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From: Len Brown <lenb@kernel.org>
To: x86@kernel.org
Cc: linux-kernel@vger.kernel.org, Zhang Rui <rui.zhang@intel.com>,
	Len Brown <len.brown@intel.com>
Subject: [PATCH 09/14] thermal/x86_pkg_temp_thermal: Support multi-die/package
Date: Tue, 26 Feb 2019 01:20:07 -0500	[thread overview]
Message-ID: <863054888eb8f1a595369c49ec24740501e9c175.1551160674.git.len.brown@intel.com> (raw)
In-Reply-To: <e2810a5317d3a109a98204e883fd1461f77b9339.1551160674.git.len.brown@intel.com>

From: Zhang Rui <rui.zhang@intel.com>

On the new dual-die/package systems, the package temperature MSR becomes
die-scope. Thus instead of one thermal zone device per physical package,
now there should be one thermal_zone for each die on these systems.

This patch introduces x86_pkg_temp_thermal support for new
dual-die/package systems.

On the hardwares that do not have multi-die, topology_logical_die_id()
equals topology_physical_package_id(), thus there is no functional change.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
---
 drivers/thermal/intel/x86_pkg_temp_thermal.c | 9 +++++----
 1 file changed, 5 insertions(+), 4 deletions(-)

diff --git a/drivers/thermal/intel/x86_pkg_temp_thermal.c b/drivers/thermal/intel/x86_pkg_temp_thermal.c
index 1ef937d799e4..1b03ab3ee20c 100644
--- a/drivers/thermal/intel/x86_pkg_temp_thermal.c
+++ b/drivers/thermal/intel/x86_pkg_temp_thermal.c
@@ -122,7 +122,7 @@ static int pkg_temp_debugfs_init(void)
  */
 static struct pkg_device *pkg_temp_thermal_get_dev(unsigned int cpu)
 {
-	int pkgid = topology_logical_package_id(cpu);
+	int pkgid = topology_logical_die_id(cpu);
 
 	if (pkgid >= 0 && pkgid < max_packages)
 		return packages[pkgid];
@@ -353,7 +353,7 @@ static int pkg_thermal_notify(u64 msr_val)
 
 static int pkg_temp_thermal_device_add(unsigned int cpu)
 {
-	int pkgid = topology_logical_package_id(cpu);
+	int pkgid = topology_logical_die_id(cpu);
 	u32 tj_max, eax, ebx, ecx, edx;
 	struct pkg_device *pkgdev;
 	int thres_count, err;
@@ -449,7 +449,7 @@ static int pkg_thermal_cpu_offline(unsigned int cpu)
 	 * worker will see the package anymore.
 	 */
 	if (lastcpu) {
-		packages[topology_logical_package_id(cpu)] = NULL;
+		packages[topology_logical_die_id(cpu)] = NULL;
 		/* After this point nothing touches the MSR anymore. */
 		wrmsr(MSR_IA32_PACKAGE_THERM_INTERRUPT,
 		      pkgdev->msr_pkg_therm_low, pkgdev->msr_pkg_therm_high);
@@ -511,11 +511,12 @@ MODULE_DEVICE_TABLE(x86cpu, pkg_temp_thermal_ids);
 static int __init pkg_temp_thermal_init(void)
 {
 	int ret;
+	struct cpuinfo_x86 *c = &cpu_data(0);
 
 	if (!x86_match_cpu(pkg_temp_thermal_ids))
 		return -ENODEV;
 
-	max_packages = topology_max_packages();
+	max_packages = topology_max_packages() * c->x86_max_dies;
 	packages = kcalloc(max_packages, sizeof(struct pkg_device *),
 			   GFP_KERNEL);
 	if (!packages)
-- 
2.18.0-rc0


  parent reply	other threads:[~2019-02-26  6:21 UTC|newest]

Thread overview: 39+ messages / expand[flat|nested]  mbox.gz  Atom feed  top
2019-02-26  6:19 [PATCH 0/14] v2 multi-die/package topology support Len Brown
2019-02-26  6:19 ` [PATCH 01/14] x86 topology: Fix doc typo Len Brown
2019-02-26  6:20   ` [PATCH 02/14] topolgy: Simplify cputopology.txt formatting and wording Len Brown
2019-02-26  6:20   ` [PATCH 03/14] x86 smpboot: Rename match_die() to match_pkg() Len Brown
2019-02-26  6:20   ` [PATCH 04/14] x86 topology: Add CPUID.1F multi-die/package support Len Brown
2019-02-26 19:46     ` Dave Hansen
2019-02-28 15:43       ` Len Brown
2019-04-05 18:16         ` Thomas Gleixner
2019-02-26  6:20   ` [PATCH 05/14] cpu topology: Export die_id Len Brown
2019-03-07 14:45     ` Morten Rasmussen
2019-03-26 18:18       ` Len Brown
2019-02-26  6:20   ` [PATCH 06/14] x86 topology: Define topology_logical_die_id() Len Brown
2019-02-26  6:20   ` [PATCH 07/14] powercap/intel_rapl: Simplify rapl_find_package() Len Brown
2019-02-26 19:06     ` Peter Zijlstra
2019-03-26 18:27       ` Len Brown
2019-02-26  6:20   ` [PATCH 08/14] powercap/intel_rapl: Support multi-die/package Len Brown
2019-04-05 18:27     ` Thomas Gleixner
2019-04-08  1:35       ` Zhang Rui
2019-02-26  6:20   ` Len Brown [this message]
2019-04-05 18:29     ` [PATCH 09/14] thermal/x86_pkg_temp_thermal: " Thomas Gleixner
2019-04-05 18:39       ` Brown, Len
2019-04-05 18:50         ` Thomas Gleixner
2019-02-26  6:20   ` [PATCH 10/14] powercap/intel_rapl: update rapl domain name and debug messages Len Brown
2019-02-26  6:20   ` [PATCH 11/14] hwmon/coretemp: Support multi-die/package Len Brown
2019-02-26  6:20   ` [PATCH 12/14] topology: Create package_threads sysfs attribute Len Brown
2019-02-26  6:20   ` [PATCH 13/14] topology: Create core_threads " Len Brown
2019-02-26  6:20   ` [PATCH 14/14] topology: Create die_threads " Len Brown
2019-02-26 18:51 ` [PATCH 0/14] v2 multi-die/package topology support Peter Zijlstra
2019-04-12 19:32   ` Len Brown
2019-02-26 18:53 ` Peter Zijlstra
2019-03-07 14:59   ` Morten Rasmussen
2019-04-05 18:33     ` Thomas Gleixner
2019-04-12 19:52       ` Len Brown
2019-04-12 20:40         ` Brice Goglin
2019-02-26 19:05 ` Peter Zijlstra
2019-04-30  6:50   ` Len Brown
2019-04-30  9:33     ` Borislav Petkov
2019-04-30 18:46       ` Len Brown
2019-04-05 18:33 ` Thomas Gleixner

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