04-07 10:40 ` Xinwei Kong
2015-04-07 10:40 ` Xinwei Kong
2015-04-21 9:09 ` 答复: " Wangfei (William, Euler)
2015-04-21 9:09 ` Wangfei (William, Euler)
2015-04-21 9:15 ` Wangfei (William, Euler)
2015-04-21 9:15 ` Wangfei (William, Euler)
2015-04-22 5:47 ` Xinwei Kong
2015-04-22 5:47 ` Xinwei Kong
2015-04-22 5:47 ` Xinwei Kong
Reply instructions:
You may reply publicly to this message via plain-text email
using any one of the following methods:
* Save the following mbox file, import it into your mail client,
and reply-to-all from there: mbox
Avoid top-posting and favor interleaved quoting:
https://en.wikipedia.org/wiki/Posting_style#Interleaved_style
* Reply using the --to, --cc, and --in-reply-to
switches of git-send-email(1):
git send-email \
--in-reply-to=1428403252-8208-1-git-send-email-kong.kongxinwei@hisilicon.com \
--to=kong.kongxinwei@hisilicon.com \
--cc=devicetree@vger.kernel.org \
--cc=edubezval@gmail.com \
--cc=haojian.zhuang@linaro.org \
--cc=jorge.ramirez-ortiz@linaro.org \
--cc=liguozhu@hisilicon.com \
--cc=linux-arm-kernel@lists.infradead.org \
--cc=linux-kernel@vger.kernel.org \
--cc=linux-pm@vger.kernel.org \
--cc=linuxarm@huawei.com \
--cc=mporter@konsulko.com \
--cc=rui.zhuang@intel.com \
--cc=xuwei5@hisilicon.com \
/path/to/YOUR_REPLY
https://kernel.org/pub/software/scm/git/docs/git-send-email.html
* If your mail client supports setting the In-Reply-To header
via mailto: links, try the mailto: link
Be sure your reply has a Subject: header at the top and a blank line
before the message body.
This is an external index of several public inboxes,
see mirroring instructions on how to clone and mirror
all data and code used by this external index.