Re: [PATCH v3 0/2] thermal: mediatek: Add cpu power cooling model

From: Viresh Kumar <viresh.kumar@linaro.org>
To: Punit Agrawal <punit.agrawal@arm.com>
Cc: Dawei Chien <dawei.chien@mediatek.com>,
	"Rafael J. Wysocki" <rjw@rjwysocki.net>,
	Rob Herring <robh+dt@kernel.org>, Pawel Moll <pawel.moll@arm.com>,
	Mark Rutland <mark.rutland@arm.com>,
	Ian Campbell <ijc+devicetree@hellion.org.uk>,
	Kumar Gala <galak@codeaurora.org>,
	Matthias Brugger <matthias.bgg@gmail.com>,
	Daniel Kurtz <djkurtz@chromium.org>,
	Sascha Hauer <s.hauer@pengutronix.de>,
	Daniel Lezcano <daniel.lezcano@linaro.org>,
	devicetree@vger.kernel.org, linux-arm-kernel@lists.infradead.org,
	linux-kernel@vger.kernel.org, linux-pm@vger.kernel.org,
	linux-mediatek@lists.infradead.org, srv_heupstream@mediatek.com,
	Sascha Hauer <kernel@pengutronix.de>
Subject: Re: [PATCH v3 0/2] thermal: mediatek: Add cpu power cooling model
Date: Mon, 2 Nov 2015 21:40:07 +0530	[thread overview]
Message-ID: <20151102161007.GI3639@ubuntu> (raw)
In-Reply-To: <9hh4mh4bdoi.fsf@e105922-lin.cambridge.arm.com>

On 02-11-15, 15:53, Punit Agrawal wrote:
> For dynamic power, I had posted some patches[0][1][2] introducing the
> binding as well as updating cooling device registration via cpufreq
> driver. Now that the SCPI hwmon driver is merged, I should re-send the
> remaining patches.
> 
> [0] http://lkml.iu.edu/hypermail/linux/kernel/1508.0/01020.html
> [1] http://lkml.iu.edu/hypermail/linux/kernel/1508.0/01022.html
> [3] http://lkml.iu.edu/hypermail/linux/kernel/1508.0/01031.html

Sure. Just that whatever can be merged with opp-v2 should be merged.

-- 
viresh