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From: Thomas Gleixner <tglx@linutronix.de>
To: Len Brown <lenb@kernel.org>
Cc: x86@kernel.org, linux-kernel@vger.kernel.org
Subject: Re: [PATCH 0/14] v2 multi-die/package topology support
Date: Fri, 5 Apr 2019 20:33:07 +0200 (CEST)	[thread overview]
Message-ID: <alpine.DEB.2.21.1904052031250.1802@nanos.tec.linutronix.de> (raw)
In-Reply-To: <20190226062012.23746-1-lenb@kernel.org>

On Tue, 26 Feb 2019, Len Brown wrote:

> This patch series does 4 things.
> 
> 1. Parses the new CPUID.1F leaf to discover multi-die/package topology
> 
> 2. Export multi-die topology inside the kernel
> 
> 3. Update 3 places (coretemp, pkgtemp, rapl) that that need to know
>    the difference between die and package-scope MSR.
> 
>    (Note: Kan Liang has a patch series on top of this one to similarly
>    make the uncore perf code multi-die/package aware.)
> 
> 4. Export multi-die topology to user-space via sysfs

Aside of the few nitpicks (which apply to several patches) this looks very
nice.

Thanks,

	tglx

      parent reply	other threads:[~2019-04-05 18:33 UTC|newest]

Thread overview: 39+ messages / expand[flat|nested]  mbox.gz  Atom feed  top
2019-02-26  6:19 [PATCH 0/14] v2 multi-die/package topology support Len Brown
2019-02-26  6:19 ` [PATCH 01/14] x86 topology: Fix doc typo Len Brown
2019-02-26  6:20   ` [PATCH 02/14] topolgy: Simplify cputopology.txt formatting and wording Len Brown
2019-02-26  6:20   ` [PATCH 03/14] x86 smpboot: Rename match_die() to match_pkg() Len Brown
2019-02-26  6:20   ` [PATCH 04/14] x86 topology: Add CPUID.1F multi-die/package support Len Brown
2019-02-26 19:46     ` Dave Hansen
2019-02-28 15:43       ` Len Brown
2019-04-05 18:16         ` Thomas Gleixner
2019-02-26  6:20   ` [PATCH 05/14] cpu topology: Export die_id Len Brown
2019-03-07 14:45     ` Morten Rasmussen
2019-03-26 18:18       ` Len Brown
2019-02-26  6:20   ` [PATCH 06/14] x86 topology: Define topology_logical_die_id() Len Brown
2019-02-26  6:20   ` [PATCH 07/14] powercap/intel_rapl: Simplify rapl_find_package() Len Brown
2019-02-26 19:06     ` Peter Zijlstra
2019-03-26 18:27       ` Len Brown
2019-02-26  6:20   ` [PATCH 08/14] powercap/intel_rapl: Support multi-die/package Len Brown
2019-04-05 18:27     ` Thomas Gleixner
2019-04-08  1:35       ` Zhang Rui
2019-02-26  6:20   ` [PATCH 09/14] thermal/x86_pkg_temp_thermal: " Len Brown
2019-04-05 18:29     ` Thomas Gleixner
2019-04-05 18:39       ` Brown, Len
2019-04-05 18:50         ` Thomas Gleixner
2019-02-26  6:20   ` [PATCH 10/14] powercap/intel_rapl: update rapl domain name and debug messages Len Brown
2019-02-26  6:20   ` [PATCH 11/14] hwmon/coretemp: Support multi-die/package Len Brown
2019-02-26  6:20   ` [PATCH 12/14] topology: Create package_threads sysfs attribute Len Brown
2019-02-26  6:20   ` [PATCH 13/14] topology: Create core_threads " Len Brown
2019-02-26  6:20   ` [PATCH 14/14] topology: Create die_threads " Len Brown
2019-02-26 18:51 ` [PATCH 0/14] v2 multi-die/package topology support Peter Zijlstra
2019-04-12 19:32   ` Len Brown
2019-02-26 18:53 ` Peter Zijlstra
2019-03-07 14:59   ` Morten Rasmussen
2019-04-05 18:33     ` Thomas Gleixner
2019-04-12 19:52       ` Len Brown
2019-04-12 20:40         ` Brice Goglin
2019-02-26 19:05 ` Peter Zijlstra
2019-04-30  6:50   ` Len Brown
2019-04-30  9:33     ` Borislav Petkov
2019-04-30 18:46       ` Len Brown
2019-04-05 18:33 ` Thomas Gleixner [this message]

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