From: Richard Acayan <mailingradian@gmail.com>
To: Andy Gross <agross@kernel.org>,
Bjorn Andersson <andersson@kernel.org>,
Konrad Dybcio <konrad.dybcio@linaro.org>,
Rob Herring <robh+dt@kernel.org>,
Krzysztof Kozlowski <krzysztof.kozlowski+dt@linaro.org>,
linux-arm-msm@vger.kernel.org, devicetree@vger.kernel.org
Cc: Odelu Kukatla <quic_okukatla@quicinc.com>,
Luca Weiss <luca@z3ntu.xyz>,
Richard Acayan <mailingradian@gmail.com>
Subject: [PATCH v4 0/2] SDM670 Interconnects (now with dts patches only)
Date: Tue, 31 Jan 2023 20:00:18 -0500 [thread overview]
Message-ID: <20230201010020.84586-1-mailingradian@gmail.com> (raw)
Changes since v4 (20230111005155.50452-1-mailingradian@gmail.com):
- drop applied bindings and driver patches (previously 1-2/4)
Changes since v3:
- fix a merge conflict on linux-next (1/4)
Changes since v2:
- change qcom,sdm670.h to qcom,sdm670-rpmh.h (2/4)
- use SPDX v3 license identifiers (1/4, 2/4)
- accumulate ack tag (1/4)
- format changelog (0/4)
Changes since v1:
- change qcom,sdm670.h to qcom,sdm670-rpmh.h (1/4, 4/4)
This series adds interconnects nodes and consumers to the Snapdragon 670.
Richard Acayan (2):
arm64: dts: qcom: sdm670: add interconnects
arm64: dts: qcom: sdm670: add opps for peripherals
arch/arm64/boot/dts/qcom/sdm670.dtsi | 165 +++++++++++++++++++++++++++
1 file changed, 165 insertions(+)
--
2.39.1
next reply other threads:[~2023-02-01 1:00 UTC|newest]
Thread overview: 6+ messages / expand[flat|nested] mbox.gz Atom feed top
2023-02-01 1:00 Richard Acayan [this message]
2023-02-01 1:00 ` [PATCH v4 1/2] arm64: dts: qcom: sdm670: add interconnects Richard Acayan
2023-02-01 1:00 ` [PATCH v4 2/2] arm64: dts: qcom: sdm670: add opps for peripherals Richard Acayan
2023-02-01 18:51 ` Konrad Dybcio
2023-02-09 4:23 ` [PATCH v4 0/2] SDM670 Interconnects (now with dts patches only) Bjorn Andersson
2023-03-15 23:35 ` (subset) " Bjorn Andersson
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