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From: Rob Herring <robh@kernel.org>
To: Keerthy <j-keerthy@ti.com>
Cc: rui.zhang@intel.com, robh+dt@kernel.org,
	daniel.lezcano@linaro.org, j-keerthy@ti.com,
	amit.kucheria@verdurent.com, t-kristo@ti.com,
	devicetree@vger.kernel.org, linux-kernel@vger.kernel.org,
	linux-arm-kernel@lists.infradead.org, linux-pm@vger.kernel.org,
	mark.rutland@arm.com
Subject: Re: [PATCH v2 1/4] dt-bindings: thermal: k3: Add VTM bindings documentation
Date: Tue, 18 Feb 2020 14:20:48 -0600	[thread overview]
Message-ID: <20200218202048.GA32279@bogus> (raw)
In-Reply-To: <20200214063443.23589-2-j-keerthy@ti.com>

On Fri, 14 Feb 2020 12:04:40 +0530, Keerthy wrote:
> Add VTM bindings documentation. In the Voltage Thermal
> Management Module(VTM), K3 AM654 supplies a voltage
> reference and a temperature sensor feature that are gathered in the band
> gap voltage and temperature sensor (VBGAPTS) module. The band
> gap provides current and voltage reference for its internal
> circuits and other analog IP blocks. The analog-to-digital
> converter (ADC) produces an output value that is proportional
> to the silicon temperature.
> 
> Signed-off-by: Keerthy <j-keerthy@ti.com>
> ---
> 
> Changes in v2:
> 
>   * Fixed make dt_binding_check errors.
> 
>  .../bindings/thermal/ti,am654-thermal.yaml    | 57 +++++++++++++++++++
>  1 file changed, 57 insertions(+)
>  create mode 100644 Documentation/devicetree/bindings/thermal/ti,am654-thermal.yaml
> 

My bot found errors running 'make dt_binding_check' on your patch:

Documentation/devicetree/bindings/display/simple-framebuffer.example.dts:21.16-37.11: Warning (chosen_node_is_root): /example-0/chosen: chosen node must be at root node
Error: Documentation/devicetree/bindings/thermal/ti,am654-thermal.example.dts:21.41-42 syntax error
FATAL ERROR: Unable to parse input tree
scripts/Makefile.lib:300: recipe for target 'Documentation/devicetree/bindings/thermal/ti,am654-thermal.example.dt.yaml' failed
make[1]: *** [Documentation/devicetree/bindings/thermal/ti,am654-thermal.example.dt.yaml] Error 1
Makefile:1263: recipe for target 'dt_binding_check' failed
make: *** [dt_binding_check] Error 2

See https://patchwork.ozlabs.org/patch/1237882
Please check and re-submit.

WARNING: multiple messages have this Message-ID (diff)
From: Rob Herring <robh@kernel.org>
To: Keerthy <j-keerthy@ti.com>
Cc: mark.rutland@arm.com, devicetree@vger.kernel.org,
	amit.kucheria@verdurent.com, linux-pm@vger.kernel.org,
	j-keerthy@ti.com, daniel.lezcano@linaro.org,
	linux-kernel@vger.kernel.org, t-kristo@ti.com,
	robh+dt@kernel.org, rui.zhang@intel.com,
	linux-arm-kernel@lists.infradead.org
Subject: Re: [PATCH v2 1/4] dt-bindings: thermal: k3: Add VTM bindings documentation
Date: Tue, 18 Feb 2020 14:20:48 -0600	[thread overview]
Message-ID: <20200218202048.GA32279@bogus> (raw)
In-Reply-To: <20200214063443.23589-2-j-keerthy@ti.com>

On Fri, 14 Feb 2020 12:04:40 +0530, Keerthy wrote:
> Add VTM bindings documentation. In the Voltage Thermal
> Management Module(VTM), K3 AM654 supplies a voltage
> reference and a temperature sensor feature that are gathered in the band
> gap voltage and temperature sensor (VBGAPTS) module. The band
> gap provides current and voltage reference for its internal
> circuits and other analog IP blocks. The analog-to-digital
> converter (ADC) produces an output value that is proportional
> to the silicon temperature.
> 
> Signed-off-by: Keerthy <j-keerthy@ti.com>
> ---
> 
> Changes in v2:
> 
>   * Fixed make dt_binding_check errors.
> 
>  .../bindings/thermal/ti,am654-thermal.yaml    | 57 +++++++++++++++++++
>  1 file changed, 57 insertions(+)
>  create mode 100644 Documentation/devicetree/bindings/thermal/ti,am654-thermal.yaml
> 

My bot found errors running 'make dt_binding_check' on your patch:

Documentation/devicetree/bindings/display/simple-framebuffer.example.dts:21.16-37.11: Warning (chosen_node_is_root): /example-0/chosen: chosen node must be at root node
Error: Documentation/devicetree/bindings/thermal/ti,am654-thermal.example.dts:21.41-42 syntax error
FATAL ERROR: Unable to parse input tree
scripts/Makefile.lib:300: recipe for target 'Documentation/devicetree/bindings/thermal/ti,am654-thermal.example.dt.yaml' failed
make[1]: *** [Documentation/devicetree/bindings/thermal/ti,am654-thermal.example.dt.yaml] Error 1
Makefile:1263: recipe for target 'dt_binding_check' failed
make: *** [dt_binding_check] Error 2

See https://patchwork.ozlabs.org/patch/1237882
Please check and re-submit.

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linux-arm-kernel@lists.infradead.org
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  reply	other threads:[~2020-02-18 20:20 UTC|newest]

Thread overview: 18+ messages / expand[flat|nested]  mbox.gz  Atom feed  top
2020-02-14  6:34 [PATCH v2 0/4] thermal: k3: Add support for bandgap sensors Keerthy
2020-02-14  6:34 ` Keerthy
2020-02-14  6:34 ` [PATCH v2 1/4] dt-bindings: thermal: k3: Add VTM bindings documentation Keerthy
2020-02-14  6:34   ` Keerthy
2020-02-18 20:20   ` Rob Herring [this message]
2020-02-18 20:20     ` Rob Herring
2020-02-19  7:40     ` Keerthy
2020-02-19  7:40       ` Keerthy
2020-02-20 20:28       ` Rob Herring
2020-02-20 20:28         ` Rob Herring
2020-02-24  1:12         ` J, KEERTHY
2020-02-24  1:12           ` J, KEERTHY
2020-02-14  6:34 ` [PATCH v2 2/4] thermal: k3: Add support for bandgap sensors Keerthy
2020-02-14  6:34   ` Keerthy
2020-02-14  6:34 ` [PATCH v2 3/4] arm64: dts: ti: am654: Add thermal zones Keerthy
2020-02-14  6:34   ` Keerthy
2020-02-14  6:34 ` [PATCH v2 4/4] arm64: dts: ti: am6: Add VTM node Keerthy
2020-02-14  6:34   ` Keerthy

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